1. The document discusses ON Semiconductor's communications segment, which generated $395M in revenue in 2012. It provides an overview of key growth drivers like the rising smartphone and tablet market. 2. ON Semiconductor has leading positions in areas like RF tuning, optical image stabilization, and power supplies that are essential for communications devices. It offers a broad portfolio of solutions for enabling hardware differentiation in smartphones and tablets. 3. Key takeaways are that both communications equipment volumes and ON Semiconductor's market opportunity are growing, and it has strong offerings in areas like RF tuning and camera modules that position it well in this segment.

1. 1 • Industry Analyst Day • May 2013
Communications
Niall Shakeshaft
Segment Marketing Manager - Communications

2. 2 • Industry Analyst Day • May 2013
Leading Positions: RF Tuning, Optical Image Stabilization, Power Supplies, Protection, MOSFETs
Smartphone
Tablet
Base Station
Customer Premise Equipment
Enterprise
Routers
Communications Segment
2012 Revenue = $395M (13% of Company Revenue)
Source: iSuppli AMFT, Corporate Marketing
*ON Semiconductor reported Tablet revenue in its Computing Segment for 2012 and prior years.
Key Growth DriversDesign-In Activity (Major OEMs)Market: Smartphone / Tablet*
2012 SAM 2015 SAM CAGR
$3.2B $5.1B 17.0%
BOM Opportunity
 ~$3.50 in 2012  ~$7.50
2012 Average BOM
 ~$0.38
 High smartphone / tablet CAGR
 High resolution cameras
 3G / 4G band fragmentation
drives need for RF tuning
 Power and backlighting for high
resolution, low power displays
+104%

3. 3 • Industry Analyst Day • May 2013
Mobility and Big Data (The Cloud)
Data
Center
CDN
(Enterprise)
Network
Carrier
Network
Devices
Source”: Cisco VIN (May 2012)
• Smartphones and tablets
• Social media
• IP Services VoD/IPTV
• Consumer Cloud Services
• Enterprise virtualization
• M2M ‘Internet of Things’

4. 4 • Industry Analyst Day • May 2013
Smart Devices Continue to Boom
Source: Corporate Marketing Analysis and Estimates. BMO Capital Markets (May 2013), IDC (May 2013)
Key Themes
• Featurephones in terminal decline
• Rise of low-cost segment in
smartphones and tablets
• LTE becoming mainstream
• War of ecosystems; iOS vs
Android vs others
• Margin pressure and integration
Samsung, 32.8
%
Apple, 17.5%
LG, 4.8%Huawei, 4.7%
ZTE, 4.0%
Sony, 3.7%
Lenovo, 3.7%
Nokia, 2.9%
Blackberry, 2.8
%
Yulong/Coolpad
, 2.8%
HTC, 2.0%
Motorola, 1.3%
Others, 17.0%
Smartphone Shipment Share Q1/2013
Apple, 39.60%
Samsung, 17.90
%
ASUS, 5.50%
Amazon, 3.70%
Microsoft, 1.80
%
Others, 31.50%
Tablet Shipment Share Q1/2013

5. 5 • Industry Analyst Day • May 2013
Products for Smartphones and Tablets
• Modular product architectures have largely ‘leveled the
playing field’ in the wireless device industry
– Widely available operating systems (Android, Windows
Phone) and core application processor/chipset platforms
(Qualcomm, Intel, MediaTek, Broadcom…)
• Key to success for device manufacturers is rapid introduction
of differentiated hardware – feature innovation on top of the
chipset
• ON Semiconductor provides a broad portfolio of solutions to
enable hardware differentiation
– Adding new sub-systems, powering them, managing and
protecting interfaces between sub-systems
– Cooperating ahead of market with chipset reference designs

6. 6 • Industry Analyst Day • May 2013
Broad Portfolio for Smartphones/Tablets
Power Tree
ARM based
Apps
Processor
Logic
Logic, Interface &
Discretes
Interface
Optical
Sensor
Camera Module
Lens
FlashFlash Driver
Image
Sensor
Auto Focus
OIS
EE
PR
O
M
MEMs Sensors
Gyro
Compass
Accele-
rometer
Pressure ALS +
Proximity
Sensor
Power Mngmt Unit
RAM
Modem SoC
(BB + RF)
PAM
IPD
DCDC
PA
TunableRF
WLAN/BT/FM/GPS Combos
Touch Display Subsystem
Display
LED Backlight
AMOLED pwr
Touch
Interface
Displ. Driver
Mini PMICDCDCLDO
Load
Switch
High I
DCDC
>5A
Vbat
Mass Storage
EEPROM
NFC
Modem
Secure
Element
Vibra
Motor
Haptics/
Motor Drive
Switch Mode
Charger
ESD/EMI Protn,
Audio
Audio
CODEC/HUB
Speech DSPHeadphone
Speaker/
Earpiece
ANC
OVP/OCPUSB/MHL
Battery Pack
MOSFET
Protection
IC
Vbat
Temp
Sensor
Fuel
Gauge
Wireless Charging
System
Ctrl
Pwr Disc
GSM…WCDMA…
HSPA…LTE
ON Product

7. 7 • Industry Analyst Day • May 2013
RF Tuning Essential for 4G
Globally Fragmented Spectrum Allocation
No. of defined frequency bands by 3GPP release
More Antennae in Smaller Space
Challenging Use Cases
• Antennae performance
related to size
• Cross-coupling,
correlation, SAR
• Dependence between
form factor and antenna
performance
• Carrier emphasis on RF
performance
• Antenna detuning
due to interaction
with head/hand/
environment
LTE-Advanced: First Deployment 2012
• Carrier aggregation:
combination of non-
contiguous spectrum to
create up to 100MHz
channel
• MIMO: Multi-antenna
techniques for higher
data rates, better
coverage
Source: 3GPP, Intel, Apple, ZTE

8. 8 • Industry Analyst Day • May 2013
Differentiated Solution Already Shipping
• Barium Strontium Titanate (BST) capacitors
• Best RF performance of technologies available in volume
• Lower cost than competing technologies
• Simpler implementation – continuous control
Transceiver
Baseband
FEM
PA/Filters/
Switches
PTIC
SPI/MIPI control
HVDAC
PTIC Solution
DCBIAS
RFIN
DCBIAS
RFOUT
capacitors
resistors
resistors
Tunable
capacitor
element
Control IC
ON Product

9. 9 • Industry Analyst Day • May 2013
Strong Presence in Camera Module
Image
Sensor
OIS
AF
EEPROM
AF +
OIS
Lens
Unit
OIS
VCM
AF
VCM
OIS
Position
Camera PMIC LED
flash
MEMs
Gyro
Smartphone Camera Subsystem
• Autofocus already standard in higher-
end smartphones. Transition from open
to closed loop
• Optical Image stabilization becoming
mainstream at 12MP+
• ON Semiconductor (SANYO) with
strong technology for AF and OIS
• Size and performance advantages
developed from long experience in
DSC market
• Strong position in Smartphone Camera
PMICs
• Upstream collaboration with camera
module and actuator vendors essential
ON Product

10. 10 • Industry Analyst Day • May 2013
Optical Image Stabilization
High Megapixels, Low Light
Device
VDD (V) VM (V) PWM
max
CPU
IF
Gyro IF DA AD Package
min max min max
LC898111 2.6 3.6 2.6 3.6 6 MHz
I2C
SPI
I2C / SPI / Analog 8-bit 12-bit WLP48
LC898111A* 2.6 3.6 2.6 3.6 6 MHz
I2C
SPI
I2C / SPI / Analog 10-bit & 8-bit 12-bit WLP48
Benefits
High PWM carrier frequency
Supports Hall and Photo Reflector position sensors
Internal circuit for position sensor
OIS OFF
OIS ON
I2C/SPI
Digital
Gyro IF
LDO
OSC
DA
AD
Equalizer
PWM
ControlLogic
Driver
Position
Sensor
OIS
Gyro
OIS
Actuat
or
CPU
Autofocus Driver Block Diagram

11. 11 • Industry Analyst Day • May 2013
Power Management Components
Core Chipset
Switching Battery
Charger
OVPACDC
Power
Management
Unit
Applications
Processor
Battery
Power
Management
Unit
Modem
Block
E
Block
D
Block
C
LDO
DCDC
Mini PMIC
Block
B
Subsystem A
Multiple different
combinations of DCDC
and LDO available e.g.
Camera PMIC
Single rail power supplies
Medium-scale Integration with fast
design turn-around
Load Switches
Discrete MOSFET
Key components for highly efficient
battery charging and protection
Single and multi-cell
High efficiency, small
package, competitive
pricing
Need to be fast, agile and included in
chipset reference designs
ON Product
Íntegrated Smart
Loadswitches and
EcoSwitches

12. 12 • Industry Analyst Day • May 2013
-5
0
5
10
15
20
25
30
35
40
-20 30 80 130
Voltage(V)
Time (ns)
Common Mode Filters for LTE Phones
800 MHz Common
Mode Rejection
Integrated ESD protection + EMI
filtering
• Integrated ESD protection and EMI filtering high
speed, differential interfaces
• Prevents propogation of common mode interference
into sensitive RF systems and outside of phone
• First all-silicon solution. Saves 40% board space and
has superior ESD clamping performance than discrete
solution
• Less than 1pF capacitance, but strong noise
attenuation from 700MHz to 3GHz parts for internal
and external interfaces USB2.0, MHL, HDMI, MDDI,
MIPI
Robust ESD perforance Excellent Signal Integrity
Suppresses Common Mode
Interference in key LTE band

13. 13 • Industry Analyst Day • May 2013
Infrastructure Equipment Solutions
Complete System Clock Solutions
• New Sub-1ps RMS Jitter PLL’s: PureEdgeTM
• Crystal Oscillator Module Replacement Clocks
• Flexible CMOS PLL Clocks
• Spread-spectrum EMI reduction
Recent launch of specialized ACDC and DCDC components
ASIC, FPGA, power, protection, discretes...

14. 14 • Industry Analyst Day • May 2013
Key Takeaways: Communications
• Equipment volumes and ON Semiconductor SAM are both
growing strongly
• We have a very strong offering for RF tuning
• We are building critical mass within the camera subsystem
• We have one of the broadest and deepest portfolios to
serve this segment as an ’innovation enabler’
• Essential to win sockets in chipset reference designs and
other upstream technology developers