Our speaker this week is David Peng. David has more than 25 years of experience in the electronics industry, 15 of which were at EMS companies. At Foxconn, he led 60 R&D teams, and served as a Sony strategy product PM for more than 2 years. David's also led the product management and marketing departments at LiteOn Corp and Jabil Circuit for many years. He has rich knowledge and experience in designing products, marketing promotion, and project management. David has now established SlingX Corp. with his partner, Wade Ho, to share their experiences and contacts to provide quality services and advice to startups and entrepreneurs. Most lectures tell startups and entrepreneurs they should follow the PLM design processes, but rarely tell them “how” to design a good product. In his talk, David wants to discuss 8 key processes in designing a product from the viewpoint of design and project management.

1. By : SlingX Corp. / David Peng
Date : March 17th, 2017
POC to Product
8 Aspect Thinking In Designing Product

2. Brief of David Peng
• David Peng
• Title : SlingX Corp. / CEO
• Education : Bachelor of Electrical Engineer Dept. of National Central Univ.
• Experience :
• 1 year at HiTech Energy Inc as director in charge of BMS project management
• 2 years at Jabil Corp. as director in charge of STB project management at Jabil Circuit Taiwan branch
STB Div.
• 6 Years at LiteOn Group as senior manager in charge of Wireless Dept. , DQA dept. & Product Marketing
at NABU & IABU
• 6 Years at Foxconn as senior manager in charge of R&D dept. & project management at CNSBG &
CMMSG
• Major at : RF Circuit & Embedded system Design
Product technology analysis, development and integration
Product Management
Product marketing plan and promotion

3. ASSUMPTIONS
1. Conceptual Idea has been approved and feasibility
study has been done
2. Out-side-In design processes

4. PLM PROCESS
Test ItUnique Idea Proof Concept Ship ItProduce It
CONCEPT & PROOF OF
CONCEPT
DESIGN, ENGINEERING, MANUFACTURING &
PRODUCTION
Design It
EVTPOCConcept DVT PVT MP
1. Tooling making
2. Reliability & Stress Test
3. Certification Test
4. Design MFG flow and test station
5. Draft test plan and Test MFG test code
6. Setup test station and smooth the test
procedure
1. UI / ME Design
2. Housing/PCBA interference check
3. Thermal simulation / solution
4. Mock-up Making
5. E/E design
6. Board Function Test
7. EMI/EMC/ESD pre-test
8. FW design
9. APP design
10. Server construction

5. 1,800 Tesla Model x
US$ 240 M

6. 8 Aspect Thinking In Designing Product
1. System Block Diagram
2. Usage Environment ( Environment / Reliability Test )
3. Certification
4. Manufacturing Test Requirement
5. Considerations in Mechanical Design
6. Layout Strategy
7. Status Transition Diagram
8. APP & Cloud

7. System Block Diagram
“A block diagram is a diagram of a system in which the principal parts or functions are represented by blocks
connected by lines that show the relationships of the blocks”
-------------- “ Wiki”
What do you read from it ?

8. System Block Diagram
1. Function :
1. Power, Memory, Display, Sensor, I/O……
2. Chip part number
2. Interface :
1. Signal between blocks : I2C, SPI, UART, HDMI, MII, LVDS, GPIO…..
2. I/O to User : USB, SD, Touch panel, Audio Jack, RJ-45, LED, Power Jack, AC
Plug……
 Also relate to ID & Mechanical design
3. Voltage : Color of each block indicates what voltage of chip uses
4. Power Budget :
1. List the input voltage and maximum current of each block
2. Accumulate power budget of each block to get system power consumption
5. Cost : For an experienced designer can estimate 70% ~ 80% BOM cost

9. System Block Diagram
Power Budget

10. System Block Diagram
Power Budget
15V AC/0.8A
Adapter
Bridge
Rectifier
Regulator
7812
110V AC
19V DC
5 V Line Driver
DC-DC
Converter
34063
2.5 V
3.3 V BCM6348, BCM5325E,
SDRAM, Flash, WLAN
BCM6348
2SB1188 (PNP)
controlled by 6348
DC-DC
Converter
34063
1.2 V
1.8 V BCM5325E
BCM6348
2SB1188 (PNP)
controlled by 6348
Regulator
7805 100 mA
707 mA
286 mA
670 mA
15.84V AC
900 mA
910 mA
193 mA
624 mA

11. Usage Environment ( Environment / Accelerated Life Test )
Product marketing has to list the possible user scenario, especially for some extreme conditions to
designer. And these scenarios should make designer to take some reliability tests into
consideration. Those tests can be categorized into two parts:
1. Environment Test
1. Temperature & Humidity Test ( Aging Test )
Purpose : to ensure that the DUT works as intended during and after long time exposure to high
temperature and humidity including condensation. The intention of the test is to reveal failure
modes that depend on ageing of materials and components.
Reference Standard :
Test method :
Temperature: Temp 1: 65 ± 3°C Temp 2: 40 ± 3°C
Humidity: Humidity 1: 70 ± 3% RH Humidity 2: 95 ± 3% RH
Hold time 1: 400 minutes
Hold time 2: 60 minutes
Transition times: 10 minutes
Duration: 126 cycles at 8 hours each. In total 42 days

12. Usage Environment ( Environment / Accelerated Life Test )
The temperature range of product category :
1. Commerce Grade : 0~70℃
2. Industry Grade : -40~+85℃
3. Car Grade : -40~+125℃
4. Military Grade : -55~+150℃

13. Usage Environment ( Environment / Accelerated Life Test )
2. Salt Spray Test :
Purpose : Salt spray testing is an accelerated corrosion test that produces a corrosive attack
to coated samples in order to evaluate (mostly comparatively) the suitability of the coating
for use as a protective finish
Standard : ISO 9227.
3. Waterpoof & dustproof :
Purpose : To classify and rate the degree of protection provided against intrusion (body
parts such as hands and fingers), dust, accidental contact, and water by mechanical casings
and electrical enclosures.
Standard : IEC 60529.
IP rating : IPXY X : Degree of solid object protection, ranks from 0 ~ 6
Y : Degree of water protection, ranks from 0 ~ 8

14. Usage Environment ( Environment / Accelerated Life Test )

15. Usage Environment ( Environment / Reliability Test )
5. Drop Test
Purpose: This test is carried out to confirm that the DUT can withstand the end user
dropping it accidentally during intended use or during transport, respectively.
Reference standard: IEC 60068-2-32 Test Ed
Test method : Drop DUT from 1.5 M height to ground for 6 faces and 8 corners
6. Vibration Test
Purpose: To determine whether the packaging and the product will resist the vibration
it may be exposed to during transport. Normally we use vibration test to check if
components solder well on PCB, especially for DIP components.
Reference Standard :

16. Usage Environment ( Environment / Reliability Test )
2. HALT/HASS Test
Highly Accelerated Life Testing (HALT) is a kind of stress test to find out the weak links of a
new product. These discovery tests rapidly find weaknesses using accelerated stress
conditions. The goal of HALT is to proactively find weaknesses and fix them thereby
increasing product reliability.
HALT test major focuses on those test items:
• vibration,
• high/ low temperature,
• rapid temperature cycling,
• combined stress,
• on/ off cycling,
• voltage limits and frequency limits.

17. Certification
Terminology :
1. FCC : Federal Communications Commission
Audit authority which is in charge of management of computers, peripheral and
communications products sold in the United States
Any digital technology of electronic devices or systems, devices or systems generate pulse
frequency of more than 10KHz of equipment shall get FCC certification before they can be
sold in the US market
2. UL :
UL is an accredited standards developer in the US and Canada. In extending its global public
safety mission, UL Standards partners with national standards bodies in countries around the
world to build a safer, more sustainable world.
3. CE : Derived from the European Community abbreviation
Audit authority which is in charge of the basic safety requirements set by the European
Union for the protection of people's safety and health and environmental protection benefits.

18. Certification
CE = EMC + Safety ( LVD)
( FCC ) ( UL )
EMC = EMI + EMS

19. Certification – EMI & EMC
1. EMI
Electromagnetic interference (EMI) is radio frequency energy that interferes with the operation of an
electronic device. This radio frequency energy can be produced by the device itself or by other devices
nearby.

20. Certification – EMI & EMC
1. EMC
Electromagnetic compatibility (EMC) is the ability of an electronic product to operate without
causing EMI that would interfere with other equipment and without being affected by EMI from
other equipment or the environment. The goal is to reduce EMI to meet the requirements requested by
governments of the whole world.
• CE EN55011/13/32/24
• ETSI EN 301489-1/-3/-7/-17/-24
• Australia AS/NZS CISPR11/13/22/32/24
• FCC Part15B/18
• ISED ICES-003
• BSMI CNS13438/CNS13439/CNS13803
• Japan VCCI-3
• Korea KN32/35
966 Chamber
10m Chamber

21. Certification – Safety
1. Safety Scope
1. Electrical shock damage
1. To prevent the current flows through the human body. As long as there are several milli-ampere that will
cause health effects on the human body, of course, more larger current will produce
2. To test device immunity capability to high voltage shock
2. Energy damage
High-current supply or high-capacitance lines between the adjacent two terminals, short circuit case, may produce
arc discharge or burning in the combustion of molten metal, even low voltage lines, may also cause energy hazard
3. Fire
In the event of overload, parts failure, insulation collapse, high impedance or loose connector, resulting in
abnormal temperature, there may be a fire hazard. Therefore; safety test requests once fire in the
equipment, it can not distribute to the adjacent areas of the fire or the danger outside the equipment area
4. Mechanical and thermal damage
5. Radiation damage
6. Chemical damage

22. Certification – Safety
2. Safety Test Standard
• UL 60950-1/EN 60950-1/IEC 60950-1, Information Technology Equipment
• UL 62368-1/EN 62368-1/IEC 62368-1, Audio/Video, Information and
communication technology equipment
• UL 60065 / EN 60065 / IEC 60065, Standard for Audio, Video and Similar Electronic
Apparatus - Safety Requirements
• UL 60335-1 / EN 60335-1 / IEC 60335-1, Safety of Household and Similar Appliances,
Part 1: General Requirements
• BSMI –CNS14336

23. Certification – RF Test
1. RF Test
RF Test is in response to meet domestic and international electronic the wireless
communications industry product certification services such as 80.11ac, 802.11ad, BLE and
LTE, etc). This tests majorly at “Frequency deviation”, “Power” and “Timing”, etc.
BLE Hopping Chart ( Mid Freq)

24. Certification – RF Test
2. RF Test Standard
FCC 15.247, 15.407, including DFS, FCC part 22/24/27…...
ISED Canada RSS-247,RSS-130, RSS-132
RSS-133,RSS-139,RSS-192,RSS-195…
ETSI EN 300 328, ETSI EN 301 893, including DFS, EN300 220,EN300 440…..
EN301 511, EN301 908-1….
Japan MIC Article 2, Para 1, Item 19
Korea RRA Notice 2012-12 Taiwan NCC LP0002
Australia / New Zealand AS/NZS 4268

25. 1
5
°
FCC CE IC ACA NCC India Japan
Limit 1.6w /kg-
1g
2.0w/kg-
10g
1.6w/kg-
1g
2.0w/kg-
10g
2.0w/kg-
10g
1.6w/kg-
1g
2.0w/kg-
10g
Mobil
Phone
Head/
Body
Head/
Body
Head/
Body
Head/
Body
Head Head/
Body
Head
NB Body Body Body Body n/a n/a n/a
Tablet Body Body Body Body n/a n/a n/a
AP Body Body Body Body n/a n/a n/a
Certification – SAR Test
1. SAR Test
SAR test is mainly to simulate the body to absorb the intensity of
electromagnetic waves to protect the human body from radio
frequency transmission beyond the value of wireless devices caused
by human damage

26. Manufacturing Test Requirement
1. Purpose :
1. Guarantee product quality
2. Less manufacturing cost
2. Items :
1. Manufacture Test Plan ( SOP )
2. Test points & Test Tooling Design
3. Manufacture Test Program

27. Manufacturing & Test Requirement
1. SOP :
SOP plans the following items :
1. Board level functions to be tested
2. Test stations and test flow
3. Test Criteria ( Pass Or Fail)

28. Manufacturing & Test Requirement
2. Test points & Test Tooling Design
3. Manufacture Test Program (Mfg program)
Extracted from shipping firmware to only test board hardware functions. After all hardware
functions tested then mfg program will be erased and replaced by shipping image code.

29. Considerations in Mechanical Design
1. 3D interference Checking
2. Thermal consideration
3. Mockup
4. Antenna placement criteria
5. Waterproof

30. Considerations in Mechanical Design
1. 3D interference Checking
To check any interference between housing, electrical components and mechanical components
Max. OD = 16.0 mm
Max. ID = 14.0 mm
Min. OD = 10.0 mm
Min. ID = 8.0 mm

31. Considerations in Mechanical Design
2. Thermal consideration
Thermal shall impact on system once system does not have good heat dissipation system.
1. System Power Efficiency
2. Noise
1. Temperature noise
According to Johnson-Nyquist noise formula, P/B = KBT, the noise temperature goes high, the more power
system needs
2. S/N ratio decrease
System
Temp. rises
System power
efficiency decrease
Current increase
to raise power
W=I2R
Generate more heat

32. Considerations in Mechanical Design
2. Thermal consideration
Solution :
1. Conduction
Convention is the transfer of heat between two bodies. The rate at which energy is conducted as
heat between two bodies is a function of the temperature difference (temperature gradient)
between the two bodies and the properties of the conductive medium through which the heat is
transferred.
Heatsink is the most popular way to adopt to solve thermal issue.
2. Radiation
Radiation is electromagnetic radiation generated by the thermal motion of charged particles in
matter. All matter with a temperature greater than absolute zero emits thermal radiation. In
general, the radiation includes visible light and infrared light.
The more surface for thermal dissipation, the more thermal radiation. ( Fins )
3. Convention
Convention is the transfer of heat from one place to another by the movement of fluids. The fluid
can be air, water or any liquid.

33. Considerations in Mechanical Design
3. Thermal consideration
4. Thermal simulation
Fins
Fin integrates the 3 solutions with
Conduction, radiation and convention
Fins increase the surface area to
have more heat can be dissipated by
radiation and convention with air.
In general, we like to do thermal simulation to have
more system thermal information then apply the
solution.
Air flow track
T ambient =40 ℃

34. Considerations in Mechanical Design
3. Mockup
1. Verify the interference of solid bodies
2. Verify the color plan , real visual effect and feeling
3. Verify if any issue occurs in real operations
4. Tips
If you want to have more than 2 mockup samples then please adopt soft-tooling to make
mockup samples to lower your cost.
4. Antenna placement criteria
5. Waterproof

35. Layout Strategy
1. Power & Ground
Power and Ground is the most important item that designer must take into consideration when you engage in PCB layout.
Good management of power & ground enables PCB with good performance, less noise and less EMI. Some principles
1. A complete ground preferred, no scattered ground
2. Analog, RF and Digital ground separated to avoid noise coupled
3. Every ground plane must have its own path to the common ground to reduce noise
4. The impedance of return path
All the return current will take the shortest return path to common ground based on the impedance of the return path. With DC, the return
current takes the way back with the lowest resistance (Figure a). With a higher frequency, the return current flows along the lowest
impedance (Figure b).
Figure a Figure b

36. Layout Strategy
1. Safety Requirement
To have good space between power, signal and ground to meet the safety requirement.
2. Placement
1. Place components based on function blocks. Create a diagram with the functional groups of the system – e.g.,
transmitter path, receiver path, analog signals, digital signals, etc.
2. To have layout path as short as possible unless any requirement s listed in the layout guide ( for example, the
address and data signals of DRAM or Flash)
3. List the critical signals that may have higher radiation.

37. Status Transition Diagram

38. • Talk to you about where things
should go, what colors to use.
• UI is responsible for the creative
and visual pieces .
• UX focuses on the interactive side.
• UX handles the architecture of the content and the site
map.
Usability
Functionality
Information
Architecture
Validation
Requirements
Design
APP & CLOUD
Validation
Requirements
Design
Usability
Functionality
Information
Architecture

39. Communication MQTT,
WebSockets, HTTP
Platform Android, iOS, Windows
Phone.
Platform Local server, AWS,
Google cloud. Azure
Key Features
 Communication server
 Web API
 Database
 Push Notification server
Key Features
 Home/daily-life devices
 Business and Public
infrastructure
 Health-care
Key Features
 Data Transmission and Management
 IoT device connect and control
 Integrations with other web services
Mobile
Internet of ThingsBackend Server
Mobile Application Development
APP & CLOUD

40. Mobile Application Development
Types of Mobile App Dev
Native Mobile Apps Web-based Mobile Apps Hybrid Mobile Apps
Native mobile apps are
developed in a programming
language native to the device
and operating system
 Native apps typically run and
“feel” better.
 Suited for any type of Apps.
 More expensive to develop
on multiple OS platforms.
Typically built with the
combination of languages,
including CSS 3, HTML and
JavaScript.
Hybrid apps don’t need
separate efforts for each
mobile platform.
 Developed once and can be
made available in all major
platforms.
 Saving a lot of development
time.
 Not Suited for complex Apps.
 The operation is not smooth.
 Performance and
development time are
between Native and Web-
based Apps.
 Not suited for complex Apps.
 High cost of maintenance
and updates.
APP & CLOUD

41. Mobile Application Development
• Apps Front-end development
• UI UX design
• Cross-device accommodations
• Apps Back-end development
• User authentication-authorization
• Data services
• Reusable business logic
• Apps Deployment
• App Store Google Play
• In-house (ipa / apk)
APP & CLOUD

42. Special Thanks To
Gary Hus : CEO, 京艷設計有限公司
Mobile: +886 988-079-803
E-mail: garyhsu240465@gmail.com
Simon Chen: Senior Manager, Bay Area Compliance Laboratories Corp.
Mobile : +886 935-166-791
E-mail : simon.chen@baclcorp.com
Angus Cheng: General Manager, Foxcat Inc.
Mobile : +886 983-267-700
E-mail : angus@foxcat.co

43. SlingX Corp. / David Peng
Tel : +886 2 2541-3113
Mobile : +886 939-266-600
E-mail : ap626421@gmail.com
THANK YOU