1. Innovations Towards the "System on Chip"
Development
Mayank Shrivastava
IIT Bombay
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2. Introduction
 Electronic chips  Takes information from the outside world
(Input devices)  Information Processing (CORE)  Sends
the processed information to outside world (Output Devices)
 CORE Consist of Large scale information processing
modules
 I/O  Special input-output devices  Should have good
performance with long term reliability  Provides low cost
and high performance systems
 High performance and Reliable I/O or High Voltage devices
are required for System On Chip (SoC) development
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3. Various Innovations For SoC
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4. Results & Conclusion
 SoC  Can significantly
Pulsed Current [ESD Condition]
~6X Improvement
reduce the product cost 100
with improved 80 Conventional
performance. Invented
60
 Innovations done towards 40
Early Failure
SoC development would 20 Fab-1
greatly improve the Fab-2
product’s performance- 0
cost trade-off. 4 6 8 10 12 14 16 18
Pulsed Voltage [ESD Condition]
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