2013 IEEE CPMT IMPACT Final Program

1. IMPACT-IAAC 2013
Plenary Speech
Special Session
IAAC
Packaging Session
PCB Session
Poster Session
Day 1－October 22 (Tuesday)
13:30-17:30
IAAC 2013 Opening & Meeting
ROOM
R 503
Day 2－October 23 (Wednesday)
ROOM
R 504 a+b+c
10:00-10:20
Opening of IMPACT 2013
10:20-11:10
Ricky Shi-Wei Lee, President of the IEEE-CPMT Society
Topic: From MOOREfication to LEDification
11:10-12:00
Dyi Chung Hu, Senior Vice President of Unimicron
Topic: The Challenges of IC Substrate in 3D Era
12:00-13:30
Lunch & ALC Committee Meeting
13:30-15:30
Panel Discussion- Sustainable Manufacture
Topic: Designing Electronic Products for Sustainable Manufacture
Chair: Dr. Charles E. Bauer & Dr. Shen-Li Fu
15:30-15:45
Poster Session (PCB) / Coffee Break
ROOM
ROOM 504 a
ROOM 504 b+c
【2】IAAC- Global
Business Council
【1】Advanced
15:45-18:00
Packaging (SPIL)
ROOM 503
【3】Advanced
Packaging I
ROOM 501
ROOM 502
【4】Advanced and
【5】IP Session
Emerging Technology
TPCA Show & IMPACT-IAAC 2013 Joint Reception & Award Ceremony (3F)
18:00-20:00
Day 3－October 24 (Thursday)
ROOM
R 504 b+c
09:30-10:20
Yasumitsu Orii, Senior Manager of IBM Japan
Topic: Next Generation Computer System for the Era of Big Data
ROOM
10:30-12:30
ROOM 504 b+c
【6】ICEP Japan
Session
ROOM 504 a
【7】3D Integration I
12:30-13:30
ROOM 503
ROOM 501
ROOM 502
【8】Thermal
【9】Modeling, Simulation 【10】Green Materials
Management I
& Design I
& Process
Lunch
ROOM
R 504 b+c
13:30-14:20
Kyong Wook Paik, Professor of Materials Sci. & Eng., KAIST
Topic: Recent Advances in Anisotropic Conductive Technology: Materials & Processing
ROOM
ROOM 504 b+c
14:30-17:30 【11】3D IC Forum
15:45-16:00
ROOM 504 a
ROOM 503
ROOM 501
ROOM 502
【12】Advanced
【13】Interconnections & 【14】Modeling, Simulation
【15】Test & Quality
Nanotechnology
& Design II
Packaging II
Poster Session (Packaging) / Coffee Break
Day 4－October 25 (Friday)
ROOM
R 504 b+c
09:30-10:20
Islam Salama, Sr. Manager of Intel
Topic: Enabling Continuum Computing Thru Innovation in Packaging Substrate & Assembly
ROOM
10:30-12:15
12:30-18:30
ROOM 504 b+c
ROOM 504 a
ROOM 503
ROOM 501
ROOM 502
【18】LED & Thermal 【19】Modeling, Simulation 【20】HDI &
【16】iNEMI Reliability
【17】3D Integration II
Session
Management
& Design III
Embedded
Plant Visit & Culture Tour (Only for Overseas Attendees)

2. Floor Plan
@
Organizer’s Office
Registration
Speaker’s Preview Room
WIFI for 5F
Poster
4F
Poster
Poster
5F
Poster
Poster
Room 501 Room 502 Room 503 Room 504 A Room 504 B+C
EAssembly
Green Tech
2013
PCB
Thermal
TPCA SHOW 2013
．Outlook 2014 Asia Electronics Industry Trends Forum in Room 401 (Oct.24)
3F
Canton Chinese
Restaurant
@
Conference Room
Dining Room
(Conference Attendees Only)
Coffee Break
WiFi
Award
Ceremony
TPCA Show & IMPACT
Joint Reception

3. Index
Agenda of Conference. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inside Cover
Organizer, Co-Organizer and Sponsor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Greeting of Chair
Welcome Message from Wun-Yan Chen , Conference General Chair. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Welcome Message from Shen-Li Fu, Conference Co-Chair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
. .
Welcome Message from CT Liu, Conference Co-Chair. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Welcome Message from Rick Wu, Conference Co-Chair. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Committee Member. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
General Information
About Conference / Hotel Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
TPCA Show & Welcomee Reception / International Welcome Dinner . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Registration Desk / Organizer’s Office / Speaker Preview Room. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
City Tour / About Taiwan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Inquiries. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Conference
Plenary Speeches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
IAAC Opening & Meeting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Panel Discussion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Posters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Abstracts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
2013 IMPACT Outstanding Paper Award. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
92
Sponsor AD
Industrial session: SPIL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Gold: TSMC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Silver: ASE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Silver: ATOTECH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Note. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pre-Announcement- IMPACT 2014 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
96
Inside Back Cover

4. IEEE COMPONENTS, PACKAGING,
& MANUFACTURING TECHNOLOGY
SOCIETY (IEEE CPMT Taipei)
Industrial Session
Award Sponsor
SILICONWARE PRECISION
INDUSTRIES CO., LTD.(SPIL)
Career Technology (Mfg.) Co., Ltd.
Special Sponsor &
General Sponsor
Organizer
Dow Electronic Materials
INTERNATIONAL MICROELECTRONICS
AND PACKAING SOCIETY TAIWAN
(IMAPS Taiwan)
INDUSTRIAL TECHNOLOGY RESEARCH
INSTITUTE, TAIWAN (ITRI)
ITEQ CORPORATION
ADVANCED SEMICONDUCTOR
ENGINEERING INC. (ASE)
Atotech Taiwan Limited
Shenzhen Printed Circuit Association
TAIWAN PRINTED CIRCUIT
ASSOCIATION (TPCA)
Shanghai Unitech Electronics Co.,Ltd.
Co-Organizer
Brominated Science and Environmental
Forum (BSEF)
Taiflex Scientific co., Ltd.
Communication Research Center, NTU
2013
Dow Electronic Materials
TIMA
International
Conference on
Electronics
Packaging
International Conference on Electronics
Packaging (ICEP)
INTERNATIONAL ELECTRONICS
MANUFACTURING INITIATIVE (iNEMI)
I-SHOU UNIVERSITY (ISU)
Surface Mount Technology Association
(SMTA)
Eternal Chemical Co., Ltd.
3D IC Forum Sponsor
Taiwan Semiconductor Manufacturing
Company Limited (tsmc)
WPCA
Zhen Ding Tech.
CSUN MFG. LTD
TAIWAN THERMAL MANAGEMENT
ASSOCIATION (TTMA)
▲
1

5. Welcome Message from Wun-Yan Chen, Conference Chair
Wun-Yan Chen
Chairman, IMAPS-Taiwan
It gives me great pleasure to represent the Organizing Committee to welcome you participating
in the IMPACT-IAAC 2013 joint conference. Over the past years, IMPACT conference continually
pays attention to the latest trends of global micro-system, packaging and circuit technology, and
encouraging the development and research of new materials, processes and designs in realizing the
versatile system demands for advanced consumer, communication, mobile computing, medical and
automobile applications. Due to the efforts, IMPACT conference has been successfully established as
an international platform for information exchange and experience shared by experts from all over
the world.
Recently, we witnessed a significant increase of concern among the peoples of the world with the
rational utilization of renewable natural resources, and also there is a greater consciousness today
of the links with the research which leads to a better understanding and knowledge of environmental
issues. This year, catering to the eco-technology trends, the IMPACT-IAAC 2013 joint conference
highlights “Green & Cloud: Creating Value and Toward ECO Life”, and elaborately arranges the
panel sessions, invited talks, industrial sessions and outstanding paper presentations, with a view to
pushing the research and development of ICT products to gain further effective improvements in
system performance and integration, and innovating to alleviate environmental damages.
We hope this Conference to be successful and to become an important and valuable resource
under your contribution and participation. The challenges in front of us are significant, but I am
confident that we will succeed in your zealously dedication. I wish you have a very pleasant stay
here, and have a productive and successful meeting. Finally, I would like to thank to the working team
members and the organizing committee members, and also express my particular appreciations
to the collaboration with ICEP (International Conference on Electronic Packaging), iNEMI (The
International Electronics Manufacturing Initiative), and IAAC (IMAPS All Asia Conference).
Wun-Yan Chen
Chair, Organizing Committee
▲
2

6. Greeting
Welcome Message from Shen-Li Fu, Conference Co- Chair
Shen-Li Fu
Chairman, IEEE CPMT-Taipei
Honorary President, I-Shou University
Chairman, SMTA-Taiwan
As the Co-Chair of the Organizing Committee, IMPACT-IAAC2013, I take it a great pleasure to
welcome friends, colleagues, and participants from all over the world attending this wonderful event.
IMPACT-IAAC2013 is the eighth conference jointly organized by IEEE-CPMT Taipei Chapter, IMAPS
Taiwan Chapter, ITRI (Industrial Technology Research Institute), I-Shou University and TPCA (Taiwan
Printed Circuit Association). It is one of the most important events of this kind in the world, and is
acknowledged for its intensive connections between industries and academia.
Several unique arrangements of IMPACT-IAAC 2013 are as the follows. First, the conference will be
a joint event of IMPACT and IAAC this year. Second, follows the footsteps of the previous conferences,
there will still be Industrial Forums this year: Advanced Packaging-SPIL and 3D IC Forum. There will
also be several special forums: ICEP (Japan Packaging Session), iNEMI (iNEMI Session) and a Panel
Discussion (Chaired by Dr. Charles E. Bauer).
Thanks again for your participation. I hope, and I am sure, you will have fruitful discussion and
expand cooperation. Wish you all have a pleasant and enjoyable stay in Taiwan and looking
forward to seeing you in person.
Shen-Li Fu
Chairman, IEEE CPMT-Taipei
Honorary President, I-Shou University
Chairman, SMTA-Taiwan
▲
3

7. Welcome Message from Dr. CT Liu, Conference Co-Chair
Dr. CT Liu
Vice President & General Director, ITRI
On behalf of the Organizing Committee, it is my great pleasure to welcome you to “IMPACT 2013”,
the 2013 International Microsystems, Packaging, Assembly and Circuits Technology Conference.
The theme of 2013 IMPACT is “Green & Cloud: Creating Value and Toward Eco-Life”. All
participants will enjoy many well organized technical events by our Technical Program Committee
and Organizers, including IEEE, CPMT-Taipei, IMPAS-Taiwan, ISU University, TPCA, and ITRI.
In this 3-day conference, you will have the chance to attend the IMPACT speeches and meet
renowned Plenary Speakers who will share their visions on technology trends. In addition, there
will be 4 Special Sessions and 1 Special Forum presented by experts in advanced packaging
technologies moving toward system scaling and integration.
Your involvement brings together the world’s leading researchers, engineers, and industrial experts.
I would also like to express my sincere appreciation to everyone who has helped in organizing this
conference, in particular, the Local Organizing Committee and the Technical Program Committee, and
sincere gratitude to all of our sponsors and partners as well.
Again, welcome to IMPACT 2013 –“Green & Cloud: Creating Value and Toward Eco-Life”!
Wish you all have a pleasant and enjoyable conference and stay in Taiwan.
CT Liu, Ph.D.
Vice President &General Director, ITRI
▲
4

8. Greeting
Welcome Message from Rick Wu, Conference Co-Chair
Rick Wu
Chairman, Taiwan Printed Circuit Association (TPCA)
As a Co-Chair of IMAPCT Conference, it is my pleasure and privilege in welcoming you to join
IMPACT-IAAC 2013. This year, the 2nd IAAC (IMAPS All Asia Conference) is combined to IMPACT
organized by IEEE CPM-Taipei, iMAPS-Taiwan, ITRI and TPCA will be held in conjunction with TPCA
Show 2013 on 22nd -25th at Taipei Nangang Exhibition Center. As we know IMPACT is the largest
Electronic Packaging and PCB Conference which has become the benchmark event in the world.
This year, IMPACT arranges two thematic Industrial Forums-SPIL-Advanced Packaging and 3D IC
Forum. In addition, there are many special sessions such as IAAC GBC session, Japan Packaging
session, iNEMI session, Panel Discussion and IP Session. Furthermore, TPCA offers rich scholarship for
the Outstanding Paper Award winner from PCB and Packaging and supports them traveling to join
ECWC 13 conference in Germany next year. I believe it must attract many experts and elites from
world-wide to participate.
Moreover, as a host of TPCA Show, I would like to invite you to visit TPCA Show 2013 taking place
on the fourth floor of Nangang Exhibition Center. Base on the full support from TPCA members, TPCA
Show 2013 has 1,320 booths consisted by 350 exhibitors which increased 11% compared to last
year. Finally, I wish TPCA show 2013 and IMPACT Conference to make a big success and to become
a valuable resource under your contribution and participation.
Sincerely Yours,
Ricky Wu
Chairman, Taiwan Printed Circuit Association (TPCA)
▲
5

9. Committee Member
Conference Chair
Wun-Yan Chen
iMAPS-Taiwan
Conference Honorary Chair
Ku-Ning Chiang
NTHU
Yi-Jen Chan
Hermes-Epitek Corp.
Conference Co-Chair
Shen-Li Fu
IEEE-Taiwan
CT Liu
ITRI
Rick Wu
TPCA
Conference Executive Co-Chair
Bo-Bin Tsai
AVC Co., Ltd.
Dyi Chung Hu
Unimicron
Heinz Ru
Tong Hsing Electronic
Mike Ma
SPIL
Shin-Puu Jeng
TSMC
Technical Program Committee
Chair
Yu-Hua Chen
IMAPS-Taiwan/ITRI
Co-Chair
Hsiang-Chen Hsu
I-SHOU University
Co-Chair
Hsien-Chie Cheng
Feng Chia University
Co-Chair
Rolf Aschenbrenner
Fraunhofer IZM
Co-Chair
Yasumitsu Orii
IBM Japan
SubCommittee Chair Wei-Chung Lo
ITRI
SubCommittee Chair Frank Bai
TPCA
SubCommittee Chair Jen-Dong Hwang
TTMA
China
Haley Fu
iNEMI
Germany
Andreas Ostmann
Fraunhofer IZM
Singapore(Malaysian) Chuan-Seng Tan
Nanyang Technology University
Taiwan
Ben-Je Lwo
National Defense University
Taiwan
C. Robert Kao
National Taiwan University
Taiwan
Chang-Chun Lee
Chung Yuan Christian University
Taiwan
Chao, Shin Hua
ASE
Taiwan
Charlie Lu
Altera
Taiwan
Chen, Kuan-Neng
National Chiao Tung University
Taiwan
Chi-Chuan Wang
National Chiao Tung University
Taiwan
Chih Chen
National Chiao Tung University
Taiwan
Cho-Liang Chung
I-SHOU University
Taiwan
D. S. Liu
National Chung Cheng University
▲
6

10. Committee
Taiwan
Dennis Lin
TPCA
Taiwan
Jeffrey Lee
IST
Taiwan
Jenn-Ming Song
National Chung Hsing University
Taiwan
John Liu
BoardTek Electronics Corporation
Taiwan
K. M. Chen
UMC
Taiwan
Kuan-Jung Chung
National Changhua University of Education
Taiwan
Kun-Nan Chen
Tungnan University
Taiwan
L. S. Chen
SMTA
Taiwan
M. Y. Tsai
Chang Gung University
Taiwan
Mei-Ling Wu
National Sun Yat-Sen University
Taiwan
Shih-Kang Lin
National Cheng Kung University
Taiwan
Shung-Wen Kang
Tamkang University
Taiwan
Tz-Cheng Chiu
National Cheng Kung University
Taiwan
Yi-Shao Lai
ASE
Taiwan
Yu-Po Wang
SPIL
USA
John Xie
Altera
USA
Yung-Yu Hsu
MC10 Inc.
Domestic Advisory Board
Albert Lan
藍章益
SPIL
David Wang
王 偉
ChipMOS
George Yang
楊志海
Atotech Taiwan Limited
James Ho
何信芳
Nan Ya Printed Circuit Board Corp.
Jao-Hwa Kuang
光灼華
National Sun Yat Sen University
Maurice Lee
李長明
Unimicron Technology Corp.
S. J. Hwang
黃聖杰
National Cheng Kung University
Stephen Wang
王仙壽
ETERNAL CHEMICAL CO.,LTD
International Advisory Board
Shi-Wei Ricky Lee
Co Chair
Finland
Hong Kong
Japan
Japan
Japan
Japan
Japan
Japan
Kwang-Lung Lin
Paul Collander
Enboa Wu
Masahiro Aoyagi
Masaru Ishizuka
Masayoshi Esashi
Noriyuki Miyazaki
Toshio Tomimura
Yutake Tsukada
Hong Kong University of Science and Technology
IEEE CPMT Society
Materials Science & Engineering, National Cheng Kung University (NCKU)
Poltronic
ASTRI
National Institute of Advanced Industrial Science and Technology
Toyama Prefectural University
Tohoku University
Department of Mechanical Engineering and Science, Kyoto University
Kumamoto University
The president of JIEP (Japan Institute of Electronic Packaging).
Both IMAPS-Japan and CPMT-Japan
7
▲
Chair

11. Malaysia
Malaysia
Singapore
Taiwan
UK
USA
USA
USA
USA
USA
USA
USA
USA
Mohd Zulkifly Abdullah
Wong Shaw Fong
Andrew Tay
Wen-Hwa Chen
Chris Bailey
Charles Bauer
Jay Dasai
Jie Xue
Michael Pecht
Ning-Cheng Lee
Robert C. Pfahl
Sung Yi
Voya Markovich
Univeristy Sains Malaysia (USM)
Intel Coorporation
National University of Singapore
National Applied Research Laboratories (NARL)
University of Greenwich
TechLead Corp.
MFLEX
Cisco Systems, Inc.
Center for Advanced Life Cycle Engineering/University of Maryland
Indium Corp.
International Electronics Manufacturing Initiative (iNEMI)
Portland State University
IMAPS
Local Organizing Committee
Chair
Long-Shien Lin (IMAPS-Taiwan/ITRI)
Local Committee Co-Chair
Yu-Jung Huang (ISU)
Subcommittee-Chair
R. S. Lee (ITRI)
Hung-Yin Tsai (NTHU)
Chi-Shiung Hsi (NUU)
David Lai (TPCA)
Michelle Hung (TPCA)
Secretariat
Jun-Man Lin (ITRI)
Sophia Huang (TPCA)
Sylvia Yang (TPCA)
Erik Yu (TPCA)
Registration
Jessie Chiu (TPCA)
Public Relations
Jessie Chiu (TPCA)
▲
8

12. Information
IMPACT- IAAC Conference 2013
The 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference
In order to avoid dangerous climate change, provide sustainable green energy and better life for global population,
the ICT products and services need to gain further effective improvements in system performance and integration,
and innovate to reduce environmental impact. Over the past years, IMPACT conference, a remarkable platform,
continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and
encourage the development and research of new materials, processes and designs in realizing the versatile system
demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications.
IMPACT sincerely welcomes you to IMPACT-IAAC 2013 Joint Conference which will be held in conjunction with TPCA
Show 2013 on 22nd -25th at Taipei Nangang Exhibition Hall. This year, the 2nd IAAC (IMAPS All Asia Conference)
is rotated in Taiwan, and a joint international conference of IMPACT and IAAC is organized by IEEE CPMT-Taipei,
iMAPS-Taiwan, ITRI and TPCA. To cater for the technology trends, the theme of IMPACT-IAAC 2013 highlights “Green
& Cloud: Creating Value and Toward Eco-Life” and will arrange Panel Sessions, invited talks, industrial sessions and
outstanding paper presentations. Furthermore, IMPACT keeps collaborating with International organizations such as
ICEP from Japan and iNEMI from U.S.A. We hope this Conference to be successful and to become an important and
valuable resource under your contribution and participation
General Information
Date: October 22(Tue) - October 25 (Fri), 2013
Venue: Taipei Nangang Exhibition Hall, Taipei, Taiwan
■ Conference: IMPACT-IAAC Conference
■ Exhibition : TPCA Show 2013
■ Theme: Green & Cloud: Creating Value and Toward Eco-Life
■
■
Hotel Information
To enjoy the discount for IMPACT conference attendees, please book your hotel right away and make further followup confirmation with the hotel.
No. HOTEL
Price
Contact Person
Venue
1
國賓大飯店
The Ambassador Hotel
★Contract No.
E9800011
Executive Single：
$5,150+10%
Executive Twin：
$5,750+10%
李姿瑩 Sonia Lee
sonia.lee@mstp.ambhotel.com.tw
Tel：886-2-25511111
Fax：886-2-25617883
捷運雙連站旁
Shuanglian Side
2
台北凱撒大飯店
Caesar Park Taipei
★Contract No.
台灣電路板協會
Single Room：
$4,000
Twine Room：
$4,600
葉虹吟 Fanny Yeh
fanny_yeh@caesarpark.com.tw
Tel：886-2-2311-5150 Ext. 2420
Fax：886-2-2371-0936
台北車站旁
Taipei Main Station
3
兄弟大飯店
Brother Hotel
★Contract No.
AE648A
Standard Single：
$3,350
Twin Room：
$4,200
訂房組
Tel：886-2-2713-0567
Fax：886-2-2717-3334
捷運南京東路站旁
Nanjing E Rd. Side
▲
9

13. No. HOTEL
Price
Contact Person
Venue
4
麗湖大飯店
City Lake Hotel
★Contract No.
73765919
Standard Single：
$2,838
Deluxe Twin：
$3,168
潘伯進
lake.hotel@msa.hinet.net
Tel：886-2-26342136
Fax：886-2-26346136
捷運葫洲站旁
Huzhou Side
5
太平洋商務飯店
Pacific Business Center
★Contract No.
E191
Surperior Room：
$3,800(1 breakfast)
Surperior Room：
$4,000(2 breakfast)
林逸萍 Tina
pbc.taipei@msa.hinet.net
Tel：886-2-8780-8000
Fax：886-2-8780-5000
捷運站六張犁站旁
Liuzhangli Side
6
維多麗亞酒店
Grand Victoria Hotel
★Contract No.
73765919
Deluxe Room：
$5,400+10%
Business Room：
$5,900+10%
業務組
lucy.chen@grandvictoria.com.tw
Tel：886-2-85020000 Ext. 2166
Fax：886-2-66025670
捷運劍南路站旁
Jinnan Rd. Side
7
柯旅天閣-台北信義
The Tango Hotel
★Contract No.
XYSC308
Deluxe King：
$4,000
Executive King：
$4,200
訂房組
rsvn.xy@tango-hotels.com
Tel：886-2-25288000
Fax：886-2-25287676
捷運永春站旁
Yongchun Side
8
台北馥華商旅(南港館) Standard Room : $2,600
Forward Hotel Business Room : $2,800
Nangang
★Contract No.
1F2013
陳紫玲
j22684832@yahoo.com.tw
Tel：886-2-66156788
Fax：886-2-66156799
捷運南港軟體園區旁
Nangang Software
Park Side
9
康寧生活會館
KangNing Service
Apartment
★Contract No.
73765919
Junior Suite A :
$3,000
Junior Suite B :
$3,250
葛觀
Tel：886-2-26348999
Fax：886-3-26347057
捷運東湖站旁
Donghu Side
10
天成大飯店
Taipei Cosmos Hotel
★Contact No.
73765919
Superior Single :
馬仲緯 Leon Ma
$3,080
rv.reserve@cosmos-hotel.com.tw
Executive Deluxe : $3,300 Tel：886-2-23617856 Ext. 231
Fax：886-2-23118902
台北車站旁
Taipei Main Station
11
桃園尊爵大飯店(莊敬
路)
Monarch Plaza Hotel Taoyuan
★Contract No.
O0003
Executive Twin ：
$3,102+10%
Monarch Room：
$3,243+10%
桃園/接駁車
Taoyuan /
Shuttle Bus
12
古華花園飯店
Hotel Kuva Chateau
★Contract No.
73765919
Executive Twin：
阮梅
3,300+10%
Tel：886-3-2811818
Deluxe Twin：3,700+10% Fax：886-3-2811616
▲
10
訂房組
sales@monarch-hotels.com.tw
Tel：886-3-316-9900
Fax：886-3-317-9000
桃園
Taoyuan

14. Information
Conference Venue Map
TPCA Show IMPACT Joint Reception (Taiwanese Cuisine Buffet)
Date: Oct. 23, 2013 (18:00-20:00)
Venue: 3F (Canton悅), Taipei Nangang Exhibition Center
International Welcome Dinner
Date: Oct. 24, 2013 (18:30-20:00)
Venue: 4F (Formosa 寶島廳, Caesar Park Taipei) (Add : 38, Chung Hsiao W. Rd., Sec. 1, Taipei, 100, Taiwan, R.O.C.)
Invited Guest: Plenary Speakers, Invited speakers, Overseas authors, VIP and Committee members
Lunch Provided
Organizer will arrange lunch box for every attendee.
Date: Oct.23-24, 2013
Time: 12:30-13:30
Venue: 504
Identification
Badges are required for admittance to all sessions, lunch and TPCA Show IMPACT Joint Reception. Please bring it
with you all the times.
▲
11

15. Registration Desk
Reception desk is located on 5th floor of Taipei Nangang Exhibition Center. Please check in and get proceedings in
reception desk from 8:30AM to 17:00PM.
Organizer Office
Room 521 is organizer’s office on the 5th floor of Taipei Nangang Exhibition Center.
Speaker Preview Room
The preview room for all speakers is located in the Room 521 on the 5th floor of Taipei Nangang Exhibition Center.
All speakers are advised to provide your update presentation slides or check your file in advance there.
Open Hour: 9:00am - 5:30pm, October 22-25
Conference Venue
Conference rooms will be located on the5th floor of Taipei Nangang Exhibition Center.
Poster Session
Poster session will be located on 5th floor of Taipei Nangang Exhibition Center.
Internet Access
Poster
Registration
Desk
Poster
Coffee
Break
Speaker Organizer
Preview
office
Room
Poster
Wireless internet is provided on 5th floor of Taipei Nangang Exhibition Center for free.
Poster
Poster
Room
Room Room 503
501 502
▲
12
Room
504
A
Room
504
B+C

16. Information
Social Program
Plant Culture Tour
Only for Oversea Attendees and Student
• Schedule on Oct. 25rd afternoon *Note: The Organizer reserves the right to amend the schedule.
Time
Schedule
Location
12:30-12:40
Gathering at 5F (in front of Impact Register Counter)
Nangang Exhibition
12:40-14:00
Shuttle to Taiwan DuPont Innovation Center
14:00-15:00
Plant tour
15:00-15:30
Shuttle to Hsinchu Glass Museum
15:30-17:00
Glass Museum visit Guided tour
17:00-18:30
Shuttle to Caesar Park Taipei Hotel
DuPont Innovation Center
Glass Museum
• Plant tour: DuPont Innovation Center
DuPont has been bringing world-class science and engineering to the global marketplace in the form of innovative
products, materials, and services since 1802. The Innovation Centers bring to life the problem-solving power of
private/public alliances, serve as a catalyst for growth, and serve to uncover unmet needs that will improve the
lives of people everywhere.
Address: No.2, Li-Hsin 4th Rd., Hsinchu Science Park
Website: www.innovationcenter.dupont.com
Note: the plant tour has minimum of 10 and maximum of 25 people.
• Culture tour: Glass Museum
Situated at the north western of Hsinchu Park, the museum was officially opened on December 18 th, 1999. The
mission of the museum is to link resources of culture and tourism, assist the upgrading of Hsinchu glass industry, and
introduce glass industry to the people and dealers of its development and application.
Address: No.2, Sec. 1, Dongda Rd., East Dist., Hsinchu City 300, Taiwan (R.O.C.)
Website: http://glassmuseum.moc.gov.tw/index.htm
▲
13

17. City Tour
Taiwan Tour Bus-Schedule
Taiwan Tour Bus schedules provide many kinds of trips which include the major scenic spots in Taiwan. It will lead you
to experience Taiwan’s city life, Taiwanese’s passion and hospitality, the ecology in farms, the spectacular scenery, hot
springs and delicious food, shopping and Chinese holiday activities and to rediscover the charming characteristics of
“Formosa.” IMAPCT organizer arranges 7 tours in Northern Taiwan, if you are interested in, you could contact South
East Travel Service.
TOUR NO.
Pick up
TOUR FARE
ADULT/person
NOTE
(1) Taipei City tour
Morning and afternoon
NTD 855
Half day
(2) Taipei Night Tour
Every day
NTD 1235
3 1/2 hours
(3) Folk Arts Tour
Afternoon
NTD 1045
Half day
(4) Yangmingshan National Park
Afternoon
NTD 1235
Half day
(5) Chiufen Village Northeast Coast
Afternoon
NTD 1045
Half day
(6) Northern Coast Tour
Morning
NTD 950
Half day
(7) Taroko Gorge Tour
Morning
NTD 4655
One day
If you need any further information,
please contact South East Travel Service Phone:(886) 2-25713001 Fax :(886) 2-25236981
About Taiwan
I. Visa
Visa-Exempt Entry
Countries eligible for
Visa-exempt entry
▲
14
1. he nationals of the following countries are eligible for the visa exemption program, which permits a
T
duration of stay up to 90 days: Austria, Belgium, Bulgaria, Canada, Croatia, Cyprus, Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Israel, Italy, Japan,
Republic of Korea, Latvia, Liechtenstein, Lithuania, Luxembourg, Malta, Monaco, the Netherlands, New
Zealand, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, U.K., U.S.A.
and Vatican City State.
The nationals of the following countries are eligible for the visa exemption program, which permits a
duration of stay up to 30 days: Australia, Malaysia, Singapore.
2. he nationals of India, Thailand, Vietnam, Philippines and Indonesia, who also possess a valid visa or
T
permanent resident certificate issued by U.S.A., Canada, Japan, U.K., Schengen Convention countries,
Australia or New Zealand, are eligible for the visa exemption program, which permits a duration of stay
up to 30 days. Those who meet the above qualification and have never been employed in Taiwan as bluecollar workers have to apply to the “Advance Online Registration System for the Visitors of Nationals from
Five Southeast Asian Countries to Taiwan” of the R.O.C. National Immigration Agency (website: https://nas.
immigration.gov.tw/nase) for an Authorization Certificate before coming to Taiwan. After completion, the
printed-out Certificate can be used by the foreign visitor for boarding the airplane and the immigration
inspection. During the immigration inspection, foreign visitors who can not show a valid visa or permanent
resident certificate issued by one of the aforementioned countries will not be admitted into the R.O.C. (In
case a single-entry visa issued by any of the said countries has already been used, it is invalid.)

18. Information
Requirements
1. passport with validity of at least six months upon entry .
a
‧visa-exempt entry only applies to foreign visitors holding formal passports (i.e.
ordinary, official/service and diplomatic passports), not including those holding
emergency, temporary, other informal passports or travel documents.
‧Japanese passport holders with their passports valid for more than 3 months are
eligible for visa-exempt entry.
‧US passport( including emergency passport) holders with their passports valid for the
period of intended stay are eligible for visa-exempt entry.
2. confirmed return air/sea ticket or an air/sea ticket and a visa for the next destination,
a
and a confirmed seat reservation for departure.
3. non-criminal record and not prohibited by the local authorities to enter the R.O.C.
Duration of stay
1. he duration of stay starts from the next day of arrival and is not extendable. Foreign
T
visitors must depart by the end of the said duration. Please click here for Penalty for
overstay.
2. isa-exempt entry cannot be converted to other types of visas, unless the following
V
exceptions:
A. oreign visitors entering the R.O.C. through visa-exemption may only apply for
F
converting to visitor visas within their legal stay at the Bureau of Consular Affairs or
branch offices of MOFA in case of: severe acute diseases, natural disasters or other
force majeure reasons, which hold them back from leaving the R.O.C. In addition,
white-collar professionals who have obtained the work permits within their legal stay
may apply for work visas, together with their spouse and minors (under age 20)
entering the R.O.C. at the same time.
B. or U.K. and Canadian passport holders, please refer to Notice for British
F
Canadian Passport Holders Who Enter Taiwan Visa-Free and Apply for an Extension
of Stay.(doc)
Ports of entry
Taiwan Taoyuan International Airport, Taipei Songshan Airport, Keelung Harbor, Taichung
Airport, Taichung Harbor, Kaohsiung International Airport, Kaohsiung Harbor, Magong
Airport, Taitung Airport, Hualien Airport, Hualien Harbor, Kinmen Airport, Shuitou Harbor
and Fuao Harbor.
Landing Visa
Countries eligible for
Visa-exempt entry
1. Nationals of Hungary , Poland and Slovak.
2. olders of emergency or temporary passports with validity more than six months for
H
nationals of those countries eligible for visa-exempt and landing-visa entry.
3. Holders of USA passport with validity less than six months.
1. a passport valid for at least six months
Requirements
2. confirmed return air ticket or an air ticket and a visa for the next destination, and a
a
confirmed seat reservation for departure
3. fill out an application form with one photo
4. isa fee of NT$ 1,600 (citizens of countries with reciprocal agreements shall be issued
v
visas gratis) plus a handling fee of NT$ 800; For U.S. citizens: see remarks 2
5. no criminal record
1. runeian passport holders: The 14-day duration of stay starts from the next day of
B
Duration of stay
arrival and is not extendable.
2. ther eligible passengers: The 30-day duration of stay starts from the next day of
O
arrival and is not extendable.
3. he above-said landing visa cannot be converted to visitor or resident visa under normal
T
circumstances.
Taiwan Taoyuan International Airport, Kaohsiung International Airport.
Ports of entry
More information please refer to : http://www.boca.gov.tw/mp?mp=2
▲
15

19. II. Transportation
Buses
Buses from the Taoyuan International Airport to Taipei are available. Please indicate your needs at ticket counters
which are located in the Arrival Passenger Reception Areas of both Terminals. Please visit more Information at http://
www.taoyuanairport.gov.tw
Airport Taxi
Taxi queues are outside the Arrival Halls of both terminals. To ensure the safety of passengers, only the taxis
approved by the Aviation Police Bureau are permitted to operate in Taoyuan International Airport. Airport taxis
charge according to the meter in addition to a 50% surcharge (highway tolls not included) and provide transport to
anywhere in Taiwan. (A typical taxi fare to Taipei is approx NT$1,100.)
Taiwan High Speed Rail (THSR)
The Ubus and taxis to Taiwan High Speed Railway Station standby at Access Station charge according to regulation
of local government without increment, passengers are welcomed to take the ride. Please visit more information at
http://www.taoyuanairport.gov.tw
III. Helpful Tips
Climate
October is one of the most pleasant months in Taiwan. The climate in October is generally mild with
temperatures of 22-27℃ in Taipei.
Currency
The New Taiwan Dollar (NT$) is the national currency. Paper currency comes in $2,000, $1,000, $500, $200, and
$100 denominations, while coins come in $50, $10, $5, and $1 denominations. The currency exchange rate at Sep.
2013 is around NT$ 29.536 to US$1. Foreign currencies can be exchanged at the Taiwan Taoyuan International
Airport, government-designated banks and hotels. Please visit the Currency converter at http://www.xe.net . Major
credit cards are accepted in major hotels and stores and travelers checks may be cashed at foreign-exchange
banks, some tourist-oriented businesses and most international tourist hotels.
Electricity
110 Volts/ 60Hz A.C.
Languages
Mandarin Chinese is the official language in Taiwan, but English is familiar to the younger generation, especially
students, and those engaged in export trading, tourism, and hotel industries. Most taxi drivers do not speak English.
Time Zone
Taiwan is 8 hours ahead of Greenwich Mean Time (GMT + 0800)
Tipping
A 10% service charge is automatically added to room rates and meals. Other tipping is not expected.
Telecommunication Services
The local rate for public pay phones is NT$1 for two minutes. Most public phones provide international call services.
English and Japanese speaking switchboard operators are employed at most hotels. Please dial the area code (02)
for Taipei first if you are calling from the Taiwan Taoyuan International Airport.
Useful Phone Numbers
Taiwan Taoyuan International Airport Tourist Service Center
http://www.taoyuanairport.gov.tw
Tel: +886-3-3983728
▲
16

20. Information
Tourism Bureau's Tourist Information
http://www.tbroc.gov.tw/
Tel: +886-2- 2717-3737
Foreign Affairs Division, Taipei Office
http://www.boca.gov.tw/english/index.htm
Tel: +886-2- 2381-8341
International Phone Assistance....................................100
Emergency Service.......................................................110
Directory Assistance in English....................................(02)2311-6796
For more information about Taiwan, please refer to http://www.taiwan.net.tw/.
Inquiries
Requests for information about the Conference should be directed to:
Ms. Sophia Huang
IMPACT 2013 Secretariat
No. 147, Sec. 2, Gaotie N. Rd., Dayuan, Taoyuan 33743, Taiwan
Tel: +886-3-3815659 Ext. 404
Fax: +886-3-3815150
Mobile: +886-961-160-202
E-mail: service@impact.org.tw
Website: www.impact.org.tw
▲
17

21. PLENARY SPEECH
Wednesday, October 23, 10:20-11:10
Ricky Shi-Wei Lee
President
IEEE-CPMT Society
Topic: From MOOREfication to LEDification
Time: 10:20-11:10
Room 504
Light-emitting diode (LED) is a semiconductor device with a p-n junction which can emit photons under
forward bias. That’s why LED is called a solid-state lighting (SSL) source. Although the electroluminescence
effect was discovered in early 20th century, LED did not become industrialized until 1960s. Before the turn of
the millennium, LED was mainly used for signaling and display applications. That was because LED had not
completed its full color spectrum and the luminous flux of LED was still low at that time. Similar to integrated
circuits (IC), the evolution of LED in the past two decades is indeed more than impressive. With the substantial
progress of blue LED, phosphor materials, and power wattage in 1990s, white light illumination by blue LED
together with yellow phosphor for general lighting applications became possible at the dawn of the 21st
century. In the Strategies in Light 2000 conference, Dr. Roland Haitz of Agilent Technologies presented his
observation and prediction on LED: “for a given wavelength, the amount of light generated per LED package
increases by a factor of 20 every decade and, at the same time, the cost per lumen falls by a factor of 10.”
The previous statement has been known as Haitz’s Law since then and is also considered the LED counterpart
to Moore's Law for IC. In recent years, commercial SSL products started to appear in the consumer markets
around the world. Despite the increasingly innovative applications of LED, the propagation of SSL is not
always that smooth. The main difficulty in bringing LED lighting into households is the rather high start-up
cost. Nevertheless, most major countries in the world are developing and/or implementing policies to ban
the production and installation of incandescent light bulbs due to their poor efficiency. With the impetus from
government policies for energy saving and proper promotion of the concept of “cost of ownership”, people
should be more willing to embrace SSL starting from 2015. It is my true belief that there exists a huge SSL
market potential ahead of us.
▲
18

22. Plenary Speeches
Wednesday, October 23, 11:10-12:00
Dyi Chung Hu
Senior Vice President
Unimicron, Taiwan
Topic: The Challenges of IC Substrate in 3D Era.
Time: 11:10-12:00
Room 504
Semiconductor technology is moving rapidly from 28nm to 20nm and even 16nm node. Traditional laminate
substrate is been challenged to meet the fine line and performance requirement of the IC. For future high
performance products, fine line such as 5/5 and 3/3 even 2/2 um are required. To meet the challenges,
laminate materials with low CTE, low loss and fine line capabilities are being developing in an ever increasing
speed. New substrate requirement such as embedding passive and active components into the substrate is
also emerging. Innovative substrate approach such as 2.5D silicon/glass interposer is an alternative solution to
meet the fine line and fine via requirement.
In this talk, the laminate substrate industry efforts to meet the challenges will be reviewed and new
approaches to the fine line IC substrate will be discussed.
▲
19

23. Thursday, October 24, 09:30-10:20
Yasumitsu Orii
Senior Manager
IBM Japan, Ltd. ,JP
Topic: Next Generation Computer System for the Era of Big Data
Time: 09:30-10:20
Room 504 b+c
The last several years in particular has been a time when the amount of data used in the general public
has been increasing dramatically. Processing speed accordingly plays a crucial role, and the packaging
technology to support the system will be mentioned.
▲
20

24. Plenary Speeches
Thursday, October 24, 13:30-14:20
Kyong Wook Paik
Professor of Materials Sci. Eng.
KAIST, KR
Topic: ecent Advances in Anisotropic Conductive Technology:
R
Materials Processing
Time: 13:30-14:20
Room 504 b+c
Anisotropic Conductive Films (ACFs) have been widely used as excellent interconnection materials in
semiconductor and display applications for chip-on-glass (COG), flex-on-glass (FOG), flex-on-board (FOB),
chip-on-flex (COF), chip-on-board (COB) interconnections due to their fine-pitch capability, simple process,
and cost effectiveness. There have been many technical innovations in terms of materials and processing
technologies. In this presentation, solder ACFs, nanofiber ACFs, photo-activated ACFs and also 3D-TSV NCF
materials will be presented as recent ACF materials innovation, and novel vertical ultrasonic bonding technique
and wafer level ACF processing methods will be presented as recent ACF processing innovation.
For nanofiber ACFs, about 500 nm diameter polymer nanofibers with coupled conductive particles are
fabricated using an electro-spinning method. This novel nanofiber ACF shows excellent electrical bump contact
resistance, and fine pitch handling capability. Nanofiber ACF can completely solve the electrical shortage
problems at 7 μm bump-to-bump gap and 20 micron ultra fine bump pitch of COG(Chip On Glass) and
COF(Chip On Flex) electronic packaging applications.
In addition, new solder ACFs containing micron size Sn-Bi and SAC solder particles combined with the
later described Ultrasonic(U/S) Bonding method overcome the limit of conventional ACFs in terms of current
handling capability and reliability, because solder ACFs form many tiny solder alloy metallurgical joints rather
than several physical contact based joints of conventional ACFs.
As very high impact innovation in ACF bonding process, room temperature operating Ultrasonic (U/S)
bonding method was successfully invented as an alternative of conventional thermo-compression (T/C) bonding
method. Solder ACF with US bonding can be successfully used for FOB(Flex On Board) and FOF(Flex On Flex)
applications to eliminate socket connectors in mobile applications.
Wafer level packages using pre-applied ACFs were also invented. After ACF pre-lamination on a bumped
wafer, and subsequent singulation, and singulated chips were assembled on various substrates using a thermocompression bonding method. The new wafer level packages using pre-applied ACFs can be widely used
for many non-solder flip chip assembly applications such as COB (Chip-on-Board), COF (Chip-on-Flex), COG
(Chip-on-Glass), and 3D-TSV. Excellent SnAg bump joints were successfully formed with stable electrical
interconnection by the added flux function at 40 um pitch 3D-TSV bump pitch.
▲
21

25. Friday, October 25, 09:30-10:20
Islam Salama
Sr. Manager
Substrate and packaging technology development
Intel, USA
Topic: nabling Continuum Computing Thru Innovation in Packaging
E
Substrate Assembly
Time: 09:30-10:20
Room 504 b+c
In today’s world, computing is becoming more pervasive. We have more devices per user and more
functionality in each device. This is shaping a uniquely personalized computing experience and driving an
explosive growth with new markets, devices and applications. It is also increasing the demands on data
centers, cloud computing and giving rise to the era of “Big Data” .The economics of Moore’s law is fueling all
this. At Intel we are committed to Moore’s law scaling. We are investing in several key materials, processes
and equipment technologies that are critical to integrated circuit manufacturing throughout the coming
decade. In this talk, we highlight the critical role high-density interconnect packaging, substrate and assembly
technologies play in Moore’s law scaling. We provide our take on the current state of the industry and call for
action to increase industry focus on standardization, HDI substarte scaling and structural cost reduction.
▲
22

26. IAAC
IAAC Opening Meeting
Time: 13:30-17:00, Tuesday, October 22
Chair: Wun-Yan Chen (iMAPS-Taiwan)
Co-Chair: Hsiang-Chen Hsu (ISU)
Remark: IAAC
Room: 503
Time
Topic
Chairs and Panelist
Affiliation
13:30-13:40
Opening Remark
Wun-Yan Chen
iMAPS-Taiwan
13:40-14:20
Materials and Interconnections to meet demands of future
computing systems
Voya Markovich
iMAPS-USA
14:20-14:50
Advanced Packaging Development in Taiwan —Challenges
and Opportunities
Wun-Yan Chen
iMAPS-Taiwan
14:50-15:20
History and Activity of Korean Semiconductor Packaging
Industry
Gu-Sung Kim
Kangnam University
15:20-15:30
Coffee Break
15:30-16:00
JIEP Activities and Trend of Low Temperature Bonding
Technology for Packaging
Tadatomo Suga
JIEP
16:00-16:30
The Role of IEEE-CPMT in the Evolution of Microelectronics
Packaging Technologies
Ricky Shi-Wei Lee
IEEE-CPMT Society
Voya Markovich
Panel Discussion
Wun-Yan Chen
Gu-Sung Kim
Tadatomo Suga
Ricky Shi-Wei Lee
23
▲
16:30-17:00

27. Panel Discussion
Panel Discussion
Time: 13:30-15:30, Wednesday, October 23
Topic: Designing Electronic Products for Sustainable Manufacture
Chair: Charles E. Bauer (TechLead Corp.)
Co-Chair: Shen-Li Fu (IEEE CPMT-Taipei / ISU)
Remark: Special Session
Room: 504 a+b+c
Time
Topic
Chairs and Panelist
Affiliation
13:30-13:40
Opening Remarks
Charles E. Bauer
TechLead Corp.
Shen-Li Fu
IEEE CPMT-Taipei / ISU
Hajime Tomokage
Fukuoka University
Kyong Wook Paik
Korea Advanced
Institute of Science and
Technology(KAIST)
Ricky Shi-Wei Lee
IEEE-CPMT Society
Klaus-Dieter Lang
Fraunhofer IZM
Ning Cheng Lee
Indium Corporation
Joseph Fjelstad
Verdant Electronics
13:40-14:40
Topic: esigning Electronic Products for Sustainable
D
Manufacture
(1) Materials recovery recycling
(2) uture directions for Pb free assembly (materials
F
processes)
(3) Smart power energy conservation
(4) Process efficiency and waste management
(5) he role of organic materials in packaging,
T
interconnection assembly
(6) Design efficiencies
(7) Eco infrastructure in support of manufacturing operations
(8) Supply chain management for conservation and efficiency
(9) Components, partitioning system architecture
14:40-15:30
Panel Discussion
Charles E. Bauer
Hajime Tomokage
▲
24
Kyong Wook Paik
Shen-Li Fu
Ricky Shi-Wei Lee
Klaus-Dieter Lang
Ning Cheng Lee
Joseph Fjelstad

28. Sessions
SESSION INTRODUCTION
IMPACT OPENING
Time: 10:00 am-10:20 am, Wednesday, October 23, 2013
Room: R 504, 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan
Symposium Chair: Wun-Yan Chen (iMAPS-Taiwan)
ORAL PRESENTATION
SESSION 1: Advanced Packaging (SPIL)
Time: 15:45-17:25, Wednesday, October 23
Chair: Max Lu
Remark: Industrial Session
Room: 504 a
Time
Topic
15:45-16:05
Advanced Package / Technology Integration of Interconnection – From OSAT Perspective
16:05-16:25
[Ag Wire] Interconnection Challenge in Wire Bonding - Ag alloy wire
16:25-16:45
Lead Author
[SIP] SIP Techology of IOT and Wearable Application
Albert Lan
Jensen Tsai
Ja-Yang Chen
16:45-17:05
[New Gen POP] Alternative PoP with Routable Substrate Interposer for stacking solution
17:05-17:25
[3D IC] The Innovative Integration of Advanced Package Technology
Steven Lin
Max Lu
▲
25

29. SESSION 2: IAAC- Global Business Council
Time: 15:45-17:30, Wednesday, October 23
Topic: More SiP or 3D IC
Chair: Wun-Yan Chen Voya Markovich
Time
Remark: IAAC
Room: 504 b+c
Topic
Chairs and Panelists
Affiliation
Wun-Yan Chen
iMAPS-Taiwan
Voya Markovich
iMAPS-USA
15:55-16:05
Charles E. Bauer
TechLead Corp.
16:05-16:15
Gu-Sung Kim
Kangnam University
Y. H. Chen
Unimicron
16:25-16:35
K. M. Chen
UMC
16:35-16:45
Yasumitsu Orii
IBM Japan Ltd.
15:45-15:55
~Welcome Remarks~
16:15-16:25
More SiP or 3D IC
16:45-17:30
Panel Discussion
Wun-Yan Chen
Charles E. Bauer
▲
26
Gu-Sung Kim
Voya Markovich
Y. H. Chen
K. M. Chen
Yasumitsu Orii

30. Sessions
SESSION 3: Advanced Packaging I
Time: 15:45-17:45, Wednesday, October 23
Chair: Shih-kang Lin (National Cheng Kung University)
Co-Chair: Cheng-En Ho (Yuan Ze University )
Time
15:45-16:15
Paper
Code
Topic
INVITED
EU153-1
Room: 503
A New Generation of Power Packaging Using
Embedding of Active Chip
Lead Author
Affiliation
Fraunhofer IZM
Andreas Ostmann
16:15-16:30
EU083-1
Non-Etching Adhesion Promoter for Dry Film
for Semi-additive Manufacturing – Advanced
Dry Film Pre-treatment
Rami Haidar
Atotech Deutschland
GmbH
16:30-16:45
TW034-1
Heat-Resistance Study of Thermal Release
Tape
Chieh-Yuan Chi
SPIL
16:45-17:00
TW064-3
A Miniature Crystal Package of Using DPC
Technology
Vincent Wei
Tong Hsing Electronic
Industries
17:00-17:15
TW086-1
☆
Electroplating of 111-oriented nickel using
111-orientated nano-twinned copper
Yi-Cheng Chu
Materials Science and
Engineering. National
Chiao Tung University
17:15-17:30
TW124-1
Phase Evolution and Nanomechanical
Properties of Intermetallic Compounds in
Solid-Liquid Interdiffusion Bonding
Tsung-Yun Pai
National Chung Hsing
University
17:30-17:45
TW120-1
Fabrication of nearly void-free Cu3Sn
microbumps for 3D IC packaging
Wei-Lan Chiu
National Chiao Tung
University
☆ Outstanding Paper Award Winner
▲
27

31. SESSION 4: Advanced and Emerging Technology
Time: 15:45-18:00, Wednesday, October 23
Chair: T.M. Lee (ITRI)
Co-Chair: Jenn-Ming Song (National Chung Hsing University)
Time
15:45-16:15
Paper
Code
Topic
INVITED
US123-1
Room: 501
FPC deformation and its implications for the
high frequency applications
Lead Author
Affiliation
MFLEX
Qiang Gao
16:15-16:30
TW085-1
☆
On the Mechanical Behaviors of ACFtyped Ultra-Thin-Chip-On-Flex Interconnect
Technology Under Bonding Process and
Bending Test
Chien-Hao Ma
Feng Chia University
16:30-16:45
AS052-1
A Novel and Green Electroless Copper
Andy Chow
The Dow Chemical
Company
16:45-17:00
TW145-1
Study of Interfacial Reactions between
Cu Substrate and Lead-Free Solder with
Low Solder Volume for 3D IC Integration
Technology
Ting-Li Yang
National Taiwan University
17:00-17:15
AS050-1
The Evolution of organic solderability
preservative process in printed circuit board
application
Kti Ho Tong
Interconnect Technologies,
Dow Electronic Materials
17:15-17:30
TW087-1
A Novel Through-Hole Filling Technology
for Next Generation Organic Interposer
Applications
Tao-Chi Liu
Enthone
17:30-17:45
TW041-1
☆
Cu Electroless Deposition by using Cu
Nanoparticles as Catalysts for a Printed
Circuit Board Metallization
Yi-Chun Chung
National Chung Hsing
University
17:45-18:00
TW122-1
☆
Reactive Wetting of Molten Ga solder on
Poly-crystalline, Single-crystalline and Ptcoated Cu Substrates
Yi-kai Kuo
National Cheng Kung
University
☆ Outstanding Paper Award Winner
▲
28

32. Sessions
SESSION 5: IP Session
Time: 15:45-18:00, Wednesday, October 23
Theme: What Makes Good Innovations into Great IPs?
Chair: Kwang-Lung Lin Kuo-Ning Chiang
Remark: Special Session
Room: 502
Time
Topic
Chairs and Panelist
15:45-15:50
Introduction
15:50-16:10
U.S. patent system overview:
(i) nique US patent features in patent procurement and enforcement
U
(ii) Trends of patent enforcement in US
Patent litigation before US federal courts: litigation procedures and case study
Kwang-Lung Lin
Kuo-Ning Chiang
Bing Ai
John Schnurer
16:10-16:30
16:30-16:55
16:55-17:10
17:10-17:20
17:20-18:00
Patent litigation before US International Trade Commission (Section 337 investigation):ITC
procedures and case study
US post-grant proceedings as part of litigation defense strategy
John Schnurer
John Schnurer
Bing Ai
Break
Panel discussion and QA from the floor
Bing Ai
John Schnurer
Benjamin Wang
No
Chairs Panelists of IP Session
Chair
Kwang-Lung Lin
Professor of Materials Science Engineering, National Cheng Kung University (NCKU)
Co-Chair of IAC (IMPACT)
Chair
Kuo-Ning Chiang
Chair Professor of National Tsing Hua University
Honorary Chair of IMPACT Conference
1
Mr. John Schnurer is a patent litigation partner of Perkins Coie LLP and co-chair of the firm's Section 337 investigations practice. He
litigates and tries cases in courts throughout the country, including Section 337 investigations before the United States International Trade
Commission (ITC) including eight jury trials and eighteen bench trials, five of which were patent trials U.S. ITC. He is recognized as a premiere
intellectual property strategist, particularly with respect to the development and execution of global patent litigation strategies. John also
prepares provides strategic intellectual property counseling including advice on patent infringement, validity, re-examinations, and large portfolio
due diligence studies, whether for acquisitions, licensing, or pre-suit purposes. He achieves optimum results by partnering with his clients to devise
and execute customized legal strategies that are consistent with his clients' tactical and strategic business objectives. John represents Taiwanese
companies in patent litigation before U.S. ITC and federal courts, including HTC, ASUS, Largan Precision, ATEN and Pegatron.
Dr. Bing Ai is a partner in the patent group at Perkins Coie LLPand is the co-chair of the firm's patent post-grant proceeding practice.
Bing was a physicist before entering law practice. His practice emphasizes patent prosecution, patent counseling and strategy, patent portfolio
management, freedom to operate analyses, patent validity and infringement issues, patent re-examinations and inter partes review (IPR)
proceedings, patent due diligence and support for patent litigation, and patent due diligence for corporate financing, mergers and acquisitions.
Bing practices in a wide range of technology fields, including electronics, semiconductors, wireless technologies, telecommunications, computer
hardware, software, Internet-based technologies, medical devices, batteries and fuel cells, lasers and optics, and nanotechnology. Bing
represents Taiwanese companies including HTC and Largan Precisionin post-grant proceedings in connection with patent litigation.
Benjamin Wang has been the general director of Technology Transfer Centre at Industrial Technology Research Institute since
2007. Before that, he was the deputy general director at the centre from 2000 to 2007. He has also acted as the director of the
business programme, computer and communication laboratories at ITRI.
3
Mr. Wang holds a PhD in management of technology from National Chiao Tung University, Taiwan (2007), an MS in IP rights law
from the Franklin Pierce Law Centre in the United States (1992) and an MBA from National Taiwan University Taiwan (1981).
Mr. Wang has make contributions not only in advancing IP rights but also in managing business and marketing for more than 30
years. Mr. Wang was awarded “Innovative Model Promoter Award”, Award for National Industrial Innovation, Ministry of Economic
Affairs (MOEA), Taiwan (2011), “Best Marketing Manager”, National Management Excellence Award, Chinese Professional
Management Association, Taiwan (2008) and “Value-created Pioneer Award”, Ministry of Economic Affairs (MOEA), Taiwan (2006).
29
▲
2
Photo

33. SESSION 6: ICEP Japan Session
Time: 10:30-12:20, Thursday, October 24
Chair: Yasumitsu Orii
Time
10:30-11:50
Paper
Code
Topic
INVITED
AS168-1
Remark: Special Session
Room: 504 b+c
Technical Review of ICEP 2013
Lead Author
Affiliation
Renesas Electronics
Corporation
Shintaro Yamamichi
10:50-11:10
INVITED
AS163-1
Waseda University
Study on Surface Treatment Process Using
VUV/O3 Treatment for Reduction of Au-Au
Bonding Temperature
Jun Mizuno
11:10-11:30
INVITED
AS171-1
Senju Metal Industry Co.,
Ltd
Advanced Micro Soldering Technology with
Semiconductor device
Derek Daily
11:30-11:50
INVITED
AS167-1
J-DEVICES
CORPORATION
A New Embedded Package Structure and
Technology for Next Generation of WLP
Akio Katsumata
11:50-12:10
INVITED
AS169-1
Sekisui Chemical Co. ltd.
Advanced Build-up Electrical Insulation
Material for IC Packages
Koichi Shibayama
12:10-12:20
▲
30
QA

34. Sessions
SESSION 7: 3D Integration I
Time: 10:30-12:30, Thursday, October 24
Chair: Shin Hua Chao (ASE)
Co-Chair: Tao-Chih Chang (ITRI)
Time
10:30-11:00
Paper
Code
Topic
INVITED
AS166-1
Room: 504 a
TSV Technology Solution for Advanced
Packaging
Lead Author
Affiliation
ULVAC,Inc.,Japan
Koukou Suu
AS081-1
☆
TW028-1
☆
300 mm Wafer 3D Integration Technology
using Hybrid Wafer Bonding
11:30-11:45
11:00-11:15
Kazuyuki Hozawa
Central Research
Laboratory, Hitachi, Ltd.
Effects of Overlaying Dielectric Layer and Its
Local Geometry on TSV-Induced KOZ in 3D
IC
PuShan Huang
Chang Gung University
EU001-1
Thin Wafer Handling and Chip to Wafer
Stacking Technologies
Pauzenberger
GuumlFnter
EV Group EVG
11:45-12:00
TW030-1
Determination of the Equivalent Thermal
Conductivities of a Through Glass Via TGV
Structure Used for 3D IC Integration
Heng Chieh Chien
Industrial Technology and
Research Institute
12:00-12:15
TW105-1
Intermetallic Compound Growth Behavior
during Multiple Reflows of Ni/SnAg/Ni
and Cu/SnAg/Ni Microbumps in ThreeDimensional Integrated Circuits
Yuan-wei Chang
Dept. of Materials Sci.
Eng., National Chiao Tung
Univ.
12:15-12:30
TW049-1
The 3-D Parallel Processor applied to Matrix
Inversion
Karl Cheng
Innotest Inc.
11:15-11:30
☆ Outstanding Paper Award Winner
▲
31

35. SESSION 8: Thermal Management I
Time: 10:30-12:00, Thursday, October 24
Chair: Chien-Yuh Yang (National Central University)
Co-Chair: Shung-Wen Kang (Tamkang University)
Time
10:30-11:00
Paper
Code
INVITED
AS150-1
Topic
Room: 503
Lead Author
A THERMAL DESIGN APPROACH FOR
NATURAL AIR COOLED ELECTRONIC
EQUIPMENT CASINGS
Affiliation
Toyama Prefectural
University
Masaru Ishizuka
11:00-11:15
AS093-1
Thermal Design Method of Printed Circuit
Board with Measured Effective Thermal
Conductivity
11:15-11:30
TW099-1
Thermal Radiation Material for Electronic
Devices Applications
Sha Yi-An
Polytronics Technology
Corp.
11:30-11:45
TW074-1
☆
Interfacial Reactions in the Cu/In/Ni Sandwich
Couples at 280°C
Yu-Hsiang Wang
National Cheng Kung
University Department
of materials science and
engineering
11:45-12:00
TW022-1
A Case Study of Thermoelectric Generator
Application on Rotary Cement Furnace
Hsu Cheng-Ting
Industrial Technology
Research Institute
☆ Outstanding Paper Award Winner
▲
32
Daiji Kondo
Toyama Prefectural
University

36. Sessions
SESSION 9: Modeling, Simulation Design I
Time: 10:30-12:30, Thursday, October 24
Chair: M. Y. Tsai (Chang Gung University)
Co-Chair: Yu-Po Wang (SPIL)
Time
10:30-11:00
Paper
Code
INVITED
US114-1
Topic
Room: 501
Lead Author
Power and Ground Co-referencing for High
Speed 10-28Gbps Transceivers in FPGA and
ASIC Devices
Affiliation
Xilinx
Hong Shi
TW146-1
Signaling Enabler in High-speed System
Design by Using Hybrid Stack-up Printed
Circuit Board
Thonas Su
Intel Corporation
11:15-11:30
TW135-1
Analysis of LED Wire Bonding Process Using
Arbitrary Lagrangian-Eulerian and Explicit
Time Integration Methods
Kuo-Ning Chiang
National Tsing Hua
University
11:30-11:45
TW133-1
Analytical Description of the Out-of-Plane
Equivalent Mechanical Properties of ThroughSilicon Via Interposers
Sheng-Tsai Wu
ITRI
11:45-12:00
TW038-1
A Novel Decoupling Capacitor for Power
Integrity Application in High-Speed 3D-IC
Package System
Robert Sung
Siliconware Precision
Industries Co., Ltd.
12:00-12:15
TW053-1
A New Detection Method for the Onset of
PCB Pad Cratering
Graver Chang
Integrated Service
Technology
12:15-12:30
TW137-1
Transition Behavior in Large Deflection of
Elastically-Bossed Unsymmetrically Layered
Plate under Initial Tension
Chun-Fu Chen
Chung-Hua University
33
▲
11:00-11:15

37. SESSION 10: Green Materials Process
Time: 10:30-12:15, Thursday, October 24
Chair: Jay Desai (MFLEX)
Co-Chair: LC Chen (DuPont Taiwan Co., Ltd)
Time
10:30-11:00
Paper
Code
Topic
INVITED
AS161-1
Room: 502
Why TBBPA in FR-4 Laminates is a Green
Solution for Printed Circuit Boards?
Lead Author
Affiliation
Chemtura
Grace Han
11:00-11:15
TW023-1
☆
Reliability Evaluation on ENEPIG, Ultrathin
NiP, and EPIG Surface Finishes in Soldering
Applications
Shih-Ju Wang
Yuan Ze University
11:15-11:30
Effective retardation of Sn-58Bi/Cu
interfacial reactions with minor Ga addition
Trong Lan Nguyen
National Cheng Kung
University
11:30-11:45
TW072-1
☆
TW142-1
High Frequency Substrate Materials with
Highly Thermal Resistance and Low Dielectric
Properties
Feng-Po Tseng
Industrial Technology
Research Institute
11:45-12:00
TW098-1
A SIMPLE PRINTABLE ETCHANT
FORMULATION FOR ETCHING
OXIDIC,TRANSPARENT AND CONDUCTIVE
LAYERS
Shin-Shin Wang
Industrial Technology
Research Institute, Material
and Chemical Research
Lab.
12:00-12:15
US154-1
A High Reliability, Stress-Free Electroless
Copper Process for FPC, Polyimide and RigidFlex
William Bowerman
OMG Electronic Chemicals,
Inc.
☆ Outstanding Paper Award Winner
▲
34

38. Sessions
SESSION 11: 3D IC Forum
Time: 14:30-17:30, Thursday, October 24
Chair: Shin-Puu Jeng (TSMC)
Remark: Speical Session
Room: 504 b+c
Time
Topic
Chair and Panelists
Affiliation
14:30-14:35
Opening Remarks
Shin-Puu Jeng
TSMC
14:35-14:55
Advanced 3D Waferlevel System in Package Technologies
Klaus-Dieter Lang
Fraunhofer IZM
14:55-15:15
3D IC Integration: A Foundry Perspective
Vic, J.C. Lin
TSMC
15:15-15:35
Technologies for Multi-chip Integration: Equipment
perspective
Seshadri Ramaswami
Applied Materials
15:35-15:50
Poster Session (Packaging) / Coffee Break
15:50-16:10
Key Focus for Flip-Chip Substrate
Zachery Lin
Nan Ya PCB
16:10-16:30
Advanced Build-up Electrical Insulation Material for IC
Packages
Calvin Yang
Csun Mfg
16:30-16:50
Besides Beyond 2.5D / 3D IC
Walter Jau
ASE
16:50-17:30
Panel Discussion
Shin-Puu Jeng
Vic, J.C. Lin
Seshadri Ramaswami
Zachery Lin
Calvin Yang
Walter Jau
35
▲
Klaus-Dieter Lang

39. SESSION 12: Advanced Packaging II
Time: 14:30-17:30, Thursday, October 24
Chair: Hsiang-Chen Hsu (I-Shou University)
Co-Chair: K. M. Chen (UMC)
Time
14:30-15:00
Room: 504 a
Paper
Code
Topic
INVITED
AS159-1
Advanced packaging and high-data
transmission technology for Smart Society
Lead Author
Affiliation
RENESAS ELECTRONICS
CORPORATION
Michitaka Kimura
15:00-15:15
AS058-1
Analysis of Stress Buffer Effect of Polyimide
for Board Level Drop Test by a Finite Element
Analysis
Nobuhiro Anzai
Asahi Kasei E-materials
Corporation
15:15-15:30
TW064-2
Stress-Reduced Thick Copper Ceramic
Substrate for High Power Module Applications
Vincent Wei
Tong Hsing Electronic
Industries
15:30-15:45
TW148-1
The First MIT 600 V / 450 A IGBT Power
Module For EV / HEV Application
Tao-Chih Chang
ITRI
15:45-16:00
Poster Session (Packaging) / Coffee Break
16:00-16:15
TW036-1
☆
Grain Refinement of Solder Materials by
Minor Element Addition
Cheng Kai Chung
Department of Materials
Science and Engineering,
National Taiwan University
16:15-16:30
TW109-1
EFFECTIVE 3DIC CHIP MODULE WARPAGE
WITH UF DESIGN BY ANALYTICAL METHOD
LI PAI YUAN
SPIL
16:30-16:45
TW089-1
An Innovative Packaging Process for Low
Power Loss Solar Modules
HsinHsin Hsieh
Industrial Technology
Research Institute
16:45-17:00
TW118-1
Effect of Ag Concentration on Ni-Sn
Interfacial Reaction for Micro joints
Jen-Jui Yu
National Taiwan University
17:00-17:15
TW119-1
Necking of low-bump-height solder induced
by reactive wetting of solder on Au finishes in
print circuit board
Chih Chia Hu
Department of Materials
Science and Engineering.
National Chiao Tung
University, Taiwan
17:15-17:30
TW039-1
Periodic Pulse Reverse Cu Electroplating for
Through Hole Filling
Fang-Yu Shen
National Chung Hsing
University
☆ Outstanding Paper Award Winner
▲
36

40. Sessions
SESSION 13: Interconnections Nanotechnology
Time: 14:30-17:30, Thursday, October 24
Chair: De-Shin Liu (Nationnal Chung Cheng University)
Co-Chair: Chih Chen (National Chiao Tung Univ)
Time
14:30-15:00
Paper
Code
Topic
INVITED
US010-1
Room: 503
A Novel Epoxy Flux On Solder Paste For High
Reliability POP Assembly
Lead Author
Affiliation
Indium Corporation
Ning-Cheng Lee
15:00-15:15
AS008-1
Effects of Wire Type and Mold Compound on
Wearout Reliability of Semiconductor Flash
Fineline BGA Package
Gan Chong Leong
Spansion Penang Sdn Bhd
15:15-15:30
TW152-1
High Performance Ag-Pd Alloy Wires for
High Frequency IC Packages
Hsing-Hua TSAI
WIRE TECHNOLOGY CO.
LTD
15:30-15:45
TW014-1
An Efficient Evaluation Method for Packaging
Interconnection
CHIA YEN LEE
Delta Electronics, Inc.
15:45-16:00
Poster Session (Packaging) / Coffee Break
16:00-16:15
TW045-1
☆
Wet Processes for Glass Surface Metallization
and Cu Filling Through Glass Vias (TGVs)
Shao-Ping Shen
Department of Chemical
Engineering National
Chung Hsing University
16:15-16:30
TW132-2
An Investigation on Nanoscale Bondability
between Cu-Al Intermetallic Compound
HSIANG-CHEN HSU
I-SHOU UNIVERSITY
16:30-16:45
TW067-1
A novel Ga-based TSV Interconnection with
Pt UBM
Hao-miao Chang
National Cheng Kung
University
16:45-17:00
TW127-1
Electro-Thermal-Mechanical Modeling of
Wire Bonding Failures in IGBT
Huang-Kang Tseng
Department of Mechanical
Engineering, National Sun
Yat-Sen University
17:00-17:15
TW124-2
Chemical and Thermal Reductions of
Carboxylate-Protected Nanoparticle-based
Ag Conductive Films
Tsung-Yun Pai
National Chung Hsing
University
17:15-17:30
TW047-1
Thermomigration in Micro-bumps of Threedimensional Integrated Circuit Packaging
Wei-Neng Hsu
National Tsing Hua
University
☆ Outstanding Paper Award Winner
▲
37

41. SESSION 14: Modeling, Simulation Design II
Time: 14:30-17:00, Thursday, October 24
Chair: Tz-Cheng Chiu (National Cheng Kung University)
Co-Chair: Yu-Jung Huang ( I-Shou University)
Time
14:30-15:00
Paper
Code
INVITED
EU170-1
Topic
Room: 501
Lead Author
Modelling Co-Design for Power Module
Packaging - Current Status and Future
Challenges
Affiliation
University of Greenwich
Chris Bailey
15:00-15:15
TW056-2
The Reliability Performance of Copper Wire
Bonding BGA Package by Way of HAST
Methodology
Dem Lee
IST-Integrated Service
Technology
15:15-15:30
TW129-1
Investigation of the Responses in the
Environmental Stress Screening System
Activated by Different Combinations of
Hammers
Le Hong Chuong
YuanZe University
15:30-15:45
TW132-3
Electrochemical Migration Failure on FR-4
PCB Plated with Cu by Hygro-Thermo-Vapor
Pressure Coupled Analysis
HSIANG-CHEN HSU
I-SHOU UNIVERSITY
15:45-16:00
Poster Session (Packaging) / Coffee Break
16:00-16:15
TW060-1
IC-Package Co-design by Computational
Thermographics
Jui-Hung Chien
National Tsing Hua
University
16:15-16:30
TW080-1
Design optimization for wafer level package
reliability by using artificial neural network
Po Chen Lai
National Cheng Kung
University
16:30-16:45
TW018-1
Thermal and Thermo-Mechanical Simulations
on High Power Diode Packaging for a Typical
Power Adapter
Ben-Je Lwo
National defense
University
16:45-17:00
TW088-1
A New Edge Strength Evaluation Method and
Apparatus for Flexible Brittle Material
Chih-Ming Shen
ITRI/EOL
▲
38

42. Sessions
SESSION 15: Test Quality
Time: 14:30-17:00, Thursday, October 24
Chair: Jeffrey Lee (IST-Integrated Service Technology Inc.)
Co-Chair: Jerry Huang (Tripod Technology Co.)
Time
14:30-15:00
Paper
Code
INVITED
US172-1
Topic
Room: 502
Lead Author
Quality: Value and Cost
Affiliation
Scimaxx Solution
Herbert J. Neuhaus
15:00-15:15
15:15-15:30
15:30-15:45
TW025-1
☆
TW091-1
☆
Unusual IMC Growth in 3D-IC Solder Joints
Cheng-En Ho
Yuan Ze University
Temperature-dependent failure mechanism
of SnAg solder joints with Cu under-bumpmetallization after electromigration:
experimentation and analysis
Chung Kuang Lin
National Chiao Tung
University
AS070-1
Remotely-Controlled Tensile Test of CopperCored Lead-Free Solder Joint in Liquid Using
Permanent Magnet
Naoya Tada
Okayama University
15:45-16:00
Poster Session (Packaging) / Coffee Break
16:00-16:15
TW151-1
The Effect of Current Stressing on Grain
Growth Tin and Orientation
Yu-Lung Lin
Department of Materials
Science Engineering,
National Chiao Tung
University
16:15-16:30
TW057-1
Inhibition of Whisker Formation by Forming
Uniform Intermetallic Layer
Han-wen Lin
National Chiao Tung
University
16:30-16:45
TW055-1
Effect of grain orientations of Cu seed
layers on the growth of 111-oriented
nanotwinned Cu
Chien-Min Liu
National Chiao Tung
University
16:45-17:00
TW136-1
Investigation of the Characteristics and Impact
Energy of the Pneumatic Hammers Used in
Highly Accelerated Life Test Systems
Chen Yeong-Shu
Yuan Ze University
☆ Outstanding Paper Award Winner
▲
39

43. SESSION 16: iNEMI Reliability Session
Time: 10:30-12:10, Friday, October 25
Chair: Haley Fu
Time
Paper
Code
Topic
10:30-10:55
US164-1
Remark: Special Session
Room: 504 b+c
iNEMI Projects on Medical Electronics
Lead Author
Affiliation
iNEMI
Bill Bader
10:55-11:20
AS162-1
iNEMI
iNEMI Copper Wire Bonded Package
Reliability Project
Haley Fu
11:20-11:45
TW165-1
UL
Improving UL Certification of Laminates and
PCBs
Carl Wang
11:45-12:10
US155-1
Intel
Striking the Balance – Driving Increased
Density and Cost Reduction in Printed Circuit
Board Designs
Tim Swettlen
▲
40

44. Sessions
SESSION 17: 3D Integration II
Time: 10:30-12:15, Friday, October 25
Chair: R. S. LEE (ITRI)
Co-Chair: Chang-Chun Lee (Chung Yuan Christian University)
Time
10:30-11:00
Paper
Code
Topic
INVITED
TW064-1
☆
Room: 504 a
Through-Ceramic Vias TCVs Interposer of
Using Direct Plated Copper Technology for
2.5DIC Packaging
Lead Author
Affiliation
Tong Hsing Electronic
Industries
Vincent Wei
11:00-11:15
EU094-1
FABRICATION, ELECTRICAL
CHARACTERIZATION AND RELIABILITY STUDY
OF PARTIALLY ELECTROPLATED TAPERED
COPPER THROUGH-SILICON VIAS
PRADEEP DIXIT
VTT TECHNICAL RESEARCH
CENTER OF FINLAND
11:15-11:30
TW139-1
Investigation of the process for Glass
interposer
Ching-Kuan Lee
Industrial Technology
Research Institute
11:30-11:45
TW090-1
Wafer Bonding Type Selection for 3D IC
Designs
Shih-Hsu Huang
Chung Yuan Christian
University
11:45-12:00
TW028-2
Strength Evaluation of Thin 3D-TSV Memory
Chips by Pin-on-Elastic-Foundation Test
PuShan Huang
Chang Gung University
12:00-12:15
TW090-2
Temperature Rise Minimization through
Simultaneous Layer Assignment and Thermal
Through-Silicon-Via Planning
Shih-Hsu Huang
Chung Yuan Christian
University
☆ Outstanding Paper Award Winner
▲
41

45. SESSION 18: LED Thermal Management
Time: 10:30-12:15, Friday, October 25
Chair: Jen-Dong Hwang (TTMA)
Co-Chair: Chien-Yuh Yang (National Central University)
Time
10:30-11:00
Paper
Code
Topic
INVITED
TW160-1
Room: 503
Application of Heat Transfer Enhanced Fins in
Electronic Devices Cooling Systems
Lead Author
Affiliation
National Central University
Chien-Yuh Yang
11:00-11:15
EU156-1
Electro-Optical PCBs for Optical Interconnects
in Data Centers
Marika Immonen
TTM Technologies
11:15-11:30
Analysis of Hot Spot Temperature in Power Si
MOSFET with Electro- thermal Analysis
Risako Kibushi
Toyama Prefectural
University
11:30-11:45
AS101-1
☆
TW004-1
The Analysis of the Thermal Resistance
Structure of LEDs by Measuring Its Transient
Temperature Variation
Wei-Keng Lin
Enginnering System
Science Dept., National
Tsing-Hua Univ.
11:45-12:00
TW065-1
Implement of a Silicon-based LED Packaging
Module with Temperature Sensor
Chingfu Tsou
Department of Automatic
Control Engineering, Feng
Chia University
12:00-12:15
TW132-1
Thermal Design for High Power Arrayed LED
Heat-Dissipating System
HSIANG-CHEN HSU
I-SHOU UNIVERSITY
☆ Outstanding Paper Award Winner
▲
42

46. Sessions
SESSION 19: Modeling, Simulation Design III
Time: 10:30-12:00, Friday, October 25
Chair: Tz-Cheng Chiu (National Cheng Kung University)
Co-Chair: Ben-Je Lwo (National Defense University)
Time
10:30-11:00
Paper
Code
INVITED
TW029-1
Topic
Room: 501
Lead Author
Review on Silver Wire Bonding
Affiliation
Altera Corp.
Charlie Lu
11:00-11:15
TW003-1
Simulations and Characterizations for Stress
Reduction Designs in Wafer Level Chip Scale
Packages
Ming-Che Hsieh
STATS ChipPAC Taiwan
11:15-11:30
AS131-1
Fatigue strength around through hole in
printed circuit board
Takahiro Kinoshita
Toyama Prefectural
University
11:30-11:45
TW149-1
☆
TW048-1
On the Non-Polarity Effects of the Bi/Ni
Interfaces under Current Stressing
Liu Yu-chen
NCKU
Three Dimensional Compression Molding
Simulation for Wafer Level Packaging
Chih-Chung Hsu
National Tsing-Hua
University
11:45-12:00
☆ Outstanding Paper Award Winner
▲
43

47. SESSION 20: HDI Embedded
Time: 10:30-12:00, Friday, October 25
Chair: Eric Hsu (Nan Ya PCB Corp)
Co-Chair: Anderson Cheng (ITEQ)
Time
10:30-11:00
Paper
Code
Topic
INVITED
US113-1
Room: 502
Multi-island platform for realization of
wearable electronics
Lead Author
Affiliation
MC10 Inc.
Yung-Yu Hsu
11:00-11:15
US046-1
Integrated Metallization System for High
Density Interconnects and Modified Semi
Additive processing
Kesheng Feng
MacDermid
11:15-11:30
A Novel Cu Plating Formula for Filling
Through Holes of a PCB
Jhih-Jyun Yan
National Chung Hsing
University
11:30-11:45
TW033-1
☆
TW024-1
Investigation of Through Hole Filling by
Electrolytic Cu Deposition Using Electron
Backscatter Diffraction
Chia-Wei Fan
Yuan Ze University
11:45-12:00
TW157-1
Advanced Thin Copper Electroplating Process
for HDI Microvia Filling Application
Ming-Yao Yen
The Dow Chemical
Company
☆ Outstanding Paper Award Winner
▲
44

48. Posters
POSTER (PCB)
Time: 15:30-15:45, Wednesday, October 23
Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan
Paper
Code
Topic
Lead Author
Affiliation
AS020-1
☆
An efficient rough vacuum chlorinated separation method
for recovery of indium from waste liquid crystal display
panels
En Ma
Shanghai Jiao Tong University
AS117-1
Design and Reliability Analysis of Voltage Reference
Circuit in 180 nm CMOS Process
Yasuhiro Takahashi
Gifu University
EU112-1
Advanced Via Filling for improved Within-Unit
Distribution
Henning Hübner
Atotech Deutschland GmbH
TW005-1
OPTICALLY-INDUCED DIELECTROPHORETIC
TECHNOLOGY FOR PARTICLES MANIPULATION AND
SEPARATION
Chen Hsiu-Hsiang
Industrial Technology Research
Institute
TW027-1
The Failure Investigation of The Polymer Ball Interconnect
Under Board Level Bending Stress
Cheng-Chih Chen
IST-Integrated Service Technology,
Inc.
TW056-1
The Methodology to Monitor Gaseous Contamination in
Data Centers
Dem Lee
IST-Integrated Service Technology
TW059-1
Anisotropic grain growth and crack propagation in
eutectic microstructure under cyclic temperature annealing
in flip-chip SnPb composite solder joints
Yu-Chun Liang
NCTU
TW063-1
When “Signal” meets “Temperature”
Albert Chen
Elite Material Co., Ltd.
TW096-1
Investigation of Interfacial Reactions in the Sn/Fe-xNi
Couple
Yi- Shan Li
National Taiwan University of
Science and Technology
TW100-1
Power density effect on the microstructures and
thermoelectric properties of p-type Bi-Sb-Te
nanocrystalline thin films deposited by RF sputtering
Chen Tai-Sheng
ITRI
TW103-1
☆
PROCESS FEASIBILITY OF A NOVEL DIELECTRIC MATERIAL
IN A CHIP EMBEDDED, CORELESS AND ASYMMETRICALLY
BUILT-UP STRUCTURE
Yu-wei Huang
Industrial Technology Research
Institute
TW111-1
The Investigation of the Inkjet Printing Metallization
Technology on Flexible Substrate
Yan-Yu Nian
National Defense University
TW116-1
The Inkjet Printing of Catalyst Pd Ink for Selective
Metallization Apply to Product Antenna on PC/ABS
Substrate
Po-Chiang Wang
National Defense University
TW128-1
Surface Clean of Readily Oxidized Metals for
Interconnections with Organic Acid Vapor
Shang-Kun Huang
National Chung Hsing University
TW140-1
Electroless Nickel deposition on the hybrid polyimide
Yi-Ling Lo
Industrial Technology Research
Institute
☆ Outstanding Paper Award Winner
▲
45

49. POSTER (PACKAGING)
Time: 15:45-16:00, Thursday, October 24
Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan
Paper
Code
Topic
Lead Author
Affiliation
AS051-1
Characterization and performance study of packaged
micropump for drug delivery
Vinaya kumar K.B
Indian institute of science
AS073-1
Packaging of Polyvinylidene fluoride nasal sensor for
biomedical applications
Roopa Manjunatha
Indian institute of science
EU156-2
Optical Backplane Demonstrator with 10Gbps Video
Transmission Link on Printed Circuit Board Using Optical
Waveguides
Qian Xia
Shanghai University
TW006-1
Thermal Stability of Hydrogen Annealed Aluminum
Doped Zinc Oxide Films Investigated by Thermal
Desorption Spectroscopy
Shang-Chou Chang
Kun Shan University
TW007-1
Parameters Optimization of Electroporation Chip for
Gene Transfection
Yung-Chiang Chung
Ming Chi University of Technology
TW009-1
Nugget Shape Control in Resistance Spot Welding
P. S. Wei
Department of Mechanical and
Electro-Mechanical Engineering,
National Sun Yat-Sen University
TW011-1
WiFi SiP Module Using IPD Rx Balun Applications
Hin-Han Chuang
Siliconware Precision Industries
Co., Ltd
TW031-1
Novel Assembly Framework of Bi-Layered Molding
Materials for 3D-ICs Packaging
Lee Chang-Chun
Department of Mechanical
Engineering, Chung Yuan Christian
University
TW035-1
Thermomigration of Ag in Pb-free SnAg solder joints
Mulaine Shih
National Tsing Hua University
TW042-1
Electrical Model Analysis and Measurement of TSV to
TSV Coupling Capacitance
Yang Shiuan-hau
Siliconware Precision Industries
Co., Ltd.
TW061-1
CU WIRE HAST FAIL MECHANISM INVESTIGATION FOR
BGA PACKAGE
Chih Hung Chang
NXP Semiconductors Taiwan
TW062-1
Cu wire Development for Thin QFN Package using Die
Attach Film (DAF)
Ho-Chin Hsieh
NXP
TW066-1
☆
Interfacial reacions between pure tin and electroplated
copper substrates fabricated using different formulas
Wu Je-Yi
National Chung Hsing University
TW069-1
Film Over Wire (FOW) Selection for Copper Wire
Application
Ming-Wei Lee
NXP Semiconductors Taiwan
TW075-1
Formation of alternating interfacial layers in the Au12Ge/Ni joints
Ming-yueh Tsai
National Cheng Kung University
☆ Outstanding Paper Award Winner
▲
46

50. Posters
Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan
Paper
Code
Topic
Lead Author
Affiliation
TW077-1
Interfacial reaction in Cu/Pb-free solders/Co couples
during reflowing process
Shen Chang Lee
Department of Engineering and
System Science, National Tsing
Hua University
TW078-1
Molded Underfill for Flip Chip Package
Chen Yu-Kai
National Cheng Kung University
Department Of Mechanical
Engineering
TW079-1
Study on thermal conductive BN/VGCF/polyimide resin
composites
Chin Si-Yi
Industrial Technology Research
Institute
TW084-1
Cu Pillar Bump-on-Trace BoT Design for Ultra Low-K
Packaging
Harold Wu
United Microelectronics
Corporation
TW084-2
Bill of Material and Geometry of FCBGA Impacts on
Packaging Warpage
Harold Wu
United Microelectronics
Corporation
TW092-1
An Efficient and Effective Simulation Approach for Solder
Joint Reliability Prediction of Through-Silicon-Via TSV 3D
Integration
Lin Sheng-Chuen
National Tsing Hua University
TW095-1
Effects of Annealing on Sn Whisker Formation: Role of Cu
Alloy Seed Layer
Wahyu Diyatmika
National Taiwan University of
Science and Technology
TW097-1
TSV-less BSI-CIS Wafer-Level Package and Stacked CIS
Module
Zhi-Cheng Hsiao
Industrial Technology Research
Institute
TW102-1
Reflow Heat Source Impact on IMC Formation of Micro
Bump Interconnection for 3D Package
Yi-Chian Liao
Siliconware Precision Industries
Co., Ltd.
TW106-1
Interfacial reactions in microbumps of Ni/SnAg/Cu with
different SnAg thicknesses
Yi Sa Huang
NCTU
TW107-1
UNDERFILL ADHESION ENHANCEMENT VIA
OPTIMIZATION OF PLASMA TREATMENT FOR 3DIC
Chi Tung Yeh
Siliconware Precision Industries
Co., Ltd.
TW110-1
The investigation of dielectric properties measurement
method of packaging materials
Meng-Sheng Chen
ITRI
TW115-1
Fabrication of Robust Polyaniline Thin Film Electrodes
on the Surface of Elastomeric Polydimethylsiloxane for
Polymeric MEMS Applications
Kuan-Hsun Li
National Tsing Hua University
TW115-2
Investigating the Influence of Various Organosilanized
Substrates and Dopant Species on the Properties of
Transparent Polypyrrole Thin Films Deposited on Glass
Surfaces
Kuan-Hsun Li
National Tsing Hua University
▲
47

51. Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan
Paper
Code
Topic
Lead Author
Affiliation
TW143-1
Warpage study of power module
Wei Li
Industrial Technology Research
Institute
TW144-1
High Thermal Conductivity Underfill study for fine pitch
Cu pillar bump
Huang Huei-Nuan
SPIL
TW158-1
The Improvement of Thermoelectric Element and People’s
Livelihood Applications
Kuen-Shan Jaw
Taipei Chengshih University of
Science and Technology
▲
48

52. 20
14
16th International Conference on
Electronic Materials and packaging
IMPACT-EMAP 2014
Save your dates for Oct 22-24, 2014
Taipei, Taiwan
www.impact.org.tw
9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2014)
16th International Conference on Electronics Materials and Packaging (EMAP 2014)