1. © 2013
Glass Substrates
for Semiconductor Manufacturing
The first REPORT analyzing in detail the glass wafer for wafer–level –
packaging and micro structuring technologies applications

2. © 2013• 2
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Content of the report (1/2)
• Table of contents……………………………...2
• Glossary…………………………………….…..3
• Report Scope………………………………......4
• Companies Cited in the Report…………..…5
• Executive Summary…………………….…….6
– Glass Wafer Market Forecast (in $M,
wspy)………………………………..……...........…7
– Breakdown by Functionality……………………9
– Breakdown by End-Application……………….12
– Breakdown by Wafer Size………………………14
– Glass Substrate Players’ Market Share and
Revenue …………………………………………..16
• Introduction, Definitions & Report
Scope………………………………………..….23
• 2012 - 2018 Glass Wafer Market Status &
Evaluation Breakdown by End-
Application…………………………………….34
– Glass Substrate Market Forecast (in wspy) .36
• 2012 Shipment Forecast…………………..39
• 2018 Shipment Forecast…………………..42
– Glass Substrate Market Forecast (in $M)…..49
• 2012 Revenue Forecast………………….51
• 2018 Revenue Forecast………………….54
• 2012-2018 Detailed Glass Market Forecast
by End-Application…………………………..57
– MEMS Application Opportunities ………59
– CIS Application
Opportunities………………………….……71
– RF/Analog IC
Opportunities…………………………….…77
– LED Application
Opportunities…………………………….…83
– Memory Opportunities……………………88
– Logic IC Opportunities……………………93
– Power Opportunities………………………98
– Optoelectronic Component
Opportunities………………………………106
– µbattery Opportunities……………………112
• 2012 - 2018 Glass Wafer Market Status &
Evaluation: Breakdown by
Functionnalities…………………………..…114
– Glass Substrate Market Forecasts (in wspy)
……………………………………………….115
• 2012 Shipment Forecast………………….116
• 2018 Shipment Forecast…………………..118
• Glass Substrate Market Forecasts (in
$M)……………………………………………..122
• 2012 Revenue Forecast…………………….123
• 2018 Revenue Forecast…………………….125

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Content of the report (2/2)
• Detailed Glass Market Forecast by
Function/Platform…………………………
…123
– Focus on Support
Substrate……………………………….….125
– Focus on WLCapping……………………141
– Focus on WLOptics………………………171
– Focus on 3D TGV/2.5D
Interposer……………………………….…194
– Focus on Carrier…………………………209
– Focus on Microstructuring ……………227
• Glass Substrate Wafer: Supply Chain
& Value
Chain…….........………………………232
– Main Players involved in Glass Substrate
Processing ………………………………233
– Glass Substrate Players’ Market Share and
Revenue ………………………………...236
– Main Players involved in Glass Substrate
Processing ……………………..………243
– Glass Substrate Players’ Market Share and
Revenue ………………………….…….245
• Structuration of Glass
Substrate……………………………...252
– Wafer-Level Packaging Applications: Supply
Chain for Logic IC………………….…….255
– Supply Chain for MEMS Devices………257
– Supply Chain for CMOS Image
Sensors……………………………..……..264
– Supply Chain for Microfluidic
Devices………………………………….…273
• Glass Substrate Micromachining
Technologies…………..……………..280
• Conclusions &
Perspectives………………………….295

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Key Objectives of the Report
• We have prepared a report on the glass substrate topic related to Wafer-
Level Packaging and microstructuring technologies applications in order to
understand the applications, the technology trends and be able to provide
market forecast per functions and end applications in this area
• The objectives of the report are:
– Describe the applications of glass substrate
– Give the following detailed information
• a definition of the applicative segmentation for finished glass substrates
• an overview of the overall glass wafer market and market share of the main glass
materials suppliers
– Evaluation of market developments in terms of market size (volume, value),
substrate sizes/formats, by applications
– Technology process, specification and value chain
• The report does not cover
– ROE/DOE µoptics applications
– Photonics applications
– Flat panel display applications
– PV applications

5. © 2013• 5
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Scope of this report coverage
Platforms / Functionnalities of Glass substrates covered
Microstructuring technologies
Using Glass
µstructures
Wafer-Level Packaging
Using Glass
3D TGV/3D glass
capping
interposers
WLOptics
WLCapping
Glass
carriers
MEMS LED CIS c-PVMemory
Logic
ICs
RF
IPD/Analog
ICs
Opto
comp.
Fuel-cells/
µbatteriesµfluidic
Power
End Applications
Substrate
Support
Substrate

6. © 2013• 6
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Glass Substrate Value Chain
Structuration
of GLASS Substrates:
Functionnality
of GLASS Substrates:
End Applications
for GLASS Substrates:
• MEMS & Sensors
• CMOS image sensors
• LED Modules
• Memories
• Logic ICs
• Analog & RF ICs
• Microfluidic / Microreaction
• Micro-batteries / Fuel-cells
• Power components
• Concentrated - Solar PV
• Wafer Level Packaging
technologies using GLASS:
– Support substrate
– WLC
– WLO
– 3D TGV/3D glass capping
interposers
– Glass carriers
• Microstructuring technologies
using GLASS:
– µstructures
• Simple GLASS:
– Wafer 4” / 6” / 8” / 12”
– Sheet or Panel
• Finished / Structured Wafers with:
– Advanced thinning & polishing treatment
– Cavities
– Fluidic channel
– Fluidic hole
– Electric « Through the Glass » Vias
– Electric redistribution & Bumping
– Printed polymer structures
– Specific coating / functionalization
Example of glass value chain in a camera module

7. © 2013• 7
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Functionnalities of Glass substrate wafer versus End applications
X X X X
X X X
X
X X X X
X X X
X
MEMS LEDCIS memory
Logic
ICs
RF/Analog
ICs
Fuel-cells/
µbatteries
WLC
WLO
3D TGV/
interposer
Carriers
Micro
structures
Power
µfluidic
Opto
comp.
Support
Substrate

8. © 2013• 8
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Glass substrate market: 2012 shipments per Application
111Kwpy
8’’ eq
58Kwpy
8’’ eq
2,5Kwpy
8’’ eq
0Kwpy
8’’ eq
493Kwpy
8’’ eq
4,5Kwpy
8’’ eq
2,9Mwpy
8’’ eq
191Kwpy
8’’ eq
25Kwpy
8’’ eq
0Kwpy
8’’ eq
0Kwpy
8’’ eq
63Kwpy
8’’ eq
22Kwpy
8’’ eq
15Kwpy
8’’ eq
53Kwpy
8’’ eq
210Kwpy
8’’ eq
MEMS
LEDCIS memory
Logic
ICs
RF/Analog
ICs
Fuel-cells/
µbatteries
WLC
WLO
3D TGV/
interposer
Carriers
Micro
structures
Power
µfluidic
Opto
comp.
Support
Substrate

9. © 2013• 9
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Glass substrate overall market size in wspy
Breakdown per Functionnalities
0
2
4
6
8
10
12
14
16
2012 2013 2014 2015 2016 2017 2018
Shipments(in8incheqwspy)
Glass substrate overall market size (in 8 inch Million wspy)
Breakdown per End Application
Opto components
µfluidic
RF devices
Logic
Memory
Power
LED
CIS
MEMS
Yole Developpement © April 2013

10. © 2013• 10
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2012 Overall market share for glass substrate
• Total market related to the Glass market is assessed at $158M in 2012.
• Schott (G), Tecnisco (JP), PlanOptik (G), Bullen (US) and Corning (US) will share
almost 70% of the $158M glass substrate market this year, driven mainly by demand
for WLCapping.
Schott AG
Tecnisco
Bullen
PlanOptik
Corning
AGC
HOYA
Others
Glass substrate production for WLP
2012 Market Share Breakdown by glass supplier (in M$)
Yole Developpement
© April 2013
$158M

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More slides extracts

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Who should be interested in this report?
• Equipment & Material suppliers
– Identify new business opportunities and prospects
– Understand the differentiated value of your products and technologies in this market
– Identify technology trends, challenges and precise requirements related to glass substrate
• Glass substrate manufacturers
– Evaluate market potential of your technologies and products
– Position your company in the value chain and market
– Monitor and benchmark your competitors
• R&D organizations & Investors
– Monitor the global activity and consolidation currently happing in the semiconductor
equipment & material business in order to identify new partners, targets and take the right
decision before committing to one particular supplier
• IDMs, CMOS foundries & OSAT players
– Understand technology trends related to glass substrate used in the Wafer-Level-Packaging
and Micro structuring technologies

13. © 2013• 13
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About the Authors of this report
Amandine Pizzagalli
– Amandine recently joined Yole Development Advanced Packaging and MEMS
manufacturing teams after graduating as an engineer in Electronics, with a
specialization in Semiconductors and Nano Electronics Technologies. She
worked in the past for Air Liquide with an emphasis on CVD and ALD processes
for semiconductor applications
Contact: pizzagalli@yole.fr

14. © 2013• 14
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Companies Cited in this Report
AGC, Amkor, Anteryon, ASE, Audi, Berliner Glass, Bosch, Bullen, Colorship,
Corning, Dolomite, Heptagon, Hoya, Hoya, Honeywell, Hynix, Qualcomm,
Ibiden, IMT AG, IPDiA, Infineon, Lemoptix, Microfluidic ChipShop, Micronit,
Micron, MikroGlass, Murata, Nemotek, Omnivision, Osram, OptoPac,
PlanOptik, Saint-Gobain,Sensonor/Infineon, Samsung, SK
Hynix,Statchippac, STMicro, Schott, Sony, SPIL,Tecnisco, Texas
Instruments, Toshiba, TSMC, Ulcoat, VisEra, and more…

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