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INTEGRATED      CIRCUITS BY-: RANJAN KUMAR              B-tech{ece}               2nd sem 1
Contents  5 1 ABOUT ICS HISTORY 2 CATEGORIES OF ICS 3 TYPES OF ICS 4 DETAILS IN SLIDE ……………………………………………………….. 2 RANJAN KUMAR   10907637
Integrated Circuits are usually called ICs or chips. A complex set of electronic components and their interconnections that are imprinted onto                                           a tiny slice                                   of semiconducting                                  material. Integrated circuit: 3 RANJAN KUMAR   10907637
WHAT ARE INTEGRATED CIRCUIT Ics is one of the basic component of every electronic device.  Ics consists of active as well as passive components. Ics had revolutionized the              world of electronics. It increases the speed                        and   functioning of                         electronic devices. 4 RANJAN KUMAR   10907637
ABOUT 1st  IC’s ,[object Object]
He put together few transistors,capacitors, linking them with a thin layer of germanium, a semiconducting materialThe World First  Ics or chip 5 RANJAN KUMAR   10907637
THE WORLD 1st Ics with silicon chip Ics with                                      “silicon chip”        6 RANJAN KUMAR   10907637
MAIN COMPONENTS OF ICs TRANSISTOR Title CAPACITOR Title RESISTOR Title An Ics have million of microscopic  elements, but most vital componentsare D DIODE 7 RANJAN KUMAR   10907637
Diagram 1 3 ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. 8 RANJAN KUMAR   10907637
Diagram 1 ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. 9 RANJAN KUMAR   10907637
Categories of ICsbased on “Packing Density” SSI MSI ULSI LSI VLSI SLSI 10 RANJAN KUMAR   10907637
SHORT  DETAILS LOGIC GATES SSI     =1-12                  =1- 50 1  DEVICES ULSI <1O,000 MSI                  =12-100            =50- 5000 1 CRORE- 10 CRORE <1 LAKHS <10CRORES SLSI =<100    =5000-1 LAKHS =1000-10,000 =1 LAKHS-1 CRORE LSI VLSI 11 RANJAN KUMAR   10907637
 ON THE BASIS OF PACKING    ICS ARE OF THREE TYPES  DIP FLAT PACK IC CAN SHAPE IC 12 RANJAN KUMAR   10907637
1 3 ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. PICTORIAL DIAGRAM OF DIP 13 RANJAN KUMAR   10907637
 PICTORIALDIAGRAM OF FLAT PACK ICS 1 ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. 14 RANJAN KUMAR   10907637
PICTORIAL DIAGRAM OF IC CAN 1 3 Inc. 15 RANJAN KUMAR   10907637
ABOUT  PINOUT Nr.NamePurpose 1GNDGround, low level (0 V) 2TRIGA short pulse high-to-low on the trigger starts the timer 3OUT During a timing interval, the outputstaysat +VCC 4RESETA timing interval can be interrupted by applying a reset pulse to low (0 V) 5CTRLControl voltage allows access to the internal voltage divider (2/3 VCC) 6THRThe threshold at which the interval ends (it ends if the voltage at THR is at least 2/3 VCC) 7DISConnected to a capacitor whose discharge time will influence the timing interval 8V+, VCC The positive supply voltage which must be between 3 and 15 V EG: 555 16 RANJAN KUMAR   10907637
Types of ICs   1.Analog INTEGRATED  CIRCUITS 2.Digital 3.Mixed Signal 17 RANJAN KUMAR   10907637
WHY WE NEED ICs FOR MAKING COMPLEX  DEVICES IMPROVED PERFORMANCE LOW POWER  CONSUMPTION EASY TO REPAIR 18 RANJAN KUMAR   10907637
REASONS FOR MAKING COMPLEX DEVICES  Like LAPTOP ,PALMTOP, MOBILE etc.. LOW POWER CONSUMTION                                      If we use different  transistor, capacitor, diode, resistor separately it require large amount of voltage while the use Ics reduces this voltage consumption . 19 RANJAN KUMAR   10907637
REASONS EASY TO REPAIR: In case IC get damage, we can easily change it instead of changing each components separately. IMPROVED PERFORMANCE: Performance is increased due                                                                  to high                                                      speed and                                       efficiency. 20 RANJAN KUMAR   10907637
Advantage of Ics 1.SMALL IN SIZE 2.LOW COST Advantage 3.VERY LOW WEIGHT      4. EASY  REPLACEMENT 5.LESS POWER TO OPERATE 21 RANJAN KUMAR   10907637
DISADVANTAGE OF “ICS” COSTLY TO  REPLACE PRECIOUS TO  MAKE ICs MANY PINS  ARE USED  Title Add your text 22 RANJAN KUMAR   10907637
Why silicon is preferred over germanium SILICON GERMANIUM Less cost High cost GROUP 4   Operate>200cels. . Operate<=100cels. High M.P Low M.PS CONCEPT 23 RANJAN KUMAR   10907637
USES Ics are used in all branches of electronics. EG: Printing machines             Computer INDUSTRIAL CONTROL  EG: Cellphones,                COMMUNICATION SYSTEM Fax machine  EG: Buzzer,                               water indicator  ELECTRONICS INSTRUMENTS EG:  Detection and              measurement of protiens MEDICAL 24 RANJAN KUMAR   10907637
LATEST CHIP USED NOW A DAYS IT,S  NOTHING BUT CARBON CHIP CHIP MANUFATURED ON DIAMOND STRUCTURAL CARBON WAFER MAJOR COMPONENT ARE CARBON NANOTUBE USING “C” DIAMOND CHIP 25 RANJAN KUMAR   10907637
       WHY DIAMOND CHIP REPLACES  SILICON CHIP  WORK AT HIGH SPEED WORK AT  HIGH TEMP. SMALLER  IN SIZE D<S<G D>s>G “C” CHIP>200CEL 26 RANJAN KUMAR   10907637
GROWTH IN Ics CHIP  Text GERMANIUM CHIP 1950 SILICON CHIP 1961  DIAMOND CHIP 1991 27 RANJAN KUMAR   10907637
FUNDMENTAL UNIT OF ELETRONICS DEVICES DIAMOND CHIP IS  METAL CHIP ICS ICS INCRESES SPEED & EFFECIENCY DIAMOND CHIP  LATEST CHIP REVOLUTION IN  FIELD OF ELETRONICS ICS CONSISTS OF MANY MICRO DEVICES  CONCLUSION 28 RANJAN KUMAR   10907637

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I cs

  • 1. INTEGRATED CIRCUITS BY-: RANJAN KUMAR B-tech{ece} 2nd sem 1
  • 2. Contents 5 1 ABOUT ICS HISTORY 2 CATEGORIES OF ICS 3 TYPES OF ICS 4 DETAILS IN SLIDE ……………………………………………………….. 2 RANJAN KUMAR 10907637
  • 3. Integrated Circuits are usually called ICs or chips. A complex set of electronic components and their interconnections that are imprinted onto a tiny slice of semiconducting material. Integrated circuit: 3 RANJAN KUMAR 10907637
  • 4. WHAT ARE INTEGRATED CIRCUIT Ics is one of the basic component of every electronic device. Ics consists of active as well as passive components. Ics had revolutionized the world of electronics. It increases the speed and functioning of electronic devices. 4 RANJAN KUMAR 10907637
  • 5.
  • 6. He put together few transistors,capacitors, linking them with a thin layer of germanium, a semiconducting materialThe World First Ics or chip 5 RANJAN KUMAR 10907637
  • 7. THE WORLD 1st Ics with silicon chip Ics with “silicon chip” 6 RANJAN KUMAR 10907637
  • 8. MAIN COMPONENTS OF ICs TRANSISTOR Title CAPACITOR Title RESISTOR Title An Ics have million of microscopic elements, but most vital componentsare D DIODE 7 RANJAN KUMAR 10907637
  • 9. Diagram 1 3 ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. 8 RANJAN KUMAR 10907637
  • 10. Diagram 1 ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. 9 RANJAN KUMAR 10907637
  • 11. Categories of ICsbased on “Packing Density” SSI MSI ULSI LSI VLSI SLSI 10 RANJAN KUMAR 10907637
  • 12. SHORT DETAILS LOGIC GATES SSI =1-12 =1- 50 1 DEVICES ULSI <1O,000 MSI =12-100 =50- 5000 1 CRORE- 10 CRORE <1 LAKHS <10CRORES SLSI =<100 =5000-1 LAKHS =1000-10,000 =1 LAKHS-1 CRORE LSI VLSI 11 RANJAN KUMAR 10907637
  • 13. ON THE BASIS OF PACKING ICS ARE OF THREE TYPES DIP FLAT PACK IC CAN SHAPE IC 12 RANJAN KUMAR 10907637
  • 14. 1 3 ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. PICTORIAL DIAGRAM OF DIP 13 RANJAN KUMAR 10907637
  • 15. PICTORIALDIAGRAM OF FLAT PACK ICS 1 ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. ThemeGallery is a Design Digital Content & Contents mall developed by Guild Design Inc. 14 RANJAN KUMAR 10907637
  • 16. PICTORIAL DIAGRAM OF IC CAN 1 3 Inc. 15 RANJAN KUMAR 10907637
  • 17. ABOUT PINOUT Nr.NamePurpose 1GNDGround, low level (0 V) 2TRIGA short pulse high-to-low on the trigger starts the timer 3OUT During a timing interval, the outputstaysat +VCC 4RESETA timing interval can be interrupted by applying a reset pulse to low (0 V) 5CTRLControl voltage allows access to the internal voltage divider (2/3 VCC) 6THRThe threshold at which the interval ends (it ends if the voltage at THR is at least 2/3 VCC) 7DISConnected to a capacitor whose discharge time will influence the timing interval 8V+, VCC The positive supply voltage which must be between 3 and 15 V EG: 555 16 RANJAN KUMAR 10907637
  • 18. Types of ICs 1.Analog INTEGRATED CIRCUITS 2.Digital 3.Mixed Signal 17 RANJAN KUMAR 10907637
  • 19. WHY WE NEED ICs FOR MAKING COMPLEX DEVICES IMPROVED PERFORMANCE LOW POWER CONSUMPTION EASY TO REPAIR 18 RANJAN KUMAR 10907637
  • 20. REASONS FOR MAKING COMPLEX DEVICES Like LAPTOP ,PALMTOP, MOBILE etc.. LOW POWER CONSUMTION If we use different transistor, capacitor, diode, resistor separately it require large amount of voltage while the use Ics reduces this voltage consumption . 19 RANJAN KUMAR 10907637
  • 21. REASONS EASY TO REPAIR: In case IC get damage, we can easily change it instead of changing each components separately. IMPROVED PERFORMANCE: Performance is increased due to high speed and efficiency. 20 RANJAN KUMAR 10907637
  • 22. Advantage of Ics 1.SMALL IN SIZE 2.LOW COST Advantage 3.VERY LOW WEIGHT 4. EASY REPLACEMENT 5.LESS POWER TO OPERATE 21 RANJAN KUMAR 10907637
  • 23. DISADVANTAGE OF “ICS” COSTLY TO REPLACE PRECIOUS TO MAKE ICs MANY PINS ARE USED Title Add your text 22 RANJAN KUMAR 10907637
  • 24. Why silicon is preferred over germanium SILICON GERMANIUM Less cost High cost GROUP 4 Operate>200cels. . Operate<=100cels. High M.P Low M.PS CONCEPT 23 RANJAN KUMAR 10907637
  • 25. USES Ics are used in all branches of electronics. EG: Printing machines Computer INDUSTRIAL CONTROL EG: Cellphones, COMMUNICATION SYSTEM Fax machine EG: Buzzer, water indicator ELECTRONICS INSTRUMENTS EG: Detection and measurement of protiens MEDICAL 24 RANJAN KUMAR 10907637
  • 26. LATEST CHIP USED NOW A DAYS IT,S NOTHING BUT CARBON CHIP CHIP MANUFATURED ON DIAMOND STRUCTURAL CARBON WAFER MAJOR COMPONENT ARE CARBON NANOTUBE USING “C” DIAMOND CHIP 25 RANJAN KUMAR 10907637
  • 27. WHY DIAMOND CHIP REPLACES SILICON CHIP WORK AT HIGH SPEED WORK AT HIGH TEMP. SMALLER IN SIZE D<S<G D>s>G “C” CHIP>200CEL 26 RANJAN KUMAR 10907637
  • 28. GROWTH IN Ics CHIP Text GERMANIUM CHIP 1950 SILICON CHIP 1961 DIAMOND CHIP 1991 27 RANJAN KUMAR 10907637
  • 29. FUNDMENTAL UNIT OF ELETRONICS DEVICES DIAMOND CHIP IS METAL CHIP ICS ICS INCRESES SPEED & EFFECIENCY DIAMOND CHIP LATEST CHIP REVOLUTION IN FIELD OF ELETRONICS ICS CONSISTS OF MANY MICRO DEVICES CONCLUSION 28 RANJAN KUMAR 10907637
  • 30. THAT’S ALL ! 29