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How to find defects in SMT electronics manufacturing

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Bill Cardoso
Bill Cardoso

This presentation covers several examples of defects found in today's SMT electronics manufacturing lines. Learn how x-rays can be used to find these defects, and most importantly, diagnose your manufacturing line. All x-ray images taken with TruView X-Ray Inspection systems. - Where Are Defects Introduced in the SMT production line? - Solder Paste Application Defects - Component Placement Defects - Reflow Oven Defects - Statistical Process Control

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www.creativeelectron.com LED, BGA, and QFN Assembly and Inspection Defect Inspection Examples Copyright © 2014 Creative Electron NOT FOR DISTRIBUTION
www.creativeelectron.com Where Are Defects Introduced? Counterfeit* Components
www.creativeelectron.com Defects associated with paste application Excess solder Solder bridges Insufficient solder Solder Paste Application Defects
www.creativeelectron.com Component Placement Defects Defects associated with component placement Misalignment Polarity Missing component
www.creativeelectron.com Reflow Oven Defects Defects associated with the reflow profile Voiding Bridging Solder balls Excess solder Insufficient solder
www.creativeelectron.com Statistical Process Control Manufacturing process quality assurance. Solder joint measurement data,collected during x-ray test, can be statistically analyzed to identify manufacturing drifts,trends and other relevant process quality issues.
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www.creativeelectron.com BGA Head In Pillow Visual Inspection
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www.creativeelectron.com Thanks for your time!

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