Se ha denunciado esta presentación.
Utilizamos tu perfil de LinkedIn y tus datos de actividad para personalizar los anuncios y mostrarte publicidad más relevante. Puedes cambiar tus preferencias de publicidad en cualquier momento.

Presentation on FLEXIBLE ELECTRONICS.....

17.588 visualizaciones

Publicado el

Presentation on FLEXIBLE ELECTRONICS....

  • Inicia sesión para ver los comentarios

Presentation on FLEXIBLE ELECTRONICS.....

  1. 1. FLEXIBLE ELECTRONICS SEMINAR ON Presented by: YALAGOUDA PATIL
  2. 2. OUTLINE  Introduction  Materials for flexible electronics  Technologies involved processing  Degree of flexibility  Applications  Advantages and Limitations  Conclusion
  3. 3. INTRODUCTION Ever evolving advances in thin-film materials and devices have fueled many of the developments in the field of flexible electronics.
  4. 4. MATERIALS FOR FLEXIBLE ELECTRONICS A generic large-area electronic structure is composed of  Substrate  backplane electronics  Frontplane  encapsulation
  5. 5. SUBSTRATES Flexible substrates that are to serve as drop-in replacements for plate glass substrates must meet many requirements:  Optical properties  Surface roughness  Thermal and thermomechanical properties  Chemical properties  Mechanical properties  Electrical and magnetic properties
  6. 6. BACKPLANE ELECTRONICS Backplanes provide or collect power and signal to or from frontplanes. Backplanes may be passive or active.  Silicon Thin-Film Transistors  Organic Thin-Film Transistors  Materials for Interconnects and Contacts
  7. 7. BACKPLANE ELECTRONICS
  8. 8. FRONT PLANE TECHNOLOGIES Frontplanes carry the specific optoelectronic application.  Liquid Crystal Displays  Electrophoretic Displays  Organic Light-Emitting Displays  Sensors
  9. 9. TECHNOLOGIES AND INTEGRATION PROCESSES Any manufacturable device has four essential characteristics:  Superior and pre-specified performance, with reproducibility, uniformity, and reliability;  High yield to acceptable tolerance;  Simulations exist for both reverse engineering during development and right-first-time design;  Proven adequate in-service lifetime.
  10. 10. FABRICATION TECHNOLOGY FOR FLEXIBLE ELECTRONICS  Fabrication on sheets by Batch Processing..  On a rigid carrier, facing up and loose;  In a tensioning frame, facing up or down;  In a frame, facing down and loose  Fabrication On Web by roll-to-roll Processing  Additive Printing
  11. 11. BATCH AND ROLL TO ROLL FABRICATION
  12. 12. DEGREE OF FLEXIBILITY Flexibility can mean many different properties to manufacturers and users.  Degree of flexibility is given by ε = d/2r.  bendable or rollable  permanently shaped  elastically stretchable
  13. 13. EXAMPLES…
  14. 14. APPLICATIONS  Holistic system design
  15. 15.  Health Care
  16. 16. OTHER APPLICATIONS  Automotive Industries  Displays and Human- machine interaction  Energy management and mobile devices  Wireless systems  Electronics Embedded in the living environment  Electronics for hostile environment etc..,
  17. 17. ADVANTAGES AND LIMITATIONS Advantages:  Size and weight  Increased circuitry density  Boundries of design and packaging  Shape or to flex during its use Limitations:  Lifetime  Manufacturing  Water  Battery
  18. 18. CONCLUSION Based on the current socioeconomic trends, we outlined some of the more likely technological future needs and discussed the potential exploits of thin-film flexible electronics in various market sectors.

×