2. MULAY’S CONSULTANCY SERVICES
•Technological
Consultancy
Services
•Business
Consultancy
Services
Registered business Address in USA
Mulay’s Consultancy Services
17602 17th Street
Suite 102-242
Tustin CA 92780-7915
www.ApekMulay.com
Voice +1-214-764-0868
contact@ApekMulay.com
Apek Mulay, CEO
and Founder
Registered business Address in INDIA
Mulay’s Consultancy Services
A-2, Bilwakunj CHSL, L.B.S. Road,
Mulund (West), Mumbai – 400 082
INDIA
3. MULAY’S CONSULTANCY SERVICES
About our multi-disciplinary services !!!
Combined 20 years of experience in various fields through
professional partnerships such as
1. Training in Semiconductor Processing, Circuit Design, etc.
2. Semiconductor Failure Analysis consultant
3. Contract Integrated Circuit Failure Analysis & Reliability
services provider
4. Macroeconomic Consulting for business planning
5. Macrofinancial Consulting
4. MULAY’S CONSULTANCY SERVICES
Our Achievements in Multiple disciplines !!!
Regular contributor to Blogs on EBN ( The Premier Online community of Global
Supply Chain professionals )
Contributor to reputed International trade publications like electronics.ca
publications, truthout.org, SEMI.org, etc.
Contributed articles in reputed technical magazines such as Electronic Devices
Failure Analysis (EDFA), Military & Aerospace Electronics (MA&E) magazine,
etc.
2300+ followers on LinkedIn with 100+ endorsement in different domains
Over 1.5 million hits on personal blog www.ApekMulay.com since May 2013.
Author of two books on semiconductor industry entitled Mass Capitalism : A
Blueprint for Economic Revival and Sustaining Moore’s Law: Uncertainty
Leading to a Certainty to IoT Revolution.
Contract Failure Analysis services provider to small fabless companies in INDIA
and USA with our ties to the FA service laboratories in California,US.
6. MULAY’S CONSULTANCY SERVICES
Consultancy in Semiconductor Failure Analysis,
Technology, Tool procurement and techniques
• Experienced Failure Analysis engineer working for Qualcomm Inc., Texas
Instruments Inc. ( Advanced CMOS Technology development team) , Nanolab
Technologies Inc. and Evans Analytical Group (EAG) Inc.
• Patent award from Texas Instruments Inc. for successfully defending my US patent
application 20130088585 ‘Surface Imaging with Materials Indentified with Colors’ on
advanced failure analysis technique.
• M.S. in Electrical Engineering with thesis work performed at X-Fab Texas Inc. titled
‘Improving Reliability of Tungsten Plug Via for 0.25u BiCMOS and CMOS technology’.
• Hands-on lab experience with state-of-the-art failure analysis tools and different
techniques for performing all steps involved in failure analysis of Analog, Digital and
Mixed signal ICs.
• Provide second opinion consultancy on procurement of failure analysis tools for
laboratories.
• Training to staffed laboratories in developing new FA capabilities for reverse
engineering.
7. MULAY’S CONSULTANCY SERVICES
Failure Analysis Service provider
Advantages of using contract Failure Analysis services for a small and
growing semiconductor company
• Owning a FA Lab is highly capital intensive business
• Lab needs to be upgraded and maintained for state-of-the-art tools
• Labs need a highly qualified , skilled and well paid engineering staff for
providing root cause failure analysis from simple to complex jobs.
• Better to Invest more resources on product development rather than lab
maintenance
• Accelerated depreciation of state-of-the-art tools for performing failure analysis
• Lab makes use of hazardous chemicals and has to comply with several
environmental and government regulations for hazardous chemical handling
• It is time consuming and very skilled engineering job
• Fraction of operating costs, protected IP, product development, teardowns.
• Expert Failure Analysis consultancy services with every job from Apek Mulay
8. MULAY’S CONSULTANCY SERVICES
As a Failure Analysis service provider, we collaborate with several local
failure analysis laboratories in California and we can get the best deal
for our customers to provide them quality failure analysis services. No
separate fee for services are charged to the customer above what our
laboratories would provided. We will work with our contract labs, check
their availability and work load to offer the fastest and quality FA results
at lowest possible investments for our customers. This model helps us
to beat the amounts of our competitors.
Failure Analysis Service provider
Please ship the samples in attention of Mulay’s Consultancy Services with
reference sample, wire bond type, data sheet, failing pin information after we sign
NDA and business contract.
We can offer to do just about any Failure Analysis job at very competitive
investment and with a fast turnaround time.
9. MULAY’S CONSULTANCY SERVICES
Failure Analysis Services provider
• Decapsulation by chemical wet etch / Laser
• Counterfeit Detection
• Delayering / Parallel Lapping
• EMMI (Emission Microscopy)
• FIB (Focused Ion Beam) Precision Cutting
• InGaAs EMMI
• I-V (Curve Trace) measurement
• Mechanical Polishing
• OBIRCH (Optical Beam Induced Resistance Change)
• Optical Microscopy)
• Optical Profiler
• SAM (Scanning Acoustic Microscopy) or SAT (Scanning Acoustic Tomography)
• SEM (Scanning Electron Microscopy)
• SIMS (Secondary Ion Mass Spectrometry)
• TEM (Transmission Electron Microscope)
•X-Ray (Standard / 2-D) Examination
• X-Ray (3-D) Examination
10. MULAY’S CONSULTANCY SERVICES
Reliability Services provider
•Autoclave or Pressure Cooker Test
•Bias Life Test (BLT)
•Die Shear Test
•ESD - Charged Device Model (CDM)
•ESD - Human Body Model (HBM)
•ESD - Machine Model (MM)
•HAST (Highly Accelerated Temperature and
Humidity Stress Test)
•High-Temperature Storage Life Test (HTSL)
•HTOL (High Temperature Operating Life Test) /
Burn-in
•Humidity-Bias Test (THB)
•Latch-up Test
•Lead Integrity Test
•Mark Permanency Test
•Moisture/Reflow Sensitivity Classification (MSC)
•Physical Dimension Measurement
•Preconditioning Test (PC)
•Real Time Thermal Profiling
•Solderability
•Solder Ball Shear Test (BGA)
•Temperature Cycling (TC) Air to Air
•Temperature Humidity Bias Lifetest
85°C/85%
•Thermal Shock (Liquid to Liquid)
•Wire Bond Pull Test
•Wire Bond Shear Test
11. MULAY’S CONSULTANCY SERVICES
State-of-the-art Tools for Failure Analysis
• Focused Ion Beam (FIBs) systems – 13 systems (FEI 205,
FEI 800, FEI 9500, Vectra – G5, Quanta 3D, Nova 600, Helios
400 S)
• Scanning Electron Microscopes (SEMs) – 6 systems (Hitachi
S4800, S4700, S5000, S4500 and EDX)
• Transmission Electron Microscopes (TEMs) – 4 systems (FEI
Tecnai G2 F20, FEI Tecnai G2Lab6) with EDX detector, STEM
Analysis and Tridiem EELS detector
• Scanning Ion Mass Spectrometry (SIMS) – 2 systems
(Camaca IMS-6F , Atomica 4500 )
• Nano View P4050 optical profiler – 1 system
• Thermo K-alpha XPS/ESCA (Electron Spectroscopy for
Chemical Analysis) – 1 system
12. MULAY’S CONSULTANCY SERVICES
State-of-the-art Tools for Failure Analysis
• Allied Sample Polisher, Buehler Sample Polisher, South Bay
Technology Sample Polisher – 17 systems
• Ion Millers – 2 systems (Gatan 600, Gatan 691PIPS)
• Fschione 1020 Plasma Cleaner – 1 system
• FEINFOCUS Tiger X-Ray Inspection – 3 systems
• Hitachi MC1 Scanning Acoustic Tomograph (SAT) – 2
systems
• Optical Microscopes – 15 Systems (LEICA, NIKON,
OLYMPUS)
• Chemical Decapsulation – 5 systems (NSC PS101, Nisene)
• Laser Decapsulation – 2 systems (Control Semi, Fatcat)
• Reactive Ion Etchers (RIEs) – 3 systems (PR2001E /NARC)
13. MULAY’S CONSULTANCY SERVICES
State-of-the-art Tools for Failure Analysis
• New Wave-ezlate trilite laser cutter – 4 systems
• Emission Microscope Systems (EMMI) – Hamamatsu
Phemos- 1000 (CCD and InGaAs detector) – 3 systems
• Optical Beam Induced Resistance Change (OBIRCH) –
Hamamatsu uAMos-200 – 2 systems
• Conductive Atomic Force Microscopy (C-AFM) – Veeco
INNOVA – 1 system
• Microprobe stations (Signatone S-926, Cascade)- 3
systems
• Semiconductor Parameter Analyzer ( Agilent 4155B, Agilent
4156C )- 4 systems
• Gold Wire Bonder (KNS- Maxum Plus) – 2 systems
• Aluminum Wire Bonder (ASM AB530 , SPB–U600-WPCB) –
2 systems
14. MULAY’S CONSULTANCY SERVICES
State-of-the-art Tools for Nanoprobing up to 28
nm technology node
Machine specifications / Limitations:
Field Emission Scanning Electron Microscope
[Brand and model number]: JSM-6700F (JEOL)
Current and voltage measuring system
[Brand and model number]: Keithley Model 4200-SCS
Micro-probe Electrical Measuring System
[Brand and model number]: Zyvex/DCG Systems
(D-Prober)
Range of Movement Resolution
Coarse adjustment - X, Y, Z-axis:12mm 100 nm
Micro-adjustment -X, Z-axis: 100 µm; Y-axis:10 µm 5 nm
Operation Environment 10-4 Pa or less
Probe tip diameter < 50nm
Probe material Tungsten
Max. number of probers-4 channels
15. MULAY’S CONSULTANCY SERVICES
State-of-the-art Tools for Reliability Testing
• Keytek 256 pin ( or MK2 ) Electro-Static Discharge (ESD)
Testing – 9 systems
• Oryx Orion-9000 Non-socket Charged Device Module (CDM)
Testing – 1 system
16. MULAY’S CONSULTANCY SERVICES
Price List for FA Services
• Optical inspection & photos (Package) => $100/hr (No charge new customer)
•Standard (2-D) X-Ray => $120/hr (This is to look at inside construction of samples)
•C-SAM (C-Scanning Acoustic Microscope) Analysis => $200/hr (This is to look for
delamination inside the samples)
•Electrical analysis (Curve trace) => $160/hr (This is a comparative electrical analysis of failing
samples to a good sample)
•Chemical Decapsulation => $40 (non-BGA) or $50 (BGA) / device (This is a destructive
analysis)
•Optical inspection & photos (Die surfaces) => $100/hr. (This is to inspect die surfaces)
•OBRICH (Optical Beam Induced Resistance Change) inspection (as needed) => $350/hr (This
is to look for emission / hot spots on die surface. We will do this if IV Curve Trace shows
anomaly. Avg time 30-60 min/sample)
•Mechanical delayering (as needed) => $110 / metal layer and $75/ passivation layer (This is a
mechanical delayering (parallel lapping) of the die to look for defects on each layer. This is
done if there is a hot spot on the die)
•SEM (Scanning Electron Microscope) Analysis (as needed) => $225 / hr (This is a high power
close up inspection of the sample)
•Data review and Final report => $300-$500/set of a part number
•Additional analyses (AFM, X-section, 3D X-Ray…) are also available
17. MULAY’S CONSULTANCY SERVICES
Prior to job submission
• Min charge for each line item is 1 hr regardless of the sample size. Additional service is
charged on ½ hr increments.
•We can run multiple samples of the same part number through items 1, 2, 3, 4, and 6 in the
same run.
•Our std turnaround time is 5-7 days depending on complexity of analysis and our work load at
the time of parts arrival.
•You may issue an open PO for $1,500 and we will only charge you for the pre-approved
services. We will provide progress report after each set of analysis to obtain your approval for
the next set of analysis.
Items needed for FA:
•Failing samples to be analyzed
•Reference (good) sample (Prefer 2 samples)
•Wire bond type (Ag, Cu or Al), if known (email is okay)
•Data sheet of IC (email is okay)
•Failing pin numbers for each failing part (email is okay)
•Any other info that could help our analyst to identify the root cause of failure. (email is okay)
•Ship samples to ATTN of Mulay’s Consultancy Services after signing contract
19. MULAY’S CONSULTANCY SERVICES
Macroeconomic and Macro-financial Consulting
• Provide an in-depth analysis of impacts of
macroeconomics on Global semiconductor
industry
• Help provide solutions to companies for
rejuvenation of businesses in electronics and
semiconductor industry
• Provide advise to industry on proper
planning for robust macroeconomic growth
on microelectronics industry to realize
benefits of Moore’s law, 450 mm silicon
wafers, etc.
• Forecasting the near and long term future of
global semiconductor industry with
macroeconomic lens.
• Consultancy for achieving sustainable
manufacturing, high profitability, balanced
economy with high productivity.
Macroeconomic and Macro-financial Consulting