2. Personal details
Name: Van der Helm Date of birth: 23 March 1963
Firstname: Jan Willem Place of birth: Scherpenzeel (Gld)
Address: Andoornweg 72 Nationality: Dutch
Postalcode+city: 5361PD Grave NL E-mail: jwvdhelm@gmail.com
Telephone work: +31 24 359 5229 Mobile phone: +31 651070874
Profile Presentation CONTENTS
Specialism
Ambition and interest
WorkexperienceST-Ericsson/NXP Semi/Philips Semi
Courses/Certificates
Education
Secondaryactivities
Additionalinformation
3. Profile
Very experienced manager who successfully managed:
Suppliers (mostly internal): waferfabs (NXP internal, SSMC, TSMC,
ASMC, ..), test-&assyfabs
Industrial multi-site projects: e.g. process/product/knowledge transfers
(from Europe to Asia), ..
Multi-site and multi-cultural teams: Nijmegen, Hamburg, Zürich,
Kaohsiung (Taiwan), Calamba (Philippines)
Some of my characteristics:
Strong drive for cross functional teamwork
Taking accountability and ownership: making things happen
Analytic, pragmatic, organized, operational and result driven
Always looking for improvements
Self propelled, motivated, energetic
4. Specialism
Very experienced in resizing, rebuilding and motivating teams
20 years project management and supplier management experience
More than 15 years people management experience
At this moment I'm working on getting certificates for black belt and
Prince2
Ambition and interest
I’d like to apply my knowledge and experience of high-tech, multi-
cultural semiconductor industry into another technical environment
building winning and high performance teams.
5. WorkexperienceST-Ericsson/NXP
Semi/Philips Semi
2009 - Present
Engineering Manager BU Audio&Power Peripherals at STE
Responsible for worldwide technical operations of the BU (incl. Supplier
management, ramp-ups, industrial costdown and transfer projects, yield
improvement and testtime reduction):
Department manager of 24 people in Nijmegen and 12 engineers in Calamba
(Philippines)
Implementing Operational Excellence in a >100 M$ Sales organization, making
sure that we can guarantee supply to our customers (e.g. Nokia and Samsung)
continuously and with highest possible margin.
Q1 2009 I’ve integrated 2 engineering teams in Nijmegen (PMU and MM team)
into 1
Over 2009 the integral yield improved about 10% resulting in lower cost and
higher margin
Testtimereduced in 2009 by 30%, which led to lower cost and more capacity
6. WorkexperienceST-Ericsson/NXP
Semi/Philips Semi
2008 - 2008
Engineering&Quality Manager ProductLineMultiMedia at ST-NXP
Wireless
Responsible for worldwide technical operations of the PL (incl. Supplier
management), Quality Improvement Programs (using 8D method) and
Customer Quality Programs:
19 people in Nijmegen, 13 in Zürich, 3 engineers in Kaohsiung (Taiwan) and 4
in Calamba
Implementing Operational Excellence in a 40Meuro R&D organization making
sure that we a ready for rolling out multichip products with 100Mpcs per year
for Nokia
Due to the overall business situation I had to close my Zürich team and resize
the team in Nijmegen in Q4 2008
7. WorkexperienceST-Ericsson/NXP
Semi/Philips Semi
2006 - 2007
Operations&Location Manager BusinessLineAnalogueVideoSystems at
NXP Semiconductors
Responsible for worldwide technical operations of the BL (incl. Supplier
management), Quality Programs and Location Management of the BL in
Nijmegen (since headquarter was in Shanghai):
Managementteamrepresentative in Nijmegen and responsible for all BL STS
people in Nijmegen (designers, engineers, marketeers)
Driving information sharing between BL headquarters in Shanghai and Nijmegen
(e.g. by means of monthly briefings/town meetings)
Resizing Nijmegen site: Jan’07 70 people; Jan’08 40 people
Running Cost Reduction Program (price erosion in market 15% YoY)
Driving roll-out of UOC TOP Qty’07: Q1 0.3M, Q2 1.2M, Q4 5M)
Guarantee supply to our customers (Sony, Samsung, Philips, ...) by enabling dual
sourcing
8. WorkexperienceST-Ericsson/NXP
Semi/Philips Semi
2004 - 2006
Operations Manager BusinessLine Mainstream TV Systems at Philips
Semiconductors
Responsible for worldwide technical operations of the BL (incl. Supplier
management), Quality Programs:
Rolling out/ramping up UOCIII (3rd generation Ultimate OneChip TV) cost down
products and CMOS14NV@SSMC (0.14 μm non-volatile state-of-the-art
technology)
Excellent Operational performance regarding Yield, testtime and quality returns
(TPE value saving in 2004>12 Mio USD)
Type/Process transfer carried out for Painters/C075sOTP from Nijmegen to
Fishkill (USA) and Sherpa/Bimos5 from Nijmegen to Boeblingen (Germany)
Managing worldwide TPE groups (Nijmegen, Hamburg and Kaohsiung): 70
engineers
Maintenance budget 10.5 Mio USD
9. WorkexperienceST-Ericsson/NXP
Semi/Philips Semi
2003 - 2004
Program Manager UOCII (2nd generation Ultimate OneChip TV)
BusinessLine Mainstream TV Systems at Philips Semiconductors
Responsible for realizing cost down version of UOCII and roll out into the
market.
5 different xtals have been developed in 2 new shrink technologies
Cost reduction of 30% has been achieved: 35 Mio USD per year!!
60 Mio yearly runrate production had to be converted into new lower cost
version
50 customers involved worldwide (70% market share): strategy feature/quality
up and cost down
10. WorkexperienceST-Ericsson/NXP
Semi/Philips Semi
2000 - 2003
Groupleader Supplier Based Management BusinessLine Video at Philips
Semiconductors
Responsible for smooth operation and relation with (mainly internal)
suppliers incl. sourcing:
8 supplier managers/engineers, 10 diffusion factories, 6 test factories, 5 assembly
factories
Pushing corrective actions and improvements (e.g. by means of Supplier Ratings)
Support type introductions and industrial produceability investigations
Optimize flows and making sure that capacity is in place (e.g. by type/process
transfers)
Driving Yield Improvement Program
11. WorkexperienceST-Ericsson/NXP
Semi/Philips Semi
1994 - 2001
Groupleader Foundry Support Group BusinessLine Consumer Systems
at Philips Semiconductors
Responsible for smooth operation and relation with (mainly internal)
waferfabs incl. sourcing:
10 diffusion factories; various type/process transfers have been carried out
Yieldresponsibilityfor wafers changed from the business people to the factories
Actively involved in separation of factories from the business groups
12. WorkexperienceST-Ericsson/NXP
Semi/Philips Semi
1991 - 1994
Foundry Interface Manager ProductGroup Consumer IC at Philips
Semiconductors
Responsible for product/process transfers to other waferfabs and marketing
of bimos capacity:
6 diffusion factories; various type/process transfers have been carried out
1989 - 1991
Product Engineer BusinessGroup Application Specific Products at Philips
Semiconductors
Responsible for yield improvement, reporting and purchase contracts with
diffusion foundries
13. Courses/Certificates
Several internal and external classes as listed below:
2010 Black belt, planned for Q2’2010
PRINCE2 Foundation, planned for Q2’2010
PRINCE2 Practitioner, planned for Q2’2010
2007 Operationeel Management, Focus Conferences, 8 lectures at Nyenrode
2006 Leidinggevenaan Professionals, Schouten&Nelissen, 6 days
2003 Coaching for Performance and Growth, DDI, 2 days
2002 Management Development Workshop, Philips internal, 1 day
Performance Appraisal by Coaching, CenturiConsult, 1 day
2001 Performance Appraisal Advanced, CenturiConsult, 1 day
1999 Persoonlijk Efficiency Programma, Weesie Consult, 2 days
PersoonlijkPresenteren, de Baak, 4 days
1998 Finance&Accountingfor non-Financial Managers, Prof. Dr. C.P. Lewy, 3 d
European Quality Award Model Assessor Training, Frits Philips Institute
for Quality Management, 2 d
1996 PQA90 (Philips Quality Award) Auditor Training, Frits Philips Institute for Quality
Management, 2 days
Workshop Influencing skills, Bob Weyant, 2 days
1994 Praktischleidinggeven, Philips internal, 6 days
Workshops on Product Engineering, Thomas Group International, 4 days
WaferfabCycle Time, Thomas Group International, 2 days
14. Courses/Certificates (cont’d)
1994 Yield & Reliability of IC Processes and Products workshops, Philips internal, 1
day
Inzichtin invloed, Bureau Zuidema, 5 days
1992 Bedrijfskundecursus, Philips Internal, 8 days
1991 HBO Halfgeleidertechniek, Philips Internal, 8 days
1988 Opleiding tot Reserve OfficierAcademischGevormd, Koninklijke
Luchtmacht
Education
1981 – 1987 Electrical Engineering
University of Technology “Twente” in Enschede (see diploma)
with specials:
• Graduation assignment at IC technology department on BSIT development
• 6 month practical period in Boston (NeuroMuscular Research Centre)
• Qualification to teach: Mathematics, Physics and Mechanics
15. Secondaryactivities
1975 – now Several sports (volleyball, biking), travelling, music (choir, organ)
1983 – 1985 Secretary and later chairman of CSV “Alpha” (Christelijke
StudentenVereniging)
1988 – now Computer, handhelds, iPod, iPhone
2009 – now Paymaster of VC Dynamo local volleyball club
16. Additionalinformation
ST-Ericsson:
ST-Ericsson is a 50/50 joint venture created by bringing together ST-NXP Wireless and Ericsson Mobile
Platforms, two of the world’s leading wireless semiconductor and platform companies, both with
strong industry heritage. Pre-merger, the businesses individually generated combined pro-forma
revenues of about US$3.6bn in 2008, placing ST-Ericsson among the top players in wireless
semiconductors.
The Company is an industry leader in design, development, and the creation of cutting-
edge mobile platforms and wireless semiconductors. ST-Ericsson is a key supplier to
four of the industry’s top five handset manufacturers, who together represent about 80
percent of global handset shipments, as well as to other exciting industry leaders.
NXP Semiconductors:
NXP is a top 12 semiconductor company founded by Philips more than 50 years ago.
Headquartered in Europe, the company has 29,000 employees working in 30 countries
across the world with a revenue of $5.4 billion. NXP creates semiconductors, system
solutions and software that deliver better sensory experiences in mobile phones,
personal media players, TVs, set-top boxes, identification applications, cars and a wide
range of other electronic devices.
