SPIE 8169_12, Optical Design Conference Marseille, Wafer-Level Micro-Optics, Sept 7, 2011
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The document discusses the history and development of micro-optics manufacturing from the 19th century to present day. Key developments include the use of microlenses in color photography in the 1920s, the application of semiconductor manufacturing techniques to micro-optics starting in the 1960s, and the current trend toward wafer-level micro-optics processing and packaging. SUSS MicroOptics is highlighted as a leading supplier of high-quality micro-optics manufactured using 8-inch wafer technology.
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SPIE 8169_12, Optical Design Conference Marseille, Wafer-Level Micro-Optics, Sept 7, 2011
- 1. Wafer-Level Micro-Optics: Trends in Manufacturing, Testing and Packaging Reinhard Voelkel, Kenneth J. Weible, Martin Eisner SUSS MicroOptics SA, Neuchâtel, Switzerland voelkel@suss.ch, www.suss.ch SPIE 8169-12
- 2. SUSS MicroOptics – We Set The Standards World leading supplier of high-quality Micro-Optics More than 200 active customers Part of the SUSS MicroTec Group (www.suss.com) Neuchâtel, Switzerland SUSS MicroOptics is “Preferred Supplier” for Carl Zeiss SMT DUV Laser Beam Shaping Solutions for ASML Litho Stepper
- 3. Industrial optics manufacturing started around 1840 Source: www.wikipedia.org
- 4. Microscopy and photography were the technology drivers. Cameras and binoculars were the first optical consumer products. Micro-Optics was not an issue.
- 5. Gabriel Lippmann (1845 – 1921) 1891 Interference Color Photography Wavelength-selective volume holograms 1908 Integral photography Auto-stereoscopic method to display 3D images for observation with the naked eye 1908 Nobel Prize Source: www.wikipedia.org, www.google.com/patents
- 6. Walter R. Hess: Stereoscope Images 1912 Parallax Panoramagrams Array of cylindrical microlenses for 3D displays Working as a doctor (Ophthalmologist) Nobel prize for Physiology Source: www.google.com/patents
- 7. Microlens Arrays for Color Photography 1925 “Gaffered film” Paul Fournier Microlens arrays on film to separate the color US Patent 1,746,584, Source: www.google.com/patents
- 8. Köhler Integrator – Fly‘s Eye Illumination Source: www.wikipedia.org, www.google.com/patents
- 9. Many Innovative Ideas for Micro-Optical Systems US Patent 1762932, Mihalyi, Fly‘s Eye Condensor for Projector, 1927 US Patent 2018592, Arnulf, 1932 US 2351034 Garbor „Superlens“, 1940 Source: www.wikipedia.org, www.google.com/patents
- 11. Maurice Bonnet (1907 – 1994) ww2.cnam.fr Maurice Bonnet and the lathe used to engrave lenticular screens for integral photography* *Photo: Coll. Michèle Bonnet from Michel Frizot, “Lenticular screen systems and Maurice Bonnet’s process”, from catalog of exhibition “Paris in 3D” at Musée Carnavalet, ISBN: 1861541627 (2000) Source: www.wikipedia.org
- 12. Jean Hoerni (1924 – 1997): “Planar Process” 1959 Fairchild Semiconductor Jean Hoerni at Fairchild 1963 First Karl Süss Mask Aligner Source: www.wikipedia.org, www.google.com/patents
- 13. Computer Generated Holograms Digital Optics Planar Optics Source: www.wikipedia.org
- 14. Micro-Optics Technology 1971 Josef Hanak, dry etching of holograms 1977 Mike Gale, multi-level diffractive optics 1982 Kenichi, stacked planar optics Stacked planar micro-optics 1985 Zoran Popovich, melting resist microlenses Melting resist microlenses Dry-etching of holograms in glass Multi-Level DOE Source: www.google.com/patents
- 15. Ideas and micro-structuring technology developed in Semiconductor industry enabled Micro-Optics manufacturing. Wafer-Level Micro-Optics!
- 16. Wafer: SEMI Standards 3-inch (76 mm) 4-inch (100 mm) 150 mm (referred to as "6 inch") 200 mm (referred to as "8 inch") 8’’ Wafer-Technology 300 mm (referred to as "12 inch") Mask Aligner Coater Plasma Etch Wafer Bonder
- 17. PHOTORESIST PROCESSING A thick resist layer Photolithography Resist cylinders Melting at 150°C.
- 18. REACTIVE ION ETCHING Reactive Ion Etching (RIE) Profile shaping by changing etch ratio Aspherical profiles with high precision
- 19. Metrology for Micro-Optics Manufacturing Phase profile of a densely packed array of 16-level DOEs measured in white light profilometer Wyko NT3300
- 20. Aspherical Microlenses in Fused Silica Asphere, conic constant k = -1 Comparison of measured lens profile (blue line) to ideal lens profile (dotted line) for a microlens of 1.08mm lens diameter and 93µm sag height etched in Fused Silica.
- 21. Aspherical Microlenses in Fused Silica Deviation of measured lens profile, expressed by a 12th degree polynomial fit, versus the ideal lens profile. A deviation of 154.8nm (rms) from ideal lens profile is obtained.
- 22. Uniformity of Photoresist ±0.61% (p-v)
- 23. High-Quality Diffractive Optical Elements (DOE) 8‘‘ wafer scale 190nm to 10µm wavelength range 0.5 μm min feature size < 50nm overlay accuracy Binary, 8-level, 16-level Upto 98% diffraction efficiency
- 24. Hybrid Micro-Optics on Wafer-Level Refractive Microlens Arrays Diffractive Optical Elements (DOE) Trenches, posts, grooves, holes Full wafer-level integration
- 25. Hybrid Micro-Optics for Fiber Communication Micro-Optical Fiber Coupler for communication industry (ROADM, WSS, Transceiver...) High-quality Micro-Optics for most competitive prices due to 8’’ wafer manufacturing
- 26. Packaging concepts for systems! Wafer-Level Packaging (WLP) Wafer-Level Camera (WLC) Scheme: Patent WO 2007 030226 Source: Fraunhofer IOF (Jena), www.wikipedia.org, www.google.com/patents
- 27. Wafer-Level Camera (WLC) Thin wafer handling Lens Imprint Litho (SMILE) Wafer-Level Packaging (WLP) SUSS MicroTec Mask Aligner: MA/BA8 Gen3 © IOF Lens Master Thin Wafer Handling Imprint Lithography Wafer-Level Packaging Wafer Dicing Reinhard Voelkel, Martin Eisner, SUSS © Awaiba
- 28. Micro-Camera for CMOS imagers Wafer-Level Packaging (WLC) NanEye WLC Camera (Awaiba) for disponible endoscopes German Research Project COMIKA (2008-2011) Source: COMIKA, www.awaiba.com
- 29. Ultra-Flat Cluster Cameras WALORI (2002 – 2005) ? Jacques W. Duparre, Peter Schreiber, Peter Dannberg, Toralf Scharf, Petri Pelli, Reinhard Voelkel, Hans-Peter Herzig and Andreas Braeuer, "Artificial compound eyes: different concepts and their application for ultraflat image acquisition sensors", Proc. SPIE 5346, 89 (2004); doi:10.1117/12.530208 Source: Fraunhofer IOF (Jena), www.wikipedia.org
- 30. Micro-Optics in Front-End Lithography Customized Illumination Pupil Shaping (DOE) Now: FlexRay™ programmable illumination technology from ASML Customized Illumination Excimer Laser (193nm) Laser Beam Shaping Laser Beam Homogenizing Diffractive Optical Elements (DOE) MEMS Mirror Arrays (FlexRay™) Key Enabling Technology Microlens Köhler Homogenizer Source: ASML, Nikon, Canon; www.google.com/patents
- 31. Advanced Mask Aligner Lithography (AMALITH) Library of Illumination Filter Plates (IFP) Microlens Array MO Exposure Optics (patent pending) Microlens Optical Integrators Optical System MA 200
- 32. AMALITH: Pinhole Talbot Lithography IFP Simple pattern change with pixelated Illumination Filter Plate (IFP) SUSS Mask Aligner MA6 + MO Exposure Optics + Customized Illumination + Pinhole Mask + Proximity Gap 66µm Pinhole Lithography Multiple „Camera Obscura“ Full-wafer proximity lithography suitable for periodic structures. 33
- 33. AMALITH: Pinhole-Talbot Lithography Flowers 4 µm Pitch 5 µm Resist 2 µm thick Etching RIE (Bosch) Silicon Proximity Gap 102 µm Mask Aligner MA8/BA6 0.8 µm 34
- 34. AMALITH: Half-Tone Lithography SUSS Mask Aligner MA6 T. Harzendorf, L. Stuerzebecher, U. Vogler, U.D. Zeitner, R. Voelkel, “Half-tone proximity lithography”, Photonics Europe, Conf. on Micro- + MO Exposure Optics optics Fabrication Technologies, 7716-34, April 12-16, 2010 + Customized Illumination + Half-tone photomask* + Proximity Litho, Gap 10µm *Half-tone photomask (dot-size 450nm), E-Beam written
- 35. AMALITH: Blazed Gratings on Wafer-Level T. Harzendorf, L. Stuerzebecher, U. Vogler, U.D. Zeitner, R. Voelkel, “Half-tone proximity lithography”, Photonics Europe, Conf. on Micro- optics Fabrication Technologies, 7716-34, April 12-16, 2010
- 36. Solutions for Semiconductor Technology Industrial Optics & Vision Healthcare & Life Science Metrology Laser & Material Processing Optical Communication
- 37. High-Quality MicroOptics in Wafer-Technology Refractive (ROE) Key Enabling Equipment Technology Semiconductor, Microlens Arrays Photolithography, Fiber Coupler Illumination Systems Diffractive (DOE) Communication Telecom, Datacom, Fiber Beam-Shaping Elements Optics, Transceiver, Mode Scrambler Switches, Camera, MEMS Packaging Optics, Life Science Optical Instruments, 8’’ Wafer Technology Confocal Microscopy, Wafer-Level Packaging Healthcare, Laser Systems, Pin-Holes, Crosses, Marks Sensors, Metrology
- 38. SUSS. Our Solutions Set Standards SUSS MicroOptics SA Rue Jaquet-Droz 7 CH-2000 Neuchâtel Switzerland Tel +41-32-720-5104 Fax +41-32-720-5713 info@suss.ch