Technology of chemical-mechanical polishing of material surfaces

1. Research &
Development
Solway
Open company «Solway» was created in 2011 by Russian
specialists in the field of electrochemistry and physico-
chemical engineering in Moscow. The company works to
develop high technology devices in engineering science
for magnification of knowledge and its implementation
in practice.
Technology of chemical-mechanical
polishing of material surfaces
in combination with ozone

2. Problems of CMP in the world
Compositions for polishing;
The speed of polishing and polishing quality;
Polishing time;
Route of mechanical pretreatment.
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3. Demand / market
0,5%
The volume of all market
(PAM)
Volume of the target market
(TAM)
Volume it is realistic
an achievable segment
(SAM)
The size of the market
for semiconductor equipment in the world
90 bn $
4.5 bn $
2.5 bn $
12.5 m $
Market of Chemical
Mechanical Polishing
Market consumables
chemical-mechanical polishing
Volume it is realistic an achievable
share of the market (in a year)

4. Manufacturers
Leading manufacturers of equipment and consumables
for chemical-mechanical polishing
Сompany
Cabot Microelectronics Corporation
Nalko Chemical Co.
Applied Materials
Ebara Corporation
Fujimi Inc.
Hitachi Chemical Company Ltd.
Headquarters
USA
Japan
USA
Japan
Japan
USA

5. Solving the problems of CMP materials
The versatility of compositions, the ability to polish hard and soft materials, metals,
semiconductors of all types and dielectrics
High surface quality of materials after CMP
High polishing speed
Reduced time for material polishing
Developed routes for processing surfaces of various crystals
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6. Technology
The proposed technology provides chemical and mechanical polishing (CMP) of
material surfaces (Si, Ge, Al2O3, ZnSe, CdTe, GaAs, KCl, NaCl, CaF2, LiF, BaF2, etc.)
with the distinctive feature: using amorphous oxides as a solid phase in
combination with highly concentrated ozone, which is a strong oxidant (2.07B).
Such a solution will make it possible to obtain «defect-free» nano-
subnano-roughness mirror smooth surfaces of materials without scratches, to
substantially reduce the processing time and increase the polishing speed of the
material surfaces, in comparison with the analogues used in Russia and abroad.

7. Competitor
Сompany Ideal
surface
High rate
of removal
CMP+ cleaning
in 1 stage
Slurry
on the basis
of amorphous
particles
Cabot Microelectronics – – ––
Fujimi Inc. – – ––
Hitachi Chemical – – ––
Solway + + ++

8. Fields of application
of the composition for CMP materials
Semiconductor Electronics
Optoelectronics
Acoustoelectronics
HTS-electronics
Dielectronic equipment
Magneto-electronics
Cryo-electronics
Microwave Electronics
Optics
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Electrooptics
Magneto-optics
Acousto-optics
Electrical Engineering/
Micro-Electric Engineering
Piezo-technics
Infrared technology
Laser technology
High-Precision Engineering
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9. The rate of removal in the process of CMP crystals
with different micro hardness,
Developed compositions of amorphous oxides
α –SiC
Y3Al5O15
α –Al2O3
MgO
Gd3Ga5O12
GaAs
GaP
Si
ZrO2∙Y
Ge
α-SiO2
SrTiO3
LiNbO3
GaSb
Material
0,2; до 0,5
0,2-0,3
5-7 max/h
0,2
0,2 -0,3; 0,5
0,5-2,0
0,5-2,0
0,3; 0,5; до 1,0
0,2
0,2 -0,5; до 1,0
0,2-0,4
0,15
under 1,0
0,1-0,2; 0,6
VCMP , max/min
CdAs2
Bi12SiO20
InAs
InSb
CdSb
BaF2
PbS
α –CdS
Mo
ZnSe
α – CdSe
PbSe
ZnO
Material
0,2-0,3
0,4 – 0,8
0,6 – 0,8; 0,5 – 0,6
0,5 – 2,0
0,2-0,3
0,1-1,0
0,6-2,5
0,3 – 0,5; 0,6 – 0,8
0,8 – 1,4
0,3-0,6
0,4 – 0,5; 0,8 - 0,9
0,6-2,5
0,25
VCMP , max/min

10. Materials polished by C-MP
Semiconductors Dielectrics Metals and alloys
Si, Ge, 6H:SiC, GaP, GaAs, GaSb,
InP, InAs, InSb, Triple and
quadruple semiconductor
compounds А3В5, ZnS, ZnSe,
ZnTe, CdS, CdSe, CdTe, CdSSe,
ZnCdS, ZnCdSe, PbS, PbSe,
PbTe, PbSnTe, PbSeTe, PbSSe,
CdP2, CdAs2, CdSb, ZnP2,
ZnAs2, ZnSb, Cu2S, Cu2Se,
Cu2Te, Ag2S
Oxides: MgO,Bi2O3,
ZrO2:Y2O3, MgO:Al2O3, ZnO,
α-TeO2, α-SiO2,
α-Al2O3;
Fluorides: LiF, CaF2, BaF2,
MgF2;
Oxygen content: Bi12SiO20,
Bi12GeO20, Bi12TiO20,
Bi4Si3O12, Bi4Ge3O12, SrTiO3,
LaAlO3, Gd3Ga5O12,
Grenades: Y3Al5O12,
Y3Ga5O12, Y3Fe5O12,
Gd2(MoO4)3, Y2(MoO4)3,
(SrxBa1-x)Nb2O6, LiNbO3,
LiTaO3, La3Ga5SiO4, Mg2SiO4,
LaGaO3, NdGaO3,
Ba2NaNb5O15, KTiOPO4,
YAlO3
Cu (111), (110), (100)
Ag (100)
W (111), (110), (100)
Mo (010)
Ni (100)
Bi (110) and others.
Alloys: stainless steel, ВТ6,
Invar, Mo (poly), Ta (poly), etc.

11. Business model & marketing strategy
Contractors
Assembly
and testing
Channels of sales
Licensing
conferences
exhibitions
demonstration of work of technology
photo-video presentation materials
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12. Key project team members
General Director. Experi-
ence: management, sales,
development and imple-
mentation of projects,
attraction of investments.
Co-author of Russian
patents. Presentation of the
technology: StartupZONE,
at SEMICON Russia; Startap
Villadge. Cooperation: Log-
itestSolar Canada, Thermco
T-clean England, MAICOM
QUARZ Germany, Technical
University of Chemnitz Ger-
many, TEL Japan, STV-
Telecom Russia, Helios
Russia, Hevel Russia.
Maxim Zarezov
Dep. General Dir. 15-year
experience in microelec-
tronics, solar energy, fuel-
energy systems and electro-
chemical technologies.
Presentations at Russian
and international confer-
ences, exhibitions. Publica-
tions in different scientific
journals. The author of
patents of the Russian Fed-
eration. Cooperation: Logit-
estSolar Canada, MAICOM
QUARZ Germany, PAO
Kvazar Ukraine, Swiss Still
Fire GmbH Switzerland, TEL
Japan, STV-Telecom Russia,
Helios Russia, Hevel Russia.
Anton Mantuzov
The development and
industrial implementation
of innovative technological
solutions and electronic
materials. Оrder, import of
advanced technological
equipment. Cooperation in
the field of microelectronics
and solar energy in Canada,
England, Germany, Techni-
cal University of Chemnitz.
Victor Mantuzov
Doctor of Technical Sciences,
professor, work experience in
the field of the CMP for more
than 50 years, the creator of
the foundations of CMP tech-
nologies in the USSR. Author
of more than 200 publica-
tions, theses, reports at the
All-Union and Russian confer-
ences, including about 30
patents in the field of CMP
materials and related fields.
Collaborated with the Insti-
tute of Metallurgy and Mate-
rials. A.A. Baikov RAS, Orion,
NGO Polyus. Head of the
project «Nano-surface».
Alexander Artemov
Deputy Director for
C h e m i c a l - M e c h a n i c a l
Polishing, senior engineer-
technologist in the field of
CMP materials, work experi-
ence over 5 years, partici-
pant in the implementation
of a number of projects on
the CMP, participant in a
number of scientific and
practical conferences and
international exhibitions
(Semicon, Optica, etc.).
Evgeny Artemov

13. Current status and plan schedule
Entry into the market
We render services in CMP of a surface of materials in the Russian Federation
In the future adaptation of technology at the existing enterprises
Conclusion of license contracts
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Idea
2013-2014 2015-2016
creation
of a slurry
sample
patent
application
creation
of a prototype
installation
of a prototype
development
of a slurry sample
approbation
of technology
take
out a patent
negotiations
with the enterprises
entry into
the market
participant of the
project Skolkovo
2017-2018
development
of the technology
on the materials

14. Contacts
Maxim Zarezov CEO
+ 7 (903) 668-6516
Anton Mantuzov Deputy Director
+ 7 (909) 150-5703
E-mail: solway.npp@gmail.com