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Poster Paper
Proc. of Int. Conf. on Advances in Signal Processing and Communication 2013

A Simulation Based Analysis of Lowering Dynamic
Power in a CMOS Inverter
Durlabha Chaudhary, Rajesh Yadav, and Neeraj Kr. Shukla
ITM University, Gurgaon, (Delhi-NCR) India
Email: { durlabhachaudhary, rajeshyadav.ece49, neerajkumarshukla}@gmail.com
Abstract— With the increase in demand of high fidelity
portable devices, there is more and more emphasis laying
down on the development of low power and high performance
systems. In the next generation processors, the low power
design has to be incorporated into fundamental computation
units, such as adder. CMOS circuit design plays a crucial role
in designing of these computation units (like adder and
multiplier) so if there is any optimal way to reduce the power
dissipation in CMOS circuits then it will directly lower down
the power dissipation of other circuits and logic gates as well.
In this paper we have studied and analyzed different
techniques to reduce the dynamic power of CMOS circuit
with the help of performing simulation on some significant
factors (i.e device characteristics) of respective circuitry
designs by using Cadence-Virtuoso tool.
Index Terms— Low dynamic power, CMOS circuits, CadenceVirtuoso, Device Characteristics.

Figure 1. Charging of capacitor [1]

I. INTRODUCTION
As the size of the transistors getting reduced with
increased complexity, the power dissipation of the circuit
design has been given an important pace. With billions of
transistors incorporated on single chip, many crucial issues
are emerging at faster rate such as handling the power
consumption by these CMOS circuits. The average power
consumption in CMOS digital is expressed as:
Pavg = Pdynamic+ Pshort-circuit+ Pleakage+ Pstatic

(1)

Our area to work on is to concentrate on reducing the
dynamic power of CMOS. Dynamic power represents the
power dissipated during a switching event i.e. when the output node voltage of a CMOS logic gate makes a logic transition. The switching power is dissipated when energy is drawn
from the power supply to charge up the output node capacitance as shown in Figure 1. During charge up phase, the
output node voltage typically makes a full transition from 0V
to < VDD and one half of the energy drawn from power supply
is dissipated as heat in the conducting PMOS transistors
and no energy is drawn from the power supply during discharging phase yet the energy stored in the output capacitor
during charge up is dissipated as heat in the conducting
NMOS transistors, as the output voltage drops from VDD to >
0V as shown in Figure 2.
The average dynamic power consumption in CMOS logic
circuits:
Pavg = (α Ti x Ci x Vi) VDD x fclock
(2)

Figure 2

node in the circuit, αTi = corresponding node transition factor
associated with the node.
Hence the term in parenthesis represents the total no of
charge which is drawn from the power supply during each
switching event [2] .Since the dynamic power is the most
dominating component of the total power consumption so
reducing its value to a optimum level will bring the design of
circuit to more improvised and modified level.
From Equation(2)[2] it can be analyzed that the average
dynamic power can be decreased by either decreasing VDD or
fclock We are going to discuss and analyze by taking VDD as
parameter to reduce the power dissipation and check out its
influence on complete design. Although the reduction of
power supply voltage significantly reduces the dynamic
power dissipation, the inevitable design trade-off is increase
in of delay.

Where, Ci = parasitic capacitance associated with each
© 2013 ACEEE
DOI: 03.LSCS.2013.3. 526

Discharging of capacitor[1]

72
Poster Paper
Proc. of Int. Conf. on Advances in Signal Processing and Communication 2013

(3)
From Equation (3)[2] we can analyze that the negative
effect of reducing the power supply voltage upon delay can
be compensated for, if the threshold voltage (VT) of transistors is scaled down accordingly.

Figure 4

Figure 3

Norm alised Delay Vs power Supply Voltage[1]

When threshold voltage is scaled down linearly, it allows
the circuit to produce the same speed performance at a lower
VDD but the threshold voltage may be scaled down to some
extent only due to problems arising after that which are sub
threshold voltage or noise margin as shown in Figure 3.

Shematic Diagram for Voltage Bootstrapping

bootstrapping devices. The simulation using Cadence
spectra shows the following results as shown in Table.1 and
in Figure 5.
TABLE I. POWER CONSUMPTION IN VOLTAGE BOOTSTRAPPING T ECHNIQUE
Power

Average
Power (W)

Static
(W)

Power

Values

82.71x10 -6

57.84x10 -12

Dyanamic
Power (W)
~82.71x10 -6

II. TECHNIQUES USED IN REDUCING THE DYANAMIC POWER
A. Voltage Bootstrapping
Voltage Bootstrapping is a very useful technique which
is used to overcome threshold voltage drops in digital circuits.
The operation speed is improvised at low supply voltage
region for driving a large capacitive load by boosting internal
nodes beyond the power supply or below the ground using
a single bootstrap capacitor. Since the charge loss is
eliminated from the bootstrap nodes in this technique, the
bootstrap voltages are more than the conventional CMOS
bootstrap circuit. [3]. Referring to Figure 4, and assuming the
logic ‘0’ at input ‘Vin’, the transistor M1 will turn off and the
output voltage ‘Vout’ will start to rise. This change in the output
voltage level will now be coupled to Vx through the bootstrap
capacitor, Cboot.
Therefore, the transient current Icboot flowing through
the capacitor Cboot is
Icboot = Cboot {d(Vout - Vx)/dt}
(4)
An extra “dummy “ transistor is typically added to increase
the bootstrap capacitance (Cboot). Since, its drain and Source
terminals are connected together, the dummy transistor acts
as an MOS capacitor between Vx and Vout. Although this circuit
arrangement contains two additional transistors to achieve
voltage bootstrapping, the resulting circuit performance
improvement is usually well worth the extras silicon used for
73
© 2013 ACEEE
DOI: 03.LSCS.2013.3.526

B. NORA Logic
In order to maintain high switching speed at low supply
voltages it is necessary to reduce the transistor threshold
voltage, VT, in proportion [4]. For supply voltages much below
1V the value of V, may be just tens or hundreds of millivolts,
and the subthreshold leakage current of these transistors
becomes significant [5].
The main building blocks of NORA technique are shown
in Figure 6. The logic functions are implemented using ntype and p-type dynamic CMOS and C 2MOS blocks.
Conventional (static) CMOS function blocks can also be
eventually employed[6]. As it will further be shown, to
guarantee a fully racefree operation[3] in pipelined circuits,
the storage of information must always be performed by a
C2MOS function block (C 2MOS latch stage). For pulse
voltage 1.8V from clock changing from 0 to 1, the section is in
the precharge phase. The outputs of all the n- and p-dynamic
blocks are precharged to “1” and “0,” respectively. Also during
this phase, the phase section inputs are in a sampling mode,
i.e, these inputs are set up. For phase 1 to 0, the phase section
is in the evaluation phase.The simulation using Cadence
spectra shows the following results as in Table 2 and in Figure
7.
Poster Paper
Proc. of Int. Conf. on Advances in Signal Processing and Communication 2013
TABLE. II. POWER CONSUMPTION IN NORA LOGIC
Power

Average
Power (W)

Static Power
(W)

Dyanamic
Power (W)

Values

1.513x10 -3

48.84x10 -12

~1.513x10-3

threshold region in terms of speed and energy savings[9].In
this technique, two transistors (both pMOS and nMOS ) are
based on two different threshold voltages in the circuit as
shown in Figure 8.

Figure 5

Average Power Consumption in Voltage Bootstrapping
Technique

Figure 6

Schematic Diagram for NORA logic

Figure 8

Schematic Diagram for MTCMOS logic

The result of simulation using Cadence spectra shown in
the Table 3 and in Figure 9.
TABLE III. POWER CONSUMPTION I N MTCMOS LOGIC
Power

Power

2.515x10 -6

7.284x10 -12

Dyanamic
Power (W)
~2.515x10 -6

D. Replacement of MOSFETs with CNTFETs
Nanotechnology is a new field of research that cuts across
many fields – electronics, chemistry, physics, and biology,
that analyses and synthesizes objects and structures in the
Nano scale (10-9 m) such as Nano particles, nanowires, and
Carbon Nanotubes (CNTs)[10]. CNT is one of the several
cutting-edge emerging technologies within nanotechnology
with high efficiency and a wide range of applications in many
different streams of science and technology. Nano-circuits
which are based on CNTs such as CNT Field Effect Transistors (CNTFETs) show big promise of less delay and power

Average Power Consumption in NORA logic

C. Multiple-Threshold CMOS (MTCMOS) Logic
The MTCMOS technique was first introduced in SOI
technology in [7], [8], in which the gate of the MOSFET is
connected to its substrate. MTCMOS shows a lot of
advantages over the conventional CMOS logic in the sub
© 2013 ACEEE
DOI: 03.LSCS.2013.3. 526

Static
(W)

Values

Figure 7

Average
Power (W)

74
Poster Paper
Proc. of Int. Conf. on Advances in Signal Processing and Communication 2013
desired forms, and
 CNT growth is still very expensive due to the low
yield of CNTs.
III. CONCLUSION
Based on the simulation result on various techniques used
to lower down the dynamic power of CMOS design, we have
concluded that Voltage Bootstrapping technique consumes
much power than NORA logic and MTCMOS (MultiThreshold CMOS) techniques and moreover a new design
can be developed by implementing CNT (carbon nano tube)
in channel region in traditional MOSFET structure, which
improves the power consumption behavior of traditional
CMOS structure by nearly 7%.
REFERENCES
Figure 9

[1] Naehyuck Chang, “Power Consumption in Digital Circuits”
Dept. of EECS/CSE Seoul National University,2007.
[2] Sung-Mo Kang,Yusuf Leblebici,”CMOS Digital Integrated
Circuits”,Third Edition,2012.
[3] Kong, Bai-Sun Sun Hyundai MicroElectron., Seoul, South
Korea Kang, Dong-Oh; Jun, Young-Hyun Hyun, “A
bootstrapped CMOS circuit technique for low-voltage
application”,IEEE 1999,pp.289-292.
[4] Nelson F. Goncalves IEEE, Hugo J. De Man,”NORA: A Racefree
Dynamic CMOS Technique for Pipelined Logic
Structures”,IEEE Journal Of Solid-State Circuits, Vol. SC-18,
NO. 3, Jun. 1983.
[5] N. F. Goncalves and H. De Man, “n-p-CMOS: A racefree
dynamic CMOS technique for pipelined logic structures,” in
ESSCIRC Dig. Tech. Papers, Sept. 1982, pp. 141-144.
[6] K. Joseph Hass, Jack Venbrux, Prakash Bhatia,” Logic Design
Considerations for 0.5-Volt CMOS”,NASA Institute of
Advanced Microelectronics University of New
Mexico,IEEE,2001
[7] Azeez J. Bhavnagarwala, Blanca L. Austin, Keith A. Bowman,
and James D. Meindl. A minimum total power methodology
for projecting limits on CMOS GSI. IEEE Transactions on
VLSI Systems, 8(3):235-251, Jun. 2000.
[8] Assaderaghi, F, Parke, S.; Sinitsky, D.; Bokor, J.; Ko, P.K.;
Chenming Hu; “A dynamic threshold voltage MOSFET for
very low voltage operation”, Electron Device Letters, IEEE
Vol. 15, Issue 12, Dec. 1994, pp510 – 512.
[9] Nikhil Jayakumar, Sunil P. Khatri.; “A Predictably Low-Leakage
ASIC Design Style’; IEEE Transactions on Very Large Scale
Integration (VLSI) Systems, Vol. 15, No. 3, Mar 2007.
[10] S.A.EbrahimP.Keshavarzian,M.SalariSardoueyeh,A.Shojaei,B.
Naji Givi ,”Ultra-Low Power and High Speed Full Adder
Based-on CNTFET”,European Journal of Scientific Research
Vol.80 No.3,2012.
[11] Leonardo C. Castro, D. L. John, D. L. Pulfrey , Mahdi Purfath
, Andreas Gehring ,Hans Kosina, Method of Predicting FT for
Carbon Nanotube FETs,IEEE Transaction on Nanotechnology
,Vol.4,Jun 2005.
[12] J. Deng, H.-S. P.Wong, A compact SPICE model for carbonnanotube field-effect transistors including nonidealities and
its application—Part I: Model of the intrinsic channel region,
IEEE Transaction on Electron Device, 2007.

Average Power Consumption in MTCMOS logic

consumption than available silicon-based FETs. Many works
and circuit designs through CNTFET have been proposed
by CNTFET researchers.

Figure 10

Schematic diagram of a CNTFET: (a) Cross section view
(b) top view [10]

According to the simulation results performed by
researchers[11], their CNTFET-based design has 75.01%,
7.76% and 76.92% improvement than MOSFET
implementation in term of delay, average power and PDP
respectively.SWCNT (Figure 10) have many benefits rather
than silicon transistors counterpart such as high density of
on current and moderately high Ion/Ioff ratio that has many
effects on transistors behavior, molecular size, high theoretical
transition frequency and changeable threshold voltage
depending on carbon nanotube diameter which is an
important
characteristic
of
CNTFETs.
Although CNT has been grown into several forms, CNT
use is still limited as compared to other wide spread
technologies [12]. This is mainly due to:
 It is still difficult to exactly control CNT growth into
© 2013 ACEEE
DOI: 03.LSCS.2013.3.526

75

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A Simulation Based Analysis of Lowering Dynamic Power in a CMOS Inverter

  • 1. Poster Paper Proc. of Int. Conf. on Advances in Signal Processing and Communication 2013 A Simulation Based Analysis of Lowering Dynamic Power in a CMOS Inverter Durlabha Chaudhary, Rajesh Yadav, and Neeraj Kr. Shukla ITM University, Gurgaon, (Delhi-NCR) India Email: { durlabhachaudhary, rajeshyadav.ece49, neerajkumarshukla}@gmail.com Abstract— With the increase in demand of high fidelity portable devices, there is more and more emphasis laying down on the development of low power and high performance systems. In the next generation processors, the low power design has to be incorporated into fundamental computation units, such as adder. CMOS circuit design plays a crucial role in designing of these computation units (like adder and multiplier) so if there is any optimal way to reduce the power dissipation in CMOS circuits then it will directly lower down the power dissipation of other circuits and logic gates as well. In this paper we have studied and analyzed different techniques to reduce the dynamic power of CMOS circuit with the help of performing simulation on some significant factors (i.e device characteristics) of respective circuitry designs by using Cadence-Virtuoso tool. Index Terms— Low dynamic power, CMOS circuits, CadenceVirtuoso, Device Characteristics. Figure 1. Charging of capacitor [1] I. INTRODUCTION As the size of the transistors getting reduced with increased complexity, the power dissipation of the circuit design has been given an important pace. With billions of transistors incorporated on single chip, many crucial issues are emerging at faster rate such as handling the power consumption by these CMOS circuits. The average power consumption in CMOS digital is expressed as: Pavg = Pdynamic+ Pshort-circuit+ Pleakage+ Pstatic (1) Our area to work on is to concentrate on reducing the dynamic power of CMOS. Dynamic power represents the power dissipated during a switching event i.e. when the output node voltage of a CMOS logic gate makes a logic transition. The switching power is dissipated when energy is drawn from the power supply to charge up the output node capacitance as shown in Figure 1. During charge up phase, the output node voltage typically makes a full transition from 0V to < VDD and one half of the energy drawn from power supply is dissipated as heat in the conducting PMOS transistors and no energy is drawn from the power supply during discharging phase yet the energy stored in the output capacitor during charge up is dissipated as heat in the conducting NMOS transistors, as the output voltage drops from VDD to > 0V as shown in Figure 2. The average dynamic power consumption in CMOS logic circuits: Pavg = (α Ti x Ci x Vi) VDD x fclock (2) Figure 2 node in the circuit, αTi = corresponding node transition factor associated with the node. Hence the term in parenthesis represents the total no of charge which is drawn from the power supply during each switching event [2] .Since the dynamic power is the most dominating component of the total power consumption so reducing its value to a optimum level will bring the design of circuit to more improvised and modified level. From Equation(2)[2] it can be analyzed that the average dynamic power can be decreased by either decreasing VDD or fclock We are going to discuss and analyze by taking VDD as parameter to reduce the power dissipation and check out its influence on complete design. Although the reduction of power supply voltage significantly reduces the dynamic power dissipation, the inevitable design trade-off is increase in of delay. Where, Ci = parasitic capacitance associated with each © 2013 ACEEE DOI: 03.LSCS.2013.3. 526 Discharging of capacitor[1] 72
  • 2. Poster Paper Proc. of Int. Conf. on Advances in Signal Processing and Communication 2013 (3) From Equation (3)[2] we can analyze that the negative effect of reducing the power supply voltage upon delay can be compensated for, if the threshold voltage (VT) of transistors is scaled down accordingly. Figure 4 Figure 3 Norm alised Delay Vs power Supply Voltage[1] When threshold voltage is scaled down linearly, it allows the circuit to produce the same speed performance at a lower VDD but the threshold voltage may be scaled down to some extent only due to problems arising after that which are sub threshold voltage or noise margin as shown in Figure 3. Shematic Diagram for Voltage Bootstrapping bootstrapping devices. The simulation using Cadence spectra shows the following results as shown in Table.1 and in Figure 5. TABLE I. POWER CONSUMPTION IN VOLTAGE BOOTSTRAPPING T ECHNIQUE Power Average Power (W) Static (W) Power Values 82.71x10 -6 57.84x10 -12 Dyanamic Power (W) ~82.71x10 -6 II. TECHNIQUES USED IN REDUCING THE DYANAMIC POWER A. Voltage Bootstrapping Voltage Bootstrapping is a very useful technique which is used to overcome threshold voltage drops in digital circuits. The operation speed is improvised at low supply voltage region for driving a large capacitive load by boosting internal nodes beyond the power supply or below the ground using a single bootstrap capacitor. Since the charge loss is eliminated from the bootstrap nodes in this technique, the bootstrap voltages are more than the conventional CMOS bootstrap circuit. [3]. Referring to Figure 4, and assuming the logic ‘0’ at input ‘Vin’, the transistor M1 will turn off and the output voltage ‘Vout’ will start to rise. This change in the output voltage level will now be coupled to Vx through the bootstrap capacitor, Cboot. Therefore, the transient current Icboot flowing through the capacitor Cboot is Icboot = Cboot {d(Vout - Vx)/dt} (4) An extra “dummy “ transistor is typically added to increase the bootstrap capacitance (Cboot). Since, its drain and Source terminals are connected together, the dummy transistor acts as an MOS capacitor between Vx and Vout. Although this circuit arrangement contains two additional transistors to achieve voltage bootstrapping, the resulting circuit performance improvement is usually well worth the extras silicon used for 73 © 2013 ACEEE DOI: 03.LSCS.2013.3.526 B. NORA Logic In order to maintain high switching speed at low supply voltages it is necessary to reduce the transistor threshold voltage, VT, in proportion [4]. For supply voltages much below 1V the value of V, may be just tens or hundreds of millivolts, and the subthreshold leakage current of these transistors becomes significant [5]. The main building blocks of NORA technique are shown in Figure 6. The logic functions are implemented using ntype and p-type dynamic CMOS and C 2MOS blocks. Conventional (static) CMOS function blocks can also be eventually employed[6]. As it will further be shown, to guarantee a fully racefree operation[3] in pipelined circuits, the storage of information must always be performed by a C2MOS function block (C 2MOS latch stage). For pulse voltage 1.8V from clock changing from 0 to 1, the section is in the precharge phase. The outputs of all the n- and p-dynamic blocks are precharged to “1” and “0,” respectively. Also during this phase, the phase section inputs are in a sampling mode, i.e, these inputs are set up. For phase 1 to 0, the phase section is in the evaluation phase.The simulation using Cadence spectra shows the following results as in Table 2 and in Figure 7.
  • 3. Poster Paper Proc. of Int. Conf. on Advances in Signal Processing and Communication 2013 TABLE. II. POWER CONSUMPTION IN NORA LOGIC Power Average Power (W) Static Power (W) Dyanamic Power (W) Values 1.513x10 -3 48.84x10 -12 ~1.513x10-3 threshold region in terms of speed and energy savings[9].In this technique, two transistors (both pMOS and nMOS ) are based on two different threshold voltages in the circuit as shown in Figure 8. Figure 5 Average Power Consumption in Voltage Bootstrapping Technique Figure 6 Schematic Diagram for NORA logic Figure 8 Schematic Diagram for MTCMOS logic The result of simulation using Cadence spectra shown in the Table 3 and in Figure 9. TABLE III. POWER CONSUMPTION I N MTCMOS LOGIC Power Power 2.515x10 -6 7.284x10 -12 Dyanamic Power (W) ~2.515x10 -6 D. Replacement of MOSFETs with CNTFETs Nanotechnology is a new field of research that cuts across many fields – electronics, chemistry, physics, and biology, that analyses and synthesizes objects and structures in the Nano scale (10-9 m) such as Nano particles, nanowires, and Carbon Nanotubes (CNTs)[10]. CNT is one of the several cutting-edge emerging technologies within nanotechnology with high efficiency and a wide range of applications in many different streams of science and technology. Nano-circuits which are based on CNTs such as CNT Field Effect Transistors (CNTFETs) show big promise of less delay and power Average Power Consumption in NORA logic C. Multiple-Threshold CMOS (MTCMOS) Logic The MTCMOS technique was first introduced in SOI technology in [7], [8], in which the gate of the MOSFET is connected to its substrate. MTCMOS shows a lot of advantages over the conventional CMOS logic in the sub © 2013 ACEEE DOI: 03.LSCS.2013.3. 526 Static (W) Values Figure 7 Average Power (W) 74
  • 4. Poster Paper Proc. of Int. Conf. on Advances in Signal Processing and Communication 2013 desired forms, and  CNT growth is still very expensive due to the low yield of CNTs. III. CONCLUSION Based on the simulation result on various techniques used to lower down the dynamic power of CMOS design, we have concluded that Voltage Bootstrapping technique consumes much power than NORA logic and MTCMOS (MultiThreshold CMOS) techniques and moreover a new design can be developed by implementing CNT (carbon nano tube) in channel region in traditional MOSFET structure, which improves the power consumption behavior of traditional CMOS structure by nearly 7%. REFERENCES Figure 9 [1] Naehyuck Chang, “Power Consumption in Digital Circuits” Dept. of EECS/CSE Seoul National University,2007. [2] Sung-Mo Kang,Yusuf Leblebici,”CMOS Digital Integrated Circuits”,Third Edition,2012. [3] Kong, Bai-Sun Sun Hyundai MicroElectron., Seoul, South Korea Kang, Dong-Oh; Jun, Young-Hyun Hyun, “A bootstrapped CMOS circuit technique for low-voltage application”,IEEE 1999,pp.289-292. [4] Nelson F. Goncalves IEEE, Hugo J. De Man,”NORA: A Racefree Dynamic CMOS Technique for Pipelined Logic Structures”,IEEE Journal Of Solid-State Circuits, Vol. SC-18, NO. 3, Jun. 1983. [5] N. F. Goncalves and H. De Man, “n-p-CMOS: A racefree dynamic CMOS technique for pipelined logic structures,” in ESSCIRC Dig. Tech. Papers, Sept. 1982, pp. 141-144. [6] K. Joseph Hass, Jack Venbrux, Prakash Bhatia,” Logic Design Considerations for 0.5-Volt CMOS”,NASA Institute of Advanced Microelectronics University of New Mexico,IEEE,2001 [7] Azeez J. Bhavnagarwala, Blanca L. Austin, Keith A. Bowman, and James D. Meindl. A minimum total power methodology for projecting limits on CMOS GSI. IEEE Transactions on VLSI Systems, 8(3):235-251, Jun. 2000. [8] Assaderaghi, F, Parke, S.; Sinitsky, D.; Bokor, J.; Ko, P.K.; Chenming Hu; “A dynamic threshold voltage MOSFET for very low voltage operation”, Electron Device Letters, IEEE Vol. 15, Issue 12, Dec. 1994, pp510 – 512. [9] Nikhil Jayakumar, Sunil P. Khatri.; “A Predictably Low-Leakage ASIC Design Style’; IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 15, No. 3, Mar 2007. [10] S.A.EbrahimP.Keshavarzian,M.SalariSardoueyeh,A.Shojaei,B. Naji Givi ,”Ultra-Low Power and High Speed Full Adder Based-on CNTFET”,European Journal of Scientific Research Vol.80 No.3,2012. [11] Leonardo C. Castro, D. L. John, D. L. Pulfrey , Mahdi Purfath , Andreas Gehring ,Hans Kosina, Method of Predicting FT for Carbon Nanotube FETs,IEEE Transaction on Nanotechnology ,Vol.4,Jun 2005. [12] J. Deng, H.-S. P.Wong, A compact SPICE model for carbonnanotube field-effect transistors including nonidealities and its application—Part I: Model of the intrinsic channel region, IEEE Transaction on Electron Device, 2007. Average Power Consumption in MTCMOS logic consumption than available silicon-based FETs. Many works and circuit designs through CNTFET have been proposed by CNTFET researchers. Figure 10 Schematic diagram of a CNTFET: (a) Cross section view (b) top view [10] According to the simulation results performed by researchers[11], their CNTFET-based design has 75.01%, 7.76% and 76.92% improvement than MOSFET implementation in term of delay, average power and PDP respectively.SWCNT (Figure 10) have many benefits rather than silicon transistors counterpart such as high density of on current and moderately high Ion/Ioff ratio that has many effects on transistors behavior, molecular size, high theoretical transition frequency and changeable threshold voltage depending on carbon nanotube diameter which is an important characteristic of CNTFETs. Although CNT has been grown into several forms, CNT use is still limited as compared to other wide spread technologies [12]. This is mainly due to:  It is still difficult to exactly control CNT growth into © 2013 ACEEE DOI: 03.LSCS.2013.3.526 75