This document summarizes an approach called eScop for integrating manufacturing systems. It discusses challenges in physical layer integration using web services, knowledge representation, orchestration of changes, visualization of complex knowledge, and implementing manufacturing execution system (MES) functions as modular components. The eScop approach aims to make integration re-configurable, adaptive, modular, loosely-coupled, knowledge-driven, and dynamic by addressing these challenges through techniques like semantic web services, hypermedia-driven APIs, and knowledge modeling. Future challenges discussed include developing taxonomies for manufacturing data and functions as well as leveraging implicit knowledge, big data, and artificial intelligence.
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Integration for manufacturing The eScop Approach
1. Integration for manufacturing
The eScop Approach
•Date: October, 2015
•Linked to: eScop
Contact information
Tampere University of Technology,
FAST Laboratory,
P.O. Box 600,
FIN-33101 Tampere,
Finland
Email: fast@tut.fi
www.tut.fi/fast
Conference: ARTEMIS Technology
Conference, ATC 2015. Turin, Italy –
October 6-7 2015.
Title of the presentation:
Integration for manufacturing
The eScop Approach
Authors: Sergii Iarovyi
6. How to…
…reduce vendor dependency for MES
components?
…introduce open ecosystem for MES function
implementations?
…adjust MES for the mass customization?
…adapt MES for SMEs requirements?
9. Standardized
service contract
Service loose
coupling
Service
abstraction
Service reusability
Service autonomy
Service
statelessness
Service
discoverability
Service
composability
increased federation
increased intrinsic interoperability
increased vendor diversity options
increased business and technology alignment
increased ROI
increased organizational agility
reduced IT burden
StrategicgoalsBenefits
Principles
Background: Service orienation
10. Source: Benjamin Nowack, J. (2009). http://bnode.org/blog/2009/07/08/the-semantic-web-not-a-piece-of-cake.
Background: Knowledge Representation
13. Challenges on :
- Physical layer
- Representation layer
- Orchestration layer
- Visualization layer
- Function layer
14. Challenges on Physical layer:
- Smart devices on the shop-floor level for Web
Services
- Web services for all levels
- Web service implementation
- Plug and Produce
20. Challenges on Representation layer:
- Service inventory
Discovery
• Discover API
• Get initial links
• Traverse through hypermedia
• Analyze semantics
• Populate Ontology
• Provide access to operations by semantics
31. Future challenges:
- Widely accepted taxonomy for data in
manufacturing
- Taxonomy on functional level
- The better service definition
- Usage of implicit knowledge
- Knowledge-driven orchestration
- Safety and security
- Big data & Artificial cognition