Compound semiconductors occupy important places in the scheme of the manufacturing of lasers, optical components, light-emitting diodes (LEDs), filters, mixers, power amplifiers, solar panels, and other devices. The advantages that compound semiconductors offer are higher operating speed, lower power consumption, lower noise, higher operating temperature, light emission/detection, and superior photovoltaic attributes compared to silicon

1. Global Markets and Technologies for
Compound Semiconductors
Compound semiconductors have captured the attention of researchers, semiconductor device makers,
and original equipment manufacturers (OEMs) for several years on account of their superior physical and
chemical attributes in relation to silicon, the mainstream semiconductor material. The greatest value that
they bring to the table is that of variety and customization. It is not surprising that compound
semiconductors are the prime ingredients of some of the most complex semiconductor components ever
synthesized.
Compound semiconductors occupy important places in the scheme of the manufacturing of lasers, optical
components, light-emitting diodes (LEDs), filters, mixers, power amplifiers, solar panels, and other
devices. The advantages that compound semiconductors offer are higher operating speed, lower power
consumption, lower noise, higher operating temperature, light emission/detection, and superior
photovoltaic attributes compared to silicon. Additionally, these attributes change from compound to
compound, offering considerable design flexibility.
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Published: September 2012
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On the flip side, the variety of compounds works unfavorably in terms of scale and consequent pricing.
Considering that these materials are pitted against silicon, the most widely available material with the
most refined and cost-efficient fabrication process, there is a real danger of the competition being
rendered lop-sided in favor of silicon.
However, it is not entirely accurate to compare and confine compound semiconductors to the benchmarks
set by silicon. Compound semiconductors have a distinct character of their own and they spawn several
use-cases of application that can be catered to only by them. This report is an attempt to capture the
value added by compound semiconductors to the larger semiconductor component industry. The value is
assessed at two levels in the component manufacturing process: the material stage and the component
stage. The report assesses the value of compound semiconductor material sold to component
manufacturers as well as the value of the components manufactured by these companies. The focus of
the report is on the component, which has a perfect balance in the unitary nature of its composition and
the diverse nature of its application.

2. STUDY GOALS AND OBJECTIVES
This study has the following goals and objectives:
 Measuring and forecasting the global market size for compound semiconductor–based
components in value (dollar sales) and volume (shipment sales) terms.
 Breaking down the global compound semiconductor component market along the following
individual components in value and volume terms: lasers and optical components; LEDs; radio
frequency (RF) front end and power amplifier chipsets; and solar/ photovoltaic (PV) panels and
cells.
 Breaking down the market for individual compound semiconductor components along the
following end applications in value and volume terms: telecommunications; instrumentation and
scientific research; medicine; energy, defense, and surveillance; computing and entertainment;
industrial and automotive; retail; and others.
 Breaking down the market for individual compound semiconductor components along the
following regions in value and volume terms: the Americas; Europe, Middle East, and Africa
(EMEA); and Asia Pacific (APAC).
 Breaking down the market for individual compound semiconductor components along the
following compound semiconductor families in value and volume terms: binary II-VI, binary III-V,
binary IV-IV, and others.
 Breaking down the market for individual compound semiconductor components along relevant
individual compound semiconductors in value terms.
 Breaking down the market for individual compound semiconductor components along the
following countries in value and volume terms: U.S., Brazil, Canada, Mexico, Germany, U.K.,
France, Italy, Spain, Russia, The Netherlands, Turkey, China, Japan, India, Indonesia, and South
Korea.
 Breaking down the market for compound semiconductor materials used in individual compound
semiconductor components along the following compound semiconductor families in value
terms: binary II-VI, binary III-V, binary IV-IV, and others.
 Analyzing the stakeholder landscape in the compound semiconductor component value chain.
 Analyzing the patenting activity involving compound semiconductor components.
REASONS FOR DOING THE STUDY
Compound semiconductors provide a welcome departure from the cut-throat cost-competitive scheme of
silicon fabrication. It will not be out of place to mention that the bulk of innovation on the process and
device front is driven by compound semiconductors and that they occupy a disproportionately large share
of this activity. It is undisputable that compound semiconductors win hands down in terms of physical and
chemical attributes over silicon. It is equally clear that silicon will continue to enjoy a substantial

3. competitive advantage in terms of operating scale and availability for the foreseeable future.
This report aims to provide a quantitative point of view with regard to the tightrope traversed by
compound semiconductors. The report tries to bring out the quantitative contribution of compound
semiconductors to the components driven by them, in terms of plain bill of materials (BoMs). At the same
time, the report examines the value added by compound semiconductors in qualitative terms.
Essentially, the report focuses on components, which can be easily quantified and whose physical
attributes can be compared, contrasted, tracked and analyzed.
Each component has its own dynamics, benefits and challenges with respect to levels of adoption of
compound semiconductors. On a larger note, each component has its own market momentum dictated
by the health of the end-application verticals as well as relevant macroeconomic factors. When these
aspects are mapped for individual countries, they produce a fascinating collage of local market conditions
that add to the larger picture. This report provides a granular view of individual country markets in volume
and value terms for 17 key nations spanning all global regions. There are several variables to be
considered: preferred compounds, cost benefits of competing compounds, entry-level barriers, level of
fragmentation, state of innovation, and attitude of governments in terms of support, as well as future
avenues for market expansion. This report attempts to look at all of these factors and quantify their
impact on the state of the demand for compound semiconductors and their components.
SCOPE OF THE REPORT
The report measures and forecasts the size of the market in current U.S. dollars as well as in millions of
shipment units for components that contain compound semiconductors as primary parts. This report also
measures and forecasts dollar sales of compound semiconductor materials from 2012 through 2017.
The report forecasts the market size for the following:
 Individual compound semiconductor components such as lasers and optical components; LEDs;
RF power amplifier and front-end chipsets; and solar/PV cells and panels. It should be noted that
in solar panel shipments one square meter of the panel is considered to be a unit. It also should
be noted that the component market sizes in this report do not reflect the total market for such
components, but only those portions that contain compound semiconductors as primary parts.
 The above forecasts are classified in terms of vertical end applications, geographical regions,
compound semiconductor families, and countries on volume and value bases; in terms of value
chain contributors on a value basis; and in terms of individual key compound semiconductors on
a value basis.
 Additionally, the report forecasts the sales of compound semiconductor family materials for each
of the individual compound semiconductor components.
The Executive Summary provides a snapshot of key findings of the report.

4. The chapter on theory of compound semiconductors highlights important technology concepts behind
compound semiconductors. It also introduces the reader to the various categories and types of
compound semiconductor materials and components, as well as manufacturing and fabrication
technologies.
The chapter on global markets for compound semiconductor components provides a thorough breakdown
of the market for compound semiconductor materials and components. The breakdown focuses on the
components that employ compound semiconductors as primary parts. This chapter also provides a
comprehensive, quantitative view of the compound semiconductor material and component market.
The chapter on regional analysis for the Americas presents an overview of the region and the overall
market metrics, followed by analyses of individual major countries such as the U.S., Brazil, Canada and
Mexico.
The chapter on regional analysis for EMEA presents an overview of the region and the overall market
metrics, followed by analyses of individual major countries such as Germany, France, U.K., Spain, Italy,
Russia, the Netherlands and Turkey.
The chapter on regional analysis for APAC presents an overview of the region and the overall market
metrics, followed by analyses of individual major countries such as China, Japan, India, South Korea and
Indonesia.
The chapter on stakeholders highlights stakeholder categories and analyzes the activities in this domain.
It also clarifies where and how stakeholders fit in the larger picture.
The U.S. Patent Analysis chapter highlights the patenting activity underway in the area of compound
semiconductor components. The chapter classifies the patents awarded according to categories such as
LEDs, lasers and optical components, solar panels, and RF power amplifier and front-end chipsets.
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