First Level Inc. is a contract electronics manufacturer that offers assembly services and consulting. It has a 10,000 square foot facility with a clean room and capabilities including die attach, wire bonding, and leak testing. First Level works with customers in industries like military, medical, and automotive. It aims to deliver high quality, precision assembly and has processes in place to ensure quality and continuous improvement.

1. first level inc.
Delivering high quality assemblies
First Level Capability Overview

2. Company Profile
• Formerly Electronic Packaging Business Unit of Die-Tech Inc.
(1993-1999)
• Carol Homsy & Nabil Homsy acquired all assets (Jan. 2000)
• 10,000 sq. ft. facility with 4200 sq. ft. dedicated clean room
manufacturing space
– 2,500 Class 100,000
– 1,500 class 10,000
– 200 class 1000
• Total number of employees: 16
• More than half of employees have been with company longer than
10 years.
• 1 trained Six Sigma Black Belt
first level inc.

3. Company Profile
Customers rely on FLI for high quality assembly services, consulting,
package design, and engineering process development.
Target markets require high reliability high precision electronic assembly.
• Military & Aerospace
• Medical
• Automotive
• Photonics & Opto-Electronic
• RF & Microwave
Assembly types vary from manual assembly which require hundreds of
component placements per unit at assembly volumes of hundreds per
month to automated high speed high density LED modules at volumes of
thousands per month.
Common thread is they are all high reliability applications requiring
consistent and high quality assembly techniques
first level inc.

4. Company Profile
Customer Market Breakdown Product Type
Medical
Commercial Contract manufacturing
Military & Aerospace Design services
Automotive Consulting services
Other
• 39 Active customers
• Manufacturing service breakdown 70% consignment, 20% captive, 10% turn-key
• Of these the top 8 have been working with us for more than 5 years
• For most customers First Level is involved in early package design review
first level inc.

5. Core Processes
Die Attach
Wire Bonding
Stud Bumping
Flip Chip Attach
Encapsulation
Hermetic Lid-Sealing
Fine and Gross Leak Testing
Package Assembly
SMT Assembly
Lead Frame Attach, Trim and Form
first level inc.

6. Die Attach
• Two fully automated Datacon APM 2200
• 7000 Placements per hour (5 million per month)
• Capable of 10 µm @ 6σ
• Flip Chip Attach
• Magazine wafer, waffle pack or Gel pack handling capability.
• Programmable Automatic Transportation System
(substrate/boat/carrier)
• volumetric screw pump, time pressure, flip chip, dipping, transfer
• Pattern recognition system
• Theta-Axis rotary bond head. 0-360 deg
• Programmable lighting system
first level inc.

7. Precision Die Placement
SEC 580
• Semi-automatic precision die placement
• Split Vision System
• Heated Stage
• Force up to 10Kg
• Flip Chip Attach
• Thermo Compression Bonding
Precision Aligner
• 3 um alignment precision
first level inc.

8. Wire Bonding
Fully automated gold wire
• X/Y resolution: 2.5 µm
• Bond head resolution: 2.54 µm
• Bonding accuracy: ± 3.5 µm at 1-sigma
• Bonding method: thermosonic
• Bonding speed: 100 ms/wire (STD), 115 ms/wire (loop control)
• Fine pitch capability: 70 µm
• Wire size: 0.9~2.0 mil
Fully automated aluminum wedge
Automated large area bonders
Ribbon bonding
Manual gold and aluminum
60 x
first level inc.

9. Stud Bumping & Flip Chip Attach
Fully automated gold wire bumping
• Full wafers or individual die as small as 0.5mm square
• Bump diameter 45 to 55 µm
• Bump Height 25 to 85 µm
• Bump Pitch 70 um
• Flip Chip Attach using silver filled epoxy, anisotropic
conductive epoxy, or solder alloy.
first level inc.

10. Dispensing
• Fully automated encapsulation processes
• Two in line machines with vision, heated bed and positive
displacement
• Two gantry style machines with large area capability and vision
• Positional accuracy of +/- 1 mil.
• Stamping / pin transfer capability as small as 4 mil dots with
certain materials.
first level inc.

11. Reflow and Epoxy cure
Multiple continuous processes
• Manix TSC1210 – 10 zones, air
• Watkins-Johnson – 5 zones, 10ppm O2
• BTU – 3 zones, N2/H2-N2/Air
• Sikama – 3 zones conduction
• UV with variable lamp intensity 125 – 300 WPI
first level inc.

12. Vacuum Furnace Hermetic Lid Sealing
• DAP 110 by SST
• Die attach & Lid solder sealing
• Vacuum Reflow
• Nitrogen or Forming gas
• Graphite Boat for uniform heat distribution
• Max Temperature up to 900°C
first level inc.

13. Leak Testing
• Fine and Gross leak testing
• ASM 180T
• Per MIL-STD 883
• Meets and exceeds all criteria to perform leak testing in accordance
with MIL-STD-883E Method 1014.9
• Can accurately detect leaks as small as 10-10 mbar. l/s (two
decades better than the mil spec.)
first level inc.

14. Lead Attach / Trim and Form
Lead Frame Attach
• Hydrogen flame reflow for localized lead attach
• Flat and Clip Lead frame attach
• Pitch as small as 0.4mm
Trim & Form
• Precision lead forming per JEDEC specifications
first level inc.

15. Manual Assembly
• Highly skilled and experienced staff accustomed to highly
complex assemblies requiring exacting precision and
consistency.
• Precise component placement; +/- 3um accuracy
• Tedious assembly such as epoxy dotting an array of 425 pads
with size 300 um on 600 um pitch
• High density component placements
first level inc.

16. Design For Manufacturability
• DFSS using DMADV for new processes
– The team at FLI has many years of experience bringing lab scale concepts to full
scale production. We can help define/focus the goals of the product design
keeping the resources focused on the important aspects.
– FLI has a proven track record of “thinking outside the box” which translates into
customer value
– FLI provides design assistance built on “real life” manufacturing experiences,
years of packaging experience, and expert materials knowledge.
– On staff black belt will frame the process with the appropriate SPC to ensure
continuous optimum performance.
• DMAIC for improvement of existing customer processes
– FLI has successfully used this technique to increase process efficiency resulting
in reduced manufacturing costs.
– Project just recently moved to Control phase. The result was an increase of first
pass yields from 18% to 93%.
– FLI worked with customer, suppliers and internal process for this result.

17. Quality
Quality management system complies with ISO 9001:1994
• Documented quality management system that includes a quality
manual, operating procedures and work instructions.
• Management fully supports the QMS through directives, resources and
driving continuous improvement activities
• Identification and Traceability are maintained for each product built
• Process for planning and implementing production activities is
maintained
Process control
• Process monitoring of performance for continuous processes
• Yields are monitored by failure type and frequency which is the driver
for improvement activities
• Quality and reliability are verified by performing various MIL-STD
testing
• Control charts are implemented according to customer requirements
first level inc.

18. Contact:
Matthew H. Foster
Phone: 717-266-2450
Cell: 609-280-0289
Skype: matthew_h_foster
first level Inc.
3109 Espresso Way
York, PA 17406
first level inc.