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© 2018
FromTechnologies to Market
Status of the
CMOS Image Sensor
Industry
2018 report sample
Executive Summary
3
REPORT OBJECTIVES
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
Provide a clear understanding of applications and related technologies.
Company ecosystem identification and analysis:
• Major actors on a global basis
• Technical market segmentation
• Economic requirements by segment
• Key players by market and analysis
• Market size and market forecast in $M and M units
Use case analysis and market and technology trends involved:
• Determine applications range
• Detailed applications per market segment
• Technology identification for different products and processes
• Competing technologies
• Main technical challenges
Company
Ecosystem
Market
forecast
Technology
Use case
Market
Trend
4
METHODOLOGIES & DEFINITIONS
Market Segmentation
Volume (in Munits)
ASP (in $)
Revenues (in $M)
Yole’s market forecast model is based on matching several sources:
Information
Aggregation
Preexisting
information
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
5
TABLE OF CONTENTS (1/2)
o GLOSSARY 2
o TABLE OF CONTENTS 3
o REPORT OBJECTIVES 6
o METHODOLOGY 8
o COMPANIES CITED 13
o EXECUTIVE SUMMARY 14
1. INTRODUCTION 32
• Market segmentation
• Historical perspective
• CMOS image sensor landscape, by player
• CMOS image sensor landscape, by application
• CMOS image sensor technology shift - CMOS vs. CCD
• CMOS image sensor technology shift - BSI vs. FSI
• CMOS image sensor technology shift - 300mm vs. 200mm
2. MARKET FORECAST 46
• 2017 CIS revenue breakdown, by market
• CIS volume shipment forecast 2011 - 2023
• CIS revenue forecast 2011 - 2023
• CIS average selling price forecast 2011 - 2023
• CIS wafer production forecast 2011 - 2023
3. ECOSYSTEM 60
• 2017 M&A activity in CIS
• CMOS image sensor – M&A historical timeline
• CMOS image sensor - competitive landscape
• CMOS image sensor - ecosystem
• CIS players - geographic mapping
• CIS foundries - geographic mapping
4. PLAYERS & RANKINGS 72
• 2017 CIS revenue rankings, by player
• 2017 CIS production rankings, by foundry
• 2017 CIS player activity breakdown
• 2017 CIS mobile market revenue breakdown, by player
• 2017 CIS photography market revenue breakdown, by player
• 2017 CIS tablet market revenue breakdown, by player
• 2017 CIS laptop PC market revenue breakdown, by player
• 2017 CIS medical X-ray market revenue breakdown, by
player
• 2017 CIS security & surveillance market revenue breakdown,
by player
• 2017 CIS machine vision market revenue breakdown, by
player
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
6
TABLE OF CONTENTS (2/2)
5.1. MOBILE MARKETTRENDS 90
• Consumer electronics volume forecast
• Consumer electronics revenue forecast
• Who can afford a smartphone?
• Revenue comparison
• Mobile market volume forecast, by phone type
• Mobile market volume forecast, by player
• Market drivers
• Mobile resolution mix - forecast
• Dual camera rollout scenario
• 3D camera applications
• Mobile market trends
5.2 OTHER CONSUMER MARKET TRENDS 117
• Consumer photography volume forecast
• Action camera & drone volume forecast
• 360° camera trends
• AR/VR headset volume forecast
• AR/VR headset trends
• Wearable volume forecast
• Consumer drone volume forecast
• Consumer robotics volume forecast
• Computing volume forecast
5.3. AUTOMOTIVE MARKET TRENDS 132
• Light-vehicle volume forecast
• Automotive imaging trends
• Automotive camera volume forecast
• Robotic vehicle trends
5.4. HIGH END MARKET TRENDS 153
• Medical CIS volume forecast
• Medical CIS trends
• Security & surveillance volume forecast
• Machine vision volume forecast
6.TECHNOLOGY TRENDS 168
• Pixel/Resolution/Optical Format
• From FSI to BSI to stacked BSI
• Hybrid stack/Multi-stack
• 3D imaging & sensing
• Technology by players
7. CONCLUSION 207
8. COMPANY PROFILE 211
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
7
Almalence, Ambarella, Apple, Ams, Arm, Axis, Basler, Bosch, Brigates, BYD, Caeleste, Canon, Clairpixel, Cmosis, Cognex,
Continental, Core Photonics, CSEM, Dahua, DB Hitek, DXO Mark, Espros Photonics, Evg, Excelitas Technologies, Fairchild
Imaging, Flir, Forza Silicon, Fotonic, Foxconn, Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given Imaging, GoPro, Gpixel, Grass
Valley, Hamamatsu, Hasselblad, Himax Imaging, HikVision, Honeywell, Hoya, HTC, Huawei, Image Lab, IMEC, Infineon, Invisage,
Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LG, Luxima, Magna, Mantis Vision, Medigus, Melexis, Microsoft,
Mobileye, Movidius, New Imaging Technologies, Nikon, NXP, Nvidia, Olympus, Omnivision, Omron, ON Semiconductor,
Panasonic, PerkinElmer, Philips, Pixart, PixelPlus, Pelco, PMD Technologies, Pyxalis, Raytrix, Rosnes, Red, Samsung, Sanei
Hytech, Sharp, Silicon Optronics, Sirona, SK Hynix, SMIC, Siemens, Smartsens, Socionext, Soitec, Sony, STMicroelectronics,
SuperPix, Teledyne, Teradyne, Trixell, TSMC, TowerJazz, TPSCo, UMC, Valeo, Videantis, Viimagic, WLCSP, Xiaomi, X-Fab,
Xintec, Xperi, ZTE, and more …
COMPANIES CITED INTHIS REPORT
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
8
ABOUTTHIS REPORT’S AUTHORS
Biographies & contact information
Pierre Cambou
Pierre Cambou has been part of the imaging industry since 1999. He took several positions at Thomson TCS
which became Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 Pierre founded Vence
Innovation later renamed as Irlynx in order to bring to market a new infrared sensor technology. He has an
Engineering degree from Université de Technologie de Compiègne and a master’s of Science from Virginia Tech.
More recently, Pierre graduated with an MBA from Grenoble Ecole de Management. In 2014 he joined Yole
Développement as Imaging Activity Leader.
Contact: cambou@yole.fr
Jean-Luc Jaffard
Since 1966 Jean-Luc Jaffard has made invaluable contributions to imaging activity at STMicroelectronics, working at
the forefront of this business’s emergence and impressive growth. At STMicroelectronics’ Imaging Division, Jean-
Luc was appointed Research Development and Innovation Director, managing a large multidisciplinary/multicultural
team. Soon after, he was promoted to Deputy General Manager and Advanced Technology Director, in charge of
identifying and developing breakthrough imaging technologies and transforming them into innovative, profitable
products. In 2010 he was appointed STMicroelectronics’ Intellectual Property Business Unit Director, and in
January 2014 he created Red Belt Conseil’s Technology and Innovation branch.
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
9
WHATWE GOT RIGHT, WHATWE GOTWRONG
Technology and market forecast challenge
What we got right
o CIS’ steady growth
o Dual-camera introduction and impact
o 3D imaging & sensing introduction in mobile
o Automotive’s emergence as a key CIS market
o Security camera dynamics
What we got wrong
o Dual-camera sensors resolutions
o Impact of Mobileye and Tesla issue for
automotive CIS
o Lower-than-expected computing market
o Higher-than-expected security market
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
Body sample
11
WHAT DOESTHIS ANALYSIS ACCOUNT FOR?
From wafer to the first packaged sensor
Analysis at the
component
level
Courtesy of Omnivision
Courtesy of Valeo
Courtesy of Sony
Courtesy of Tesla
Camera
Modules
SystemsImage
sensors
Courtesy of Xiaomi
CIS
die
Courtesy of Sony
CIS
wafer
Courtesy of Apple
Market report focus Market analysis only
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
12
WHATWE GOT RIGHT,WHATWE GOTWRONG
CIS forecast over the years
Yole is again raising its
forecast for CMOS
image sensors
Mostly driven by dual-
camera approaches
and the introduction
of new sensors in
smartphones, our
2017 CIS forecast
exceeds previous
estimations
Our goal is a
+/-10% market
prediction in
five years’ time
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
13
OUR 7TH CMOS IMAGE SENSOR REPORT
• 2017 has been an excellent year for CIS as almost all segments but computing have been growing. Driven by
new applications the future of the industry remains on very strong footings.
• In 2017 the CMOS image sensor market reached $13.9B. Yole forecasts a 9.4% CAGR from 2017 to 2023,
mainly driven by smartphones integrating additional cameras that support functionalities like optical zoom,
biometry, and 3D interactions.
• Concerning the CIS ecosystem, it is now heavily dominated by three Asian heavyweights: Sony, Samsung, and
Omnivision. Europe made a noticeable come back with STMicroelectronics and ams both serving sensing for
mobile and the industry. The US has maintained a presence in the high-end sector, with On Semi for
automotive and industrial markets as well as Teledyne for industrial and medical.
• Market-wise, mobile rules revenue and technology development. New approaches such as hybrid stack and
triple stack are driving new features like super-slow motion and 3D sensing. Automotive and Security are
additional growth engine to CIS. Consumer IoT is finally making a significant entry with home devices carrying
micro cameras.
• CIS technology is becoming increasingly innovative, being at the forefront of 3D semiconductor technologies,
quantum energy detection, artificial intelligence, and more. It will be part of several megatrends, including
autonomous vehicles and the robotic revolution at large.
CIS is a key
market and
technology
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
14
Sony
Samsung
Omnivision
On Semi
STMicro
Panasonic
Canon
SK Hynix
Galaxycore
Hamamatsu
Smartsens
Pixelplus
Teledyne
ams
Gpixel
Sharp
Pixart
BYD Microel.
0
1
10
100
1 000
-100 100 300 500 700 900 1 100 1 300 1 500 1 700 1 900
AverageSellingPrice($)
Volume Shipment (M units)
2017 - CIS market landscape
by player
CMOS IMAGE SENSOR LANDSCAPE
2017 market landscape, by player
Sony maintains its
market leadership,
leveraging technology
rooted in digital
photography and
applied to mobile
Second tier players
become more
homogenous as On
Semi, Panasonic and
STMicro maintain
growth in respect to
Omnivision and
Samsung
Sony is now 2x
bigger than its
nearest
competitor
$5.9B
$2.7B
$0.4B
Key Players
High-End
Players
2nd Tier Players
Yole Développement © 2018
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
15
Mobile
67,8%
Consumer
8,1%
Computing
9,3%
Automotive
4,7%
Medical
0,5%
Security
5,6%
Industrial/Space/Defense
4,0%
2017 CIS Revenue breakdown
by market
2017 CIS REVENUE BREAKDOWN
2017
CIS revenue
breakdown
By market (in $M)
Mobile 8,068 9,437 17%
Consumer 1,120 1,127 1%
Computing 1,394 1,298 -7%
Automotive 536 658 23%
Medical 60 69 15%
Security 624 786 26%
Industrial/Space/Defense 462 555 20%
TOTAL 11,598 13,906 19.9%
2016 2017 YoY(%)
2016
$11,598M
2017
$13,906M
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
16
2017 CIS REVENUE RANKINGS
2017
CIS revenue
rankings
By player
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
17
Sony
38%
Samsung
20%
Tsmc
16%
Hlmc
5%
Smic
8%
Tpsco
4%
ST Micro
3%
SK Hynix
3%
DB Hitek
1%
Other
2%
2017 CIS production breakdown
by foundry
2017 CIS PRODUCTION RANKINGS
2017
CIS production
rankings
By foundry (in kWPY 12”eq.)
2016
2,367kW
2017
2,422kW
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
18
CIS WAFER PRODUCTION FORECAST 2011 - 2023
By technology (in kW 12” eq.)
CIS is
predominantly
produced using
3D stacked
technology
Since 2010, BSI
technology increased
its market share
Since 2014, the stacked
BSI approach has been
dominant
The hybrid stack
technique will be
predominantly used for
specific sensors such as
3D imagers
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
19
MOBILE MARKETTREND
3D brings the fourth camera embedded in smartphones!
Most of the
business is for
10x10x5mm3
camera
modules
Rear
smartphone
camera
modules
10x10mm²
1x1mm²
5x5mm²
Yole Développement © August 2018
$10
$5
$1
2000 2005 2010 2015 2020 2025
Smartphones:
the size of main camera
stops shrinking and a
front facing camera is
added
Module size
& cost
Camera phones:
Innovation from
Sharp in June 2000
3D sensing
module
2030
$20
20x10mm²
$20B
$10B
1 camera
2 cameras
3 cameras
The selfies trend:
the size of front facing
camera is increasing
Dual rear:
improved photography
thanks to dual
approach
4 cameras
$5B
Front
smartphone
camera
module
3D sensing module:
the front camera becomes
a user interface
Market size
$20B
Market
$10B
Market
$5B
Market
$1B
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
20
MOBILE MARKETTREND
More cameras - Most probably of different kinds
If the trend
maintains we
are heading
toward 10
cameras per
smartphone
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
21
MOBILE MARKETTREND
Number of cameras per smartphone (in units)
Originally, front
cameras differentiated
smartphones from
feature phones
The introduction of
dual-front and back
cameras is increasing
the number of cameras
per smartphone
3 cameras
per phone in
average by
2022
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
22
 Backside
illumination will
enable ~ 100% fill-
factor!
Front-side
illuminated (FSI)
MOBILETECHNOLOGYTREND
From FSI, to BSI, to Multi-stacked BSI - pixel level
BSI opened the
way to 3D
semiconductor
Stacked
BSI
Silicon bulk Silicon bulk
Backside
illuminated (BSI)
Silicon bulk
 Backside
illumination will
enable ~ 100% fill-
factor!
Multi-stacked
BSI
Silicon bulk
Bonding
Interface
Upper
Wafer
Lower
Wafer
Silicon bulk
Bonding
Interface
Middle
Wafer
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
23
STATUS OFTHE CIS INDUSTRY
2018 conclusions
• The CMOS image sensor industry will maintain its healthy growth pattern at a 9.4% CAGR from 2017 -
2023
• Sony is the undisputed leader due to its role in mobile, but competition is still open in many other
dynamic markets, i.e. security and automotive
• Photography applications are still powering the mobile growth engine, mostly thanks to dual-camera
approaches. The industry is on the verge of a massive transformation fuelled by augmented reality
applications involving 3D sensing.
• Technological innovation is ongoing. After a period of stacked BSI introduction (which is now the new
normal), fresh techniques like multi-stack and hybrid-stack enable new features like super-slow motion
and full PDAF.
• The key trend of using computing power to manipulate, enhance, and extract metrics from an image led
to Intel’s $15B mega-purchase of Mobileye. The stakes are indeed very high for downstream image
usage.
Healthy
growth still
ahead
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
24
IMAGE SENSOR APPLICATIONS - WHAT’S NEXT?
A roadmap for the next 10 years
The
technology
shift of 2020
will be AI-
related
Technology x Market
penetration
20242016 2018 2020 2022 2026
Computational
photography
Interaction
capability
ADAS Level 2
assistance
ADAS Level 3
autonomy
ADAS Level 4
& robotic vehicles
IP cameras
Analytics
Behavioral analysis
Augmented
reality
Ambient
intelligence
Augmentation
capability
Sensing & Computing era
Artificial Intelligence era
Cognitive era
Robotic
butler
Drones
2014 2028
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
25
IMAGE SENSOR APPLICATIONS - WHAT’S NEXT?
A roadmap for the next 20 years
From
“vision for
imaging”
to
“vision for
sensing”
1900 1980 2020 2030 2040 2045
Technology x Market Penetration
Acceleration: the speed of technology change doubles with every technological shift
Era of
Photography
5 years10 years20 years40 years80 years
Era of Machine
Sensing
Main
Players
could
change
Proximity
sensor
Autofocus
Single-
photon
imagers
Multi-
wavelength
imagers
Next Era
Sensor
fusion?
Human vision
enhancement?
3D time
of flight
By 2030, new technologies
serving machine-sensing
could become dominant
Event-based
imagers
Holographic
imagers?
Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
26
RELATED REPORTS
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Yole Dévelopment
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FromTechnologies to Market
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o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
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OUR 2018 REPORTS COLLECTION (1/4)
MEMS & SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware & Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS & Sensors for Automotive Market & Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market & Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process & Cost Report
− Gas & Particles 2018 – Market & Technology Report
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− LiDARs for Automotive and Industrial Applications 2018 – Market &
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market & Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process & Cost Report
RF DEVICES ANDTECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF & Photonic Components & Technologies for 5G Infrastructure 2018
o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
o PATENT ANALYSES – by KnowMade
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
& Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process & Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
& Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market & Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process & Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Consumer Biometrics: Sensors & Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 & 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed
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OUR 2018 REPORTS COLLECTION (2/4)
IMAGING & OPTOELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
o PATENT ANALYSES – by KnowMade
− iPhone X Dot Projector – Patent-to-Product Mapping
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Status of the CMOS Image Sensor Industry 2018 – Market & Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process & Cost Report
− CMOS Image Sensors Monitor 2018* – Quaterly Update**
− Camera Module 2017 – Market & Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process & Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market & Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects,
Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 & 2
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
o PATENT ANALYSES – by KnowMade
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
& Cost Report
− Fan-Out Packaging 2018 – Market & Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process & Cost Report
MANUFACTURING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology & Market Trends
for Lithography & Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology & Market Trends for
Lithography & Bonding/Debonding 2018 – Market & Technology Report
− Wafer Bonding Comparison 2018 – Structure, Process & Cost Report
Update : 2017 version still available / *To be confirmed
12©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (3/4)
MEMORY
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND & DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND & DRAM)
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− DRAM Technology & Cost Review 2018
− NAND Memory Technology & Cost Review 2018
o PATENT ANALYSES – by KnowMade
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Power SiC 2018: Materials, Devices, and Applications – Market & Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process & Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market & Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process & Cost Report
− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market & Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in
Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market & Technology Report – Update
− Automotive Power Module Packaging Comparison 2018 – Structure,
Process & Cost Report
− Power ICs Market Monitor 2018 – Quaterly Update**
− Power ICs Market Comparison 2018* – Structure, Process & Cost Report
BATTERY AND ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –
Update
o PATENT ANALYSES – by KnowMade
− Status of the Battery Patents – Patent Watch 2018 & Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market & Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer
13©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (4/4)
SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market & Technology
Report
− VCSELs Comparison 2018 – Structure, Process & Cost Report
DISPLAYS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market & Technology Report – Update
o PATENT ANALYSES – by KnowMade
− MicroLED Display – Patent Landscape Analysis
MEDTECH
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences & Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market & Technology Analysis 2017
o PATENT ANALYSES – by KnowMade
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Organs-On-Chips 2017 – Market & Technology Report
− Organ-on-a-Chip – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed
14©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN & REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).
15©2018 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronew se-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: CamilleVeyrier (veyrier@yole.fr), Marketing & Communication Project Manager
16©2018 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS, REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director forWestern US &
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US &
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan & Rest of Asia:
• Takashi Onozawa, General Manager,Asia Business
Development (Korea, Singapore, India & ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO & President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership withWoodside
Capital Partners)
• Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
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Status of the CMOS Image Sensor Industry 2018

  • 1. Sample © 2018 FromTechnologies to Market Status of the CMOS Image Sensor Industry 2018 report sample
  • 3. 3 REPORT OBJECTIVES Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018 Provide a clear understanding of applications and related technologies. Company ecosystem identification and analysis: • Major actors on a global basis • Technical market segmentation • Economic requirements by segment • Key players by market and analysis • Market size and market forecast in $M and M units Use case analysis and market and technology trends involved: • Determine applications range • Detailed applications per market segment • Technology identification for different products and processes • Competing technologies • Main technical challenges Company Ecosystem Market forecast Technology Use case Market Trend
  • 4. 4 METHODOLOGIES & DEFINITIONS Market Segmentation Volume (in Munits) ASP (in $) Revenues (in $M) Yole’s market forecast model is based on matching several sources: Information Aggregation Preexisting information Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 5. 5 TABLE OF CONTENTS (1/2) o GLOSSARY 2 o TABLE OF CONTENTS 3 o REPORT OBJECTIVES 6 o METHODOLOGY 8 o COMPANIES CITED 13 o EXECUTIVE SUMMARY 14 1. INTRODUCTION 32 • Market segmentation • Historical perspective • CMOS image sensor landscape, by player • CMOS image sensor landscape, by application • CMOS image sensor technology shift - CMOS vs. CCD • CMOS image sensor technology shift - BSI vs. FSI • CMOS image sensor technology shift - 300mm vs. 200mm 2. MARKET FORECAST 46 • 2017 CIS revenue breakdown, by market • CIS volume shipment forecast 2011 - 2023 • CIS revenue forecast 2011 - 2023 • CIS average selling price forecast 2011 - 2023 • CIS wafer production forecast 2011 - 2023 3. ECOSYSTEM 60 • 2017 M&A activity in CIS • CMOS image sensor – M&A historical timeline • CMOS image sensor - competitive landscape • CMOS image sensor - ecosystem • CIS players - geographic mapping • CIS foundries - geographic mapping 4. PLAYERS & RANKINGS 72 • 2017 CIS revenue rankings, by player • 2017 CIS production rankings, by foundry • 2017 CIS player activity breakdown • 2017 CIS mobile market revenue breakdown, by player • 2017 CIS photography market revenue breakdown, by player • 2017 CIS tablet market revenue breakdown, by player • 2017 CIS laptop PC market revenue breakdown, by player • 2017 CIS medical X-ray market revenue breakdown, by player • 2017 CIS security & surveillance market revenue breakdown, by player • 2017 CIS machine vision market revenue breakdown, by player Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 6. 6 TABLE OF CONTENTS (2/2) 5.1. MOBILE MARKETTRENDS 90 • Consumer electronics volume forecast • Consumer electronics revenue forecast • Who can afford a smartphone? • Revenue comparison • Mobile market volume forecast, by phone type • Mobile market volume forecast, by player • Market drivers • Mobile resolution mix - forecast • Dual camera rollout scenario • 3D camera applications • Mobile market trends 5.2 OTHER CONSUMER MARKET TRENDS 117 • Consumer photography volume forecast • Action camera & drone volume forecast • 360° camera trends • AR/VR headset volume forecast • AR/VR headset trends • Wearable volume forecast • Consumer drone volume forecast • Consumer robotics volume forecast • Computing volume forecast 5.3. AUTOMOTIVE MARKET TRENDS 132 • Light-vehicle volume forecast • Automotive imaging trends • Automotive camera volume forecast • Robotic vehicle trends 5.4. HIGH END MARKET TRENDS 153 • Medical CIS volume forecast • Medical CIS trends • Security & surveillance volume forecast • Machine vision volume forecast 6.TECHNOLOGY TRENDS 168 • Pixel/Resolution/Optical Format • From FSI to BSI to stacked BSI • Hybrid stack/Multi-stack • 3D imaging & sensing • Technology by players 7. CONCLUSION 207 8. COMPANY PROFILE 211 Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 7. 7 Almalence, Ambarella, Apple, Ams, Arm, Axis, Basler, Bosch, Brigates, BYD, Caeleste, Canon, Clairpixel, Cmosis, Cognex, Continental, Core Photonics, CSEM, Dahua, DB Hitek, DXO Mark, Espros Photonics, Evg, Excelitas Technologies, Fairchild Imaging, Flir, Forza Silicon, Fotonic, Foxconn, Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given Imaging, GoPro, Gpixel, Grass Valley, Hamamatsu, Hasselblad, Himax Imaging, HikVision, Honeywell, Hoya, HTC, Huawei, Image Lab, IMEC, Infineon, Invisage, Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LG, Luxima, Magna, Mantis Vision, Medigus, Melexis, Microsoft, Mobileye, Movidius, New Imaging Technologies, Nikon, NXP, Nvidia, Olympus, Omnivision, Omron, ON Semiconductor, Panasonic, PerkinElmer, Philips, Pixart, PixelPlus, Pelco, PMD Technologies, Pyxalis, Raytrix, Rosnes, Red, Samsung, Sanei Hytech, Sharp, Silicon Optronics, Sirona, SK Hynix, SMIC, Siemens, Smartsens, Socionext, Soitec, Sony, STMicroelectronics, SuperPix, Teledyne, Teradyne, Trixell, TSMC, TowerJazz, TPSCo, UMC, Valeo, Videantis, Viimagic, WLCSP, Xiaomi, X-Fab, Xintec, Xperi, ZTE, and more … COMPANIES CITED INTHIS REPORT Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 8. 8 ABOUTTHIS REPORT’S AUTHORS Biographies & contact information Pierre Cambou Pierre Cambou has been part of the imaging industry since 1999. He took several positions at Thomson TCS which became Atmel Grenoble in 2001 and e2v Semiconductors in 2006. In 2012 Pierre founded Vence Innovation later renamed as Irlynx in order to bring to market a new infrared sensor technology. He has an Engineering degree from Université de Technologie de Compiègne and a master’s of Science from Virginia Tech. More recently, Pierre graduated with an MBA from Grenoble Ecole de Management. In 2014 he joined Yole Développement as Imaging Activity Leader. Contact: cambou@yole.fr Jean-Luc Jaffard Since 1966 Jean-Luc Jaffard has made invaluable contributions to imaging activity at STMicroelectronics, working at the forefront of this business’s emergence and impressive growth. At STMicroelectronics’ Imaging Division, Jean- Luc was appointed Research Development and Innovation Director, managing a large multidisciplinary/multicultural team. Soon after, he was promoted to Deputy General Manager and Advanced Technology Director, in charge of identifying and developing breakthrough imaging technologies and transforming them into innovative, profitable products. In 2010 he was appointed STMicroelectronics’ Intellectual Property Business Unit Director, and in January 2014 he created Red Belt Conseil’s Technology and Innovation branch. Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 9. 9 WHATWE GOT RIGHT, WHATWE GOTWRONG Technology and market forecast challenge What we got right o CIS’ steady growth o Dual-camera introduction and impact o 3D imaging & sensing introduction in mobile o Automotive’s emergence as a key CIS market o Security camera dynamics What we got wrong o Dual-camera sensors resolutions o Impact of Mobileye and Tesla issue for automotive CIS o Lower-than-expected computing market o Higher-than-expected security market Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 11. 11 WHAT DOESTHIS ANALYSIS ACCOUNT FOR? From wafer to the first packaged sensor Analysis at the component level Courtesy of Omnivision Courtesy of Valeo Courtesy of Sony Courtesy of Tesla Camera Modules SystemsImage sensors Courtesy of Xiaomi CIS die Courtesy of Sony CIS wafer Courtesy of Apple Market report focus Market analysis only Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 12. 12 WHATWE GOT RIGHT,WHATWE GOTWRONG CIS forecast over the years Yole is again raising its forecast for CMOS image sensors Mostly driven by dual- camera approaches and the introduction of new sensors in smartphones, our 2017 CIS forecast exceeds previous estimations Our goal is a +/-10% market prediction in five years’ time Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 13. 13 OUR 7TH CMOS IMAGE SENSOR REPORT • 2017 has been an excellent year for CIS as almost all segments but computing have been growing. Driven by new applications the future of the industry remains on very strong footings. • In 2017 the CMOS image sensor market reached $13.9B. Yole forecasts a 9.4% CAGR from 2017 to 2023, mainly driven by smartphones integrating additional cameras that support functionalities like optical zoom, biometry, and 3D interactions. • Concerning the CIS ecosystem, it is now heavily dominated by three Asian heavyweights: Sony, Samsung, and Omnivision. Europe made a noticeable come back with STMicroelectronics and ams both serving sensing for mobile and the industry. The US has maintained a presence in the high-end sector, with On Semi for automotive and industrial markets as well as Teledyne for industrial and medical. • Market-wise, mobile rules revenue and technology development. New approaches such as hybrid stack and triple stack are driving new features like super-slow motion and 3D sensing. Automotive and Security are additional growth engine to CIS. Consumer IoT is finally making a significant entry with home devices carrying micro cameras. • CIS technology is becoming increasingly innovative, being at the forefront of 3D semiconductor technologies, quantum energy detection, artificial intelligence, and more. It will be part of several megatrends, including autonomous vehicles and the robotic revolution at large. CIS is a key market and technology Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 14. 14 Sony Samsung Omnivision On Semi STMicro Panasonic Canon SK Hynix Galaxycore Hamamatsu Smartsens Pixelplus Teledyne ams Gpixel Sharp Pixart BYD Microel. 0 1 10 100 1 000 -100 100 300 500 700 900 1 100 1 300 1 500 1 700 1 900 AverageSellingPrice($) Volume Shipment (M units) 2017 - CIS market landscape by player CMOS IMAGE SENSOR LANDSCAPE 2017 market landscape, by player Sony maintains its market leadership, leveraging technology rooted in digital photography and applied to mobile Second tier players become more homogenous as On Semi, Panasonic and STMicro maintain growth in respect to Omnivision and Samsung Sony is now 2x bigger than its nearest competitor $5.9B $2.7B $0.4B Key Players High-End Players 2nd Tier Players Yole Développement © 2018 Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 15. 15 Mobile 67,8% Consumer 8,1% Computing 9,3% Automotive 4,7% Medical 0,5% Security 5,6% Industrial/Space/Defense 4,0% 2017 CIS Revenue breakdown by market 2017 CIS REVENUE BREAKDOWN 2017 CIS revenue breakdown By market (in $M) Mobile 8,068 9,437 17% Consumer 1,120 1,127 1% Computing 1,394 1,298 -7% Automotive 536 658 23% Medical 60 69 15% Security 624 786 26% Industrial/Space/Defense 462 555 20% TOTAL 11,598 13,906 19.9% 2016 2017 YoY(%) 2016 $11,598M 2017 $13,906M Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 16. 16 2017 CIS REVENUE RANKINGS 2017 CIS revenue rankings By player Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 17. 17 Sony 38% Samsung 20% Tsmc 16% Hlmc 5% Smic 8% Tpsco 4% ST Micro 3% SK Hynix 3% DB Hitek 1% Other 2% 2017 CIS production breakdown by foundry 2017 CIS PRODUCTION RANKINGS 2017 CIS production rankings By foundry (in kWPY 12”eq.) 2016 2,367kW 2017 2,422kW Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 18. 18 CIS WAFER PRODUCTION FORECAST 2011 - 2023 By technology (in kW 12” eq.) CIS is predominantly produced using 3D stacked technology Since 2010, BSI technology increased its market share Since 2014, the stacked BSI approach has been dominant The hybrid stack technique will be predominantly used for specific sensors such as 3D imagers Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 19. 19 MOBILE MARKETTREND 3D brings the fourth camera embedded in smartphones! Most of the business is for 10x10x5mm3 camera modules Rear smartphone camera modules 10x10mm² 1x1mm² 5x5mm² Yole Développement © August 2018 $10 $5 $1 2000 2005 2010 2015 2020 2025 Smartphones: the size of main camera stops shrinking and a front facing camera is added Module size & cost Camera phones: Innovation from Sharp in June 2000 3D sensing module 2030 $20 20x10mm² $20B $10B 1 camera 2 cameras 3 cameras The selfies trend: the size of front facing camera is increasing Dual rear: improved photography thanks to dual approach 4 cameras $5B Front smartphone camera module 3D sensing module: the front camera becomes a user interface Market size $20B Market $10B Market $5B Market $1B Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 20. 20 MOBILE MARKETTREND More cameras - Most probably of different kinds If the trend maintains we are heading toward 10 cameras per smartphone Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 21. 21 MOBILE MARKETTREND Number of cameras per smartphone (in units) Originally, front cameras differentiated smartphones from feature phones The introduction of dual-front and back cameras is increasing the number of cameras per smartphone 3 cameras per phone in average by 2022 Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 22. 22  Backside illumination will enable ~ 100% fill- factor! Front-side illuminated (FSI) MOBILETECHNOLOGYTREND From FSI, to BSI, to Multi-stacked BSI - pixel level BSI opened the way to 3D semiconductor Stacked BSI Silicon bulk Silicon bulk Backside illuminated (BSI) Silicon bulk  Backside illumination will enable ~ 100% fill- factor! Multi-stacked BSI Silicon bulk Bonding Interface Upper Wafer Lower Wafer Silicon bulk Bonding Interface Middle Wafer Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 23. 23 STATUS OFTHE CIS INDUSTRY 2018 conclusions • The CMOS image sensor industry will maintain its healthy growth pattern at a 9.4% CAGR from 2017 - 2023 • Sony is the undisputed leader due to its role in mobile, but competition is still open in many other dynamic markets, i.e. security and automotive • Photography applications are still powering the mobile growth engine, mostly thanks to dual-camera approaches. The industry is on the verge of a massive transformation fuelled by augmented reality applications involving 3D sensing. • Technological innovation is ongoing. After a period of stacked BSI introduction (which is now the new normal), fresh techniques like multi-stack and hybrid-stack enable new features like super-slow motion and full PDAF. • The key trend of using computing power to manipulate, enhance, and extract metrics from an image led to Intel’s $15B mega-purchase of Mobileye. The stakes are indeed very high for downstream image usage. Healthy growth still ahead Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 24. 24 IMAGE SENSOR APPLICATIONS - WHAT’S NEXT? A roadmap for the next 10 years The technology shift of 2020 will be AI- related Technology x Market penetration 20242016 2018 2020 2022 2026 Computational photography Interaction capability ADAS Level 2 assistance ADAS Level 3 autonomy ADAS Level 4 & robotic vehicles IP cameras Analytics Behavioral analysis Augmented reality Ambient intelligence Augmentation capability Sensing & Computing era Artificial Intelligence era Cognitive era Robotic butler Drones 2014 2028 Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 25. 25 IMAGE SENSOR APPLICATIONS - WHAT’S NEXT? A roadmap for the next 20 years From “vision for imaging” to “vision for sensing” 1900 1980 2020 2030 2040 2045 Technology x Market Penetration Acceleration: the speed of technology change doubles with every technological shift Era of Photography 5 years10 years20 years40 years80 years Era of Machine Sensing Main Players could change Proximity sensor Autofocus Single- photon imagers Multi- wavelength imagers Next Era Sensor fusion? Human vision enhancement? 3D time of flight By 2030, new technologies serving machine-sensing could become dominant Event-based imagers Holographic imagers? Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 26. 26 RELATED REPORTS Status of the CEMOS Image Sensor Industry | Sample | www.yole.fr | ©2018
  • 28. © 2018 Yole Développement FromTechnologies to Market Source: Wikimedia Commons
  • 29. 2©2018 | www.yole.fr | About Yole Développement YOLE DEVELOPPEMENT – 4 DIVISIONS Life Sciences & Healthcare o Microfluidic o BioMEMS o Inkjet Printing o Solid-State Medical Imaging & BioPhotonics o Bio Technologies Power & Wireless o RF Devices & Technology o Compound Semiconductors & Emerging Materials o Power Electronics o Batteries & Energy Management Semiconductor & Software o Package & Assembly & Substrates o Semiconductor Manufacturing o Memory o Software & Computing Photonics, Sensing & Display o Solid-State Lighting & Display o MEMS, Sensors & Actuators o Imaging o Photonics & Optoelectronics Semiconductor & Software Power & Wireless Photonics, Sensing & Display Life Sciences & Healthcare
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  • 36. 9©2018 | www.yole.fr | About Yole Développement o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover: o You are looking for: • An analysis of your product market • A review of your competitors evolution • An understanding of your manufacturing and production costs • An understanding of your industry technology roadmap and related IPs • A clear view on the evolution of the supply chain… Our reports are for you! The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information, identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape. In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the industry. o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Bundled Offer and receive at least a 36% discount. REPORTS COLLECTION www.i-Micronews.com • MEMS & Sensors • RF devices & technologies • Imaging • Medical technologies (MedTech) • Photonics • Advanced packaging • Manufacturing • Advanced substrates • Power electronics • Batteries and energy management • Compound semiconductors • Solid state lighting • Displays • Software • Memory
  • 37. 10©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (1/4) MEMS & SENSORS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of the MEMS Industry 2018 – Update − Silicon Photonics 2018 – Update − Consumer Biometrics: Hardware & Software 2018 – Update − Inkjet Functional and Additive Manufacturing for Electronics 2018 − Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017 − Sensors and Sensing Modules for Smart Homes and Buildings 2017 − Acoustic MEMS and Audio Solutions 2017 − MEMS & Sensors for Automotive Market & Technology Trends 2017 − High End Inertial Sensors 2017 − Magnetic Sensor 2017 o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT – by System Plus Consulting − Piezo MEMS 2018 * o PATENT ANALYSES – by KnowMade − MEMS Microphone – Patent Landscape Analysis − Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product Mapping 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − MEMS Pressure Sensor 2018 – Market & Technology Report − MEMS Pressure Sensor Comparison 2018 – Structure, Process & Cost Report − Gas & Particles 2018 – Market & Technology Report − Gas & Particles Comparison 2018 – Structure, Process & Cost Report − LiDARs for Automotive and Industrial Applications 2018 – Market & Technology Report − LiDAR for Automotive 2018 – Patent Landscape Analysis − MEMS Packaging 2017 – Market & Technology Report − MEMS Packaging Comparison 2017 – Structure, Process & Cost Report RF DEVICES ANDTECHNOLOGIES o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Wireless technologies (Radar, V2X) for Automotive 2018 − RF Standards and Technologies for Connected Objects 2018 − RF & Photonic Components & Technologies for 5G Infrastructure 2018 o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System Plus Consulting − Automotive Radar Comparison 2018 o PATENT ANALYSES – by KnowMade − RF Acoustic Wave Filters 2017 – Patent Landscape Analysis o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market & Technology Report – Update − RF Front-End Module Comparison 2018 – Structure, Process & Cost Report − RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis − Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report – Update* − Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process & Cost Report − RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 Market & Technology Report – Update − RF GaN Comparison 2018* – Structure, Process & Cost Report − RF GaN 2018 – Patent Landscape Analysis SOFTWARE o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Consumer Biometrics: Sensors & Software 2018 – Update − Processing Hardware and Software for AI 2018 - Vol. 1 & 2 − From Image Processing to Deep Learning, Introduction to Hardware and Software Update : 2017 version still available / *To be confirmed
  • 38. 11©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (2/4) IMAGING & OPTOELECTRONICS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of the Compact Camera Module and Wafer Level Optics − Industry 2018 – Update − 3D Imaging and Sensing 2018 – Update − Sensors for Robotic Vehicles 2018 − Machine Vision for Industry and Automation 2018 − Imagers and Detectors for Security and Smart Buildings 2018 − Uncooled Infrared Imagers 2017 o PATENT ANALYSES – by KnowMade − iPhone X Dot Projector – Patent-to-Product Mapping o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Status of the CMOS Image Sensor Industry 2018 – Market & Technology Report - Update − CMOS Image Sensor Comparison 2018 – Structure, Process & Cost Report − CMOS Image Sensors Monitor 2018* – Quaterly Update** − Camera Module 2017 – Market & Technology Report − Compact Camera Module Comparison 2018 – Structure, Process & Cost Report − LiDARs for Automotive and Industrial Applications 2018 – Market & Technology Report − LiDAR for Automotive 2018 – Patent Landscape Analysis ADVANCED PACKAGING o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of Advanced Packaging Industry 2018 – Update − Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like PCB Trends − 3D TSV and Monolithic Business Update 2018 – Update − Power Modules Packaging 2018 – Update − Discrete Power Packaging 2018 – Update* − Status of Panel Level Packaging 2018 − Trends in Automotive Packaging 2018 − Hardware and Software for AI 2018 - Vol. 1 & 2 − Thin-Film Integrated Passive Devices 2018 − Memory Packaging Market and Technology Report 2018 – Update* o PATENT ANALYSES – by KnowMade − Hybrid Bonding for 3D Stack – Patent Landscape Analysis o LINKED REPORTS– by Yole Développement and System Plus Consulting − Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report - Update* − Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process & Cost Report − Fan-Out Packaging 2018 – Market & Technology Report – Update* − Fan-Out Packaging Comparison 2018* – Structure, Process & Cost Report MANUFACTURING o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Wafer Starts for More Than Moore Applications 2018 − Equipment for More than Moore: Technology & Market Trends for Lithography & Bonding/Debonding 2018 − Polymeric Materials for wafer-level Advanced Packaging 2018 − Laser Technologies for Semiconductor Manufacturing 2017 − Glass Substrate Manufacturing in the Semiconductor Field 2017 − Equipment and Materials for Fan-Out Packaging 2017 − Equipment and Materials for 3D TSV Applications 2017 o LINKED REPORTS – by Yole Développement and System Plus Consulting − Equipment for More than Moore: Technology & Market Trends for Lithography & Bonding/Debonding 2018 – Market & Technology Report − Wafer Bonding Comparison 2018 – Structure, Process & Cost Report Update : 2017 version still available / *To be confirmed
  • 39. 12©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (3/4) MEMORY o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Emerging Non Volatile Memory 2018 – Update − Memory Packaging Market and Technology Report 2018 – Update* o QUARTERLY UPDATE – by Yole Développement** − Memory Market Monitor 2018 (NAND & DRAM) o MONTHLY UPDATE – by Yole Développement** − Memory Pricing Monitor 2018 (NAND & DRAM) o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting − DRAM Technology & Cost Review 2018 − NAND Memory Technology & Cost Review 2018 o PATENT ANALYSES – by KnowMade − 3D Non-Volatile Memories – Patent Landscape COMPOUND SEMICONDUCTORS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of Compound Semiconductor Industry 2018* − GaAs Materials, Devices and Applications 2018 − InP Materials, Devices and Applications 2018 − Bulk GaN Substrate Market 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Power SiC 2018: Materials, Devices, and Applications – Market & Technology Report – Update − SiC Transistor Comparison 2018 – Structure, Process & Cost Report − Power SiC 2018 – Patent Landscape Analysis − Power GaN 2018: Materials, Devices, and Applications – Market & Technology Report – Update − GaN-on-Silicon Transistor Comparison 2018 – Structure, Process & Cost Report − Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017 − RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 – Market & Technology Report – Update − RF GaN – Patent Landscape Analysis POWER ELECTRONICS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Status of Power Electronics Industry 2018 – Update − Discrete Power Packaging 2018 – Update* − Power Electronics for Electric Vehicles 2018 – Update − Integrated Passive Devices (IPD) 2018 − Wireless Charging Market Expectations and Technology Trends 2018 − Thermal Management Technology and Market Perspectives in Power − Electronics and LEDs 2017 − Gate Driver 2017 − Power MOSFET 2017 − IGBT 2017 − Market Opportunities for Thermal Management Components in Smartphones 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Power Modules Packaging 2018 – Market & Technology Report – Update − Automotive Power Module Packaging Comparison 2018 – Structure, Process & Cost Report − Power ICs Market Monitor 2018 – Quaterly Update** − Power ICs Market Comparison 2018* – Structure, Process & Cost Report BATTERY AND ENERGY MANAGEMENT o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 – Update o PATENT ANALYSES – by KnowMade − Status of the Battery Patents – Patent Watch 2018 & Patent Activity 2017 o LINKED REPORTS – by Yole Développement and KnowMade − Solid State Electrolyte Battery 2018 – Market & Technology Report − Solid-State Batteries 2018 – Patent Landscape Analysis Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer
  • 40. 13©2018 | www.yole.fr | About Yole Développement OUR 2018 REPORTS COLLECTION (4/4) SOLID STATE LIGHTING o MARKET AND TECHNOLOGY REPORT – by Yole Développement − IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update − Automotive Lighting 2018: Technology, Industry and Market Trends – Update − UV LEDs 2018: Technology, Industry and Market Trends – Update − LiFi: Technology, Industry and Market Trends − LED Lighting Module Technology, Industry and Market Trends 2017 − CSP LED Lighting Modules − Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays − Horticultural Lighting 2017 o LINKED REPORTS – by Yole Développement and System Plus Consulting − VCSELs 2018: Technology, Industry and Market Trends – Market & Technology Report − VCSELs Comparison 2018 – Structure, Process & Cost Report DISPLAYS o MARKET AND TECHNOLOGY REPORT – by Yole Développement − Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update − Displays and Optical Vision Systems for VR/AR/MR 2018 − MicroLED Displays 2018 – Market & Technology Report – Update o PATENT ANALYSES – by KnowMade − MicroLED Display – Patent Landscape Analysis MEDTECH o MARKET AND TECHNOLOGY REPORT – by Yole Développement − BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical − Applications 2018 – Update − Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update − Neurotechnologies and Brain Computer Interface 2018 − CRISPR-Cas9 Technology: From Lab to Industries 2018 − Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018 − Inkjet Functional and Additive Manufacturing for Electronics 2018 − Liquid Biopsy: from Isolation to Downstream Applications 2018 − Chinese Microfluidics Industry 2018 − Scientific Cameras for the Life Sciences & Analytical Instrumentation Laboratory Markets 2018* − Artificial Organ Technology and Market 2017 − Connected Medical Devices Market and Business Models 2017 − Status of the Microfluidics Industry 2017 − Organs-On-Chips 2017 − Solid-State Medical Imaging 2017 − Medical Robotics Market & Technology Analysis 2017 o PATENT ANALYSES – by KnowMade − Microfluidic IC Cooling – Patent Landscape − Circulating Tumor Cell Isolation – Patent Landscape − OCT Medical Imaging – Patent Landscape − Pumps for Microfluidic Devices – Patent Landscape 2017 − Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017 − FLUIDIGM – Patent Portfolio Analysis 2017 − Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017 o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade − Organs-On-Chips 2017 – Market & Technology Report − Organ-on-a-Chip – Patent Landscape Analysis Update : 2017 version still available / *To be confirmed
  • 41. 14©2018 | www.yole.fr | About Yole Développement OUR 2017 PUBLISHED REPORTS LIST (3/3) OUR PARTNERS’ REPORTS PATENT ANALYSES – by KnowMade − Wireless Charging Patent Landscape Analysis − RF Acoustic Wave Filters Patent Landscape Analysis − NMC Lithium-Ion Batteries Patent Landscape Analysis − Pumps for Microfluidic Devices Patent Landscape − III-N Patent Watch − FLUIDIGM Patent Portfolio Analysis − Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017 − Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping − Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets − Microfluidic Technologies for Diagnostic Applications Patent Landscape TEARDOWN & REVERSE COSTING – by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017 MORE INFORMATION o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com. o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports automatically (multi-user format). Contact your sales team according to your location (see the last slide).
  • 42. 15©2018 | www.yole.fr | About Yole Développement MICRONEWS MEDIA o About Micronews Media To meet the growing demand for market, technological and business information, Micronews Media integrates several tools able to reach each individual contact within its network.We will ensure you benefit from this. ONLINE ONSITE INPERSON @Micronews e-newsletter i-Micronews.com i-Micronewsjp.com FreeFullPDF.com Events Webcasts Unique, cost-effective ways to reach global audiences. Online display advertising campaigns are great strategies for improving your product/brand visibility.They are also an efficient way to adapt with the demands of the times and to evolve an effective marketing plan and strategy. Brand visibility, networking opportunities Today's technology makes it easy for us to communicate regularly, quickly, and inexpensively – but when understanding each other is critical, there is no substitute for meeting in-person. Events are the best way to exchange ideas with your customers, partners, prospects while increasing your brand/product visibility. Targeted audience involvement equals clear, concise perception of your company’s message. Webcasts are a smart, innovative way of communicating to a wider targeted audience.Webcasts create very useful, dynamic reference material for attendees and also for absentees, thanks to the recording technology. Benefit from the i-Micronews.com traffic generated by the 11,200+ monthly unique visitors, the 10,500+ weekly readers of @Micronew se-newsletter Several key events planned for 2018 on different topics to attract 120 attendees on average Gain new leads for your business from an average of 340 registrants per webcast Contact: CamilleVeyrier (veyrier@yole.fr), Marketing & Communication Project Manager
  • 43. 16©2018 | www.yole.fr | About Yole Développement CONTACT INFORMATION o CONSULTING AND SPECIFIC ANALYSIS, REPORT BUSINESS • North America: • Steve LaFerriere, Senior Sales Director forWestern US & Canada Email: laferriere@yole.fr – + 1 310 600-8267 • Troy Blanchette, Senior Sales Director for Eastern US & Canada Email: troy.blanchette@yole.fr – +1 704 859-0453 • Japan & Rest of Asia: • Takashi Onozawa, General Manager,Asia Business Development (Korea, Singapore, India & ROA) Email: onozawa@yole.fr - +81 34405-9204 • Miho Othake, Account Manager (Japan) Email: ohtake@yole.fr - +81 3 4405 9204 • Itsuyo Oshiba, Account Manager (Japan) Email: oshiba@yole.fr - +81-80-3577-3042 • Greater China: Mavis Wang, Director of Greater China Business Development Email: wang@yole.fr - +886 979 336 809 • Europe: Lizzie Levenez, EMEA Business Development Manager Email: levenez@yole.fr - +49 15 123 544 182 • RoW: Jean-Christophe Eloy, CEO & President,Yole Développement Email eloy@yole.fr - +33 4 72 83 01 80 o FINANCIAL SERVICES (in partnership withWoodside Capital Partners) • Jean-Christophe Eloy, CEO & President Email: eloy@yole.fr - +33 4 72 83 01 80 • Ivan Donaldson,VP of Financial Market Development Email: ivan.donaldson@yole.fr - +1 208 850 3914 o GENERAL • Public Relations: leroy@yole.fr - +33 4 72 83 01 89 • Email: info@yole.fr - +33 4 72 83 01 80 Follow us on