2. TABLE OF CONTENTS
1. INTRODUCTION
2. APPLICATIONS
3. ADVANTAGES AND DISADVANTAGES
4. CAD TOOLS USED FOR DESIGNING OF MEMS
5. FABRICATION PROCESS
6. MANUFACTURING PROCESS
7. CHALLENGES
8. CONCLUSION
9. REFERENCES
3. 1.INTRODUCTION
MEMS or Micro-Electro Mechanical System is a technique of
combining Electrical and Mechanical components together on a
chip, to produce a system of miniature dimensions.
Integration of a number of micro-components on a single chip
which allows the micro system to both sense and control the
environment.
4. Made up of components between 1 to 100 micrometers in
size
Devices generally range in size from 20 micrometers to a
millimeter.
6. COMPARISON: IC’S VS. MEMS
MEMS
3D complex structures
Doesn’t have any basic building
block
May have moving parts
May have interface with external
media
Functions include
Biological,Chemical,Optical
Packaging is very complex
IC
2D structures
Transistor is basic building block
No moving parts
Totally isolated with media
Only Electrical
Packaging Techniques are well
developed
7. WHAT IS A SENSOR?
A device used to measure a physical
quantity(such as temperature) and
convert it into an electronic signal of
some kind(e.g. a voltage), without
modifying the environment.
What can be sensed?
Almost Everything!!!
Commonly sensed parameters are:
Pressure
Temperature
Flow rate
Radiation
Chemicals
Pathogens
N
S
EW
2 Axis
Magnetic
Sensor
2 Axis
Accelerometer
Light Intensity
Sensor
Humidity
Sensor
Pressure
Sensor
Temperature
Sensor
8. BUT WHY MEMS FOR SENSORS?
smaller in size
have lower power consumption
more sensitive to input variations
cheaper due to mass production
less invasive than larger devices
9. 2. APPLICATIONS
• A MEMS is a device that can be
implanted in the human body.
• MEMS surgical tools provide the
flexibility and accuracy to perform
surgery.
• In medicine
• Biomems
Bio-mems are used to refer to the science
and technology of operating at the micro
scale for biological and biomedical
applications.
10. • In automotives :
• As gyroscope:
Heavy use of mems is found in air
bag systems, vehicle security
system, inertial brake lights,
rollover detection, automatic door
locks etc.
Inexpensive vibrating structure
gyroscopes manufactured with
mems technology have become
widely available. These are
packaged similarly to other integrated
circuits and may provide either analog
or digital outputs.
11. • In microphones:
Micro-electro mechanical system (MEMS)
technology help projectiles to reach their
targets accurately.
• In military :
The mems microphone also called
as microphone Chip is widely used
in the present day communication
world.
12. 3. ADVANTAGES AND
DISADVANTAGES
Minimize energy and
materials.
Improved
reproducibility.
Improved accuracy
and reliability.
Increased selectivity
and sensitivity.
Farm establishment
requires huge
investments.
Micro-components are
costly compared to
macro components.
Design includes very
much complex
procedures
13. 4 DESIGN TOOLS :CAD
In MEMS technology, CAD is defined as a
tightly organized set of cooperating computer
programs that enable the simulation of
manufacturing processes, device operation and
packaged Microsystems behavior in a
continuous sequence, by a Microsystems
engineer.
14. COMMERCIALLY AVAILABLE
SOFTWARE
Coventorware from Coventor
http://www.memcad.com
IntelliSuite from Intellisense Inc. (Corning)
http://www.intellisense.com
MEMS ProCAETool from Tanner Inc.
http://www.tanner.com
MEMScap from MEMScap Inc.
http://www.memscap.com
SOLIDIS from ISE Inc.
http://www.ise.com
15. EXAMPLE: INTELLISUITE
ADVANTAGES
• Design for manufacturability
– Fabrication database
– Thin-film materials engineering
– Virtual prototyping
• Ease of use
– Consistent user interface
– Communication with existing tools
• Accuracy
– MEMS-specific meshing and analysis engines
– In-house code development
– Validated by in-house MEMS designers
16. 5. FABRICATION PROCESS
Deposition Patterning Etching
Physical Chemical Lithography Wet Dry
Photolithography
Electron beam lithography
Ion beam lithography
Ion track technology
X-ray lithography.
17.
18. DEPOSITION
MEMS deposition technology can be classified in two
groups:
1. Depositions that happen because of a chemical reaction:
Chemical Vapour Deposition (CVD)
Electro deposition
Epitaxy
Thermal oxidation
2. Depositions that happen because of a physical reaction:
Physical Vapour Deposition (PVD)
Casting
19. PATTERNING
Patterning of MEMS is the transfer of a pattern into a
material.
Lithography is a widely used process
Examples of lithography are– Photolithography, Electron
beam lithography, Ion beam lithography, Ion track
technology, X-ray lithography.
21. ETCHING
Etching is the process of using strong acid to cut the
unprotected parts of a metal surface to create a design in.
There are two classes of etching processes:
Wet Etching
Dry Etching.
23. BULK MICROMACHINING
This technique involves the
selective removal of the
substrate material in order to
realize miniaturized mechanical
components.
A widely used bulk
micromachining technique in
MEMS is chemical wet
etching, which involves the
immersion of a substrate into a
solution of reactive chemical
that will etch exposed regions
of the substrate at very high
rates.
Etched grooves using
(a) Anisotropic etchants,
(b) Isotropic etchants,
(c) Reactive Ion Etching
26. LIGA PROCESS
LIGA is a German acronym standing for lithography,
galvanoformung (plating) and abformung (molding).
Polymethyl methacrylate (PMMA) is applied as photoresist to the
substrate by a glue-down process.
28. 8. CONCLUSION
MEMS promises to be an effective technique of producing
sensors of high quality, at lower costs.
Thus we can conclude that the MEMS can create a proactive
computing world, connected computing nodes automatically,
acquire and act on real-time data about a physical environment,
helping to improve lives, promoting a better understanding of
the world and enabling people to become more productive.
29. 9. REFERENCES
Christian A. Zorman, Mehran Mehregany, MEMS Design and
Fabrication, 2nd Ed. 2,16.
Ms. Santoshi Gupta, MEMS and Nanotechnology IJSER, Vol 3,
Issue 5,2012
R. Ghodssi, P. Lin (2011). MEMS Materials and Processes
Handbook. Berlin: Springer.
Chang, Floy I. (1995).Gas-phase silicon micromachining with
xenon difluoride. 2641. pp. 117.
. Micromechanics and MEMS: Classic and Seminal Paper to
1990, Trimmer, W.S., IEEE Press, New York, NY, 1997.
Journal of Microelectromechanical Systems
(http://www.ieee.org/pub_preview/mems_toc.html)
30. University of Stanford,
http://www.stanford.edu/group/SML/ee321/ho/MEMS-01-
intro.pdf
Trimmer, W.S., Micromechanics and MEMS: Classic and
Seminal Papers to 1990, IEEE Press, New York, NY, 1997.
Tjerkstra, R. W., de Boer, M., Berenschot, E., Gardeniers,
J.G.E., van der Berg, A., and Elwenspoek, M., Etching
Technology for Microchannels, Proceedings of the 10th Annual
Workshop of Micro Electro Mechanical Systems (MEMS ’97),
Nagoya, Japan, Jan. 26-30, 1997, pp. 396-398.