ANSYS Icepak R160 Update_P4

1. 1 © 2011 ANSYS, Inc. October 22, 2014
ANSYS Icepak R16.0 Update New Features and Enhancements

2. 2 © 2011 ANSYS, Inc. October 22, 2014
• Multiphysics – Icepak – HFSS/Maxwell/Q3D 2-way coupling – Icepak – Ansoft 2-way coupling automation using Feedback Iterator – Temperature-dependent power map import from Sentinel TI
• ECAD import
– EDB import capability
• Meshing enhancements
– Concurrent assembly meshing
• Modeling and GUI Enhancements
• Solver Enhancements – Parallel Speedup
– NC Interface creation – Surface monitoring • Post processing enhancements
ANSYS Icepak R16.0 Update

3. 3 © 2011 ANSYS, Inc. October 22, 2014
Multiphysics

4. 4 © 2011 ANSYS, Inc. October 22, 2014
• Import losses from HFSS/Maxwell/Q3D into Icepak
– Import volumetric and surface losses from HFSS/Maxwell/Q3D into Icepak via
the Workbench project schematic
– HFSS/Maxwell generate temperature-dependent data
• Export temperature feedback data from Icepak to HFSS/Maxwell/Q3D
– Icepak generates thermal feedback when solution cell updated • Perform coupling iterations until desired level of convergence – Manual cyclic updates of individual system components • Option to report assigned volumetric and surface losses in Icepak Two-way Coupling with HFSS/Maxwell/Q3D

5. 5 © 2011 ANSYS, Inc. October 22, 2014
Both surface and volume mapping supported
Icepak – Q3D 2-way coupling

6. 6 © 2011 ANSYS, Inc. October 22, 2014
• Automatic system updates using the Feedback Iterator
– Automatic cyclic updates of system components until temperatures stop
changing within desired level of tolerance Automatic Coupling Iterations between HFSS/Maxwell/Q3D and Icepak

7. 7 © 2011 ANSYS, Inc. October 22, 2014
Icepak – SI Wave Coupling

8. 8 © 2011 ANSYS, Inc. October 22, 2014
• Improved filtering of powermaps from SI Wave
– Filter by area, power
– Clip to board outline
– Preview imported powermaps SI Wave Powermap Filtering

9. 9 © 2011 ANSYS, Inc. October 22, 2014
Icepak – Sentinel TI Coupling

10. 10 © 2011 ANSYS, Inc. October 22, 2014
Icepak- Sentinel TI Coupling: Temperature Dependent Powermaps
• Temperature dependent powermaps allow system thermal design variations
and optimization with realistic powermaps on chips
• Reduce iterations between chip and system thermal tools <Co-ord> T1 PD1 T2 PD2 T3 PD3 T4 PD4 T5 PD5

11. 11 © 2011 ANSYS, Inc. October 22, 2014
ECAD Import

12. 12 © 2011 ANSYS, Inc. October 22, 2014
Icepak ECAD Import Capabilities
• Cadence – Allegro  15.7, 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6
– APD  15.7, 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6
– SiP Digital/RF  15.7, 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6
– Virtuoso  5.10, 6.14, 6.15, & 6.16 (Linux only) • Mentor Graphics
– Boardstation Classic  8.x (uses HKP design flow)
– Boardstation XE  v2007, v2007.1, v2007.2, v2007.3 and v2007.7 (uses HKP design flow)
– See ODB++ Below
• Zuken – CR5000  10 and higher (Zuken translator for .anf & .cmp)
– CR8000  2013 and higher (Zuken translator for .anf & .cmp)
• ODB++ – Altium Designer  R10 and greater
– Cadence OrCAD  16.3 and greater
– Mentor Expedition  EE7.9.1 and greater
– Mentor PADS  9.4 and greater
– Zuken Cadstar  12.1 and greater
• Other ECAD Formats
– .anf  ANSYS neutral file format
– .dxf  AutoCad drawing format
– .gds  IC Chip format

13. 13 © 2011 ANSYS, Inc. October 22, 2014
ECAD Import • ECAD import process optimized • Faster processing, esp. with trace rendering
• EDB integration
• EDB import now available
• All ANF import features supported • Booleanized outlines of pads, paths, vias • Wirebonds • Import ODB++ files via EDB
• Interactive selection and display of vias • Ability to deactivate via sets and exclude from conductivity
calculations
• Improved filtering of IDF components
• Filtering of capacitors, inductors and resistors now possible

14. 14 © 2011 ANSYS, Inc. October 22, 2014
Display and Modeling of Vias

15. 15 © 2011 ANSYS, Inc. October 22, 2014
Meshing

16. 16 © 2011 ANSYS, Inc. October 22, 2014
Meshing Enhancements
• Meshing enhancements
– Concurrent meshing of assemblies • Speed-up of overall meshing time • Not licensed – No O-grids option for individual assemblies – Improved visualization of mesh cut
planes based on type of region (Solid
only, Fluid only and All)

17. 17 © 2011 ANSYS, Inc. October 22, 2014
GUI & Modeling

18. 18 © 2011 ANSYS, Inc. October 22, 2014
• Simplify Board/via and Trace heating panels
• Use mouse buttons to expand/collapse tree nodes under
Project and Library
• Show objects by type
– Traces, CAD and Joule heating
GUI Enhancements

19. 19 © 2011 ANSYS, Inc. October 22, 2014
• New option to specify ‘Fixed
velocity’ for fluid blocks
– Vacuum chamber simulations
– Specify fixed velocities in X,Y,Z
directions for fluid blocks to create
quasi-vacuum regions
– Specify radiation and natural
convection conditions
Vacuum Chamber Simulation

20. 20 © 2011 ANSYS, Inc. October 22, 2014
Network Block Enhancements
• Transient simulation capability for
network blocks
– Specify mass and specific heat
– Implemented for all network block
types
– Can parameterize mass and specific
heat

21. 21 © 2011 ANSYS, Inc. October 22, 2014
• Internal sources for species modeling
– 2D and 3D species sources can be specified
• Transient thermal boundary conditions for recirculating openings
• Type 2 blowers: option to offset the inlet from the center
• Custom vias creation for PCB object
• ‘Individual temperature variation for orthotropic thermal
conductivities
Miscellaneous Enhancements

22. 22 © 2011 ANSYS, Inc. October 22, 2014
Solver Enhancements

23. 23 © 2011 ANSYS, Inc. October 22, 2014
Solver Enhancements
• Solver robustness
• Improved implementation of non-conformal interfaces
• Improved handling of 2D objects touching assemblies
• Faster and more robust creation of interfaces in solver
• Object ‘Unmerge’ option for all objects
• Better control for macros and post-processing

24. 24 © 2011 ANSYS, Inc. October 22, 2014
Parallel Solver Speedup
• Parallel Solver Improvements
• Improved handling of NC interface creation
• Solver data export frequency control
• F-cycle for algebraic multi-grid method
• Parallel Solver Speedup
• Improvement in total solver time up to 40%
• Overall reduction in RAM usage
Total time Benchmark time I/O time
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V15.0.7 Total Time, hrs
V16 Total Time, hrs
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V15.0.7 Benchmark Time, hrs
V16 Benchmark Time, hrs
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V15.0.7 I/O Time, hrs
V16 I/O Time, hrs

25. 25 © 2011 ANSYS, Inc. October 22, 2014
Solution Monitoring
• Surface monitors for object surfaces
• Heat flow, Mass flow, Volume flow and
Temperature
• Can select an individual side or all sides
• Point monitors for mass concentration of species

26. 26 © 2011 ANSYS, Inc. October 22, 2014
Post-processing Enhancements

27. 27 © 2011 ANSYS, Inc. October 22, 2014
New Color Map Schemes
• Infrared color map schemes supported
• Mono chromatic red and gray added
• All color map schemes supported by Fluent and CFD now available

28. 28 © 2011 ANSYS, Inc. October 22, 2014
3D Projection of Cut-plane Surface Contours
• Option to project cut plane surface contours to 3D
• Projection is in direction of surface normal
• Only available for smooth shading

29. 29 © 2011 ANSYS, Inc. October 22, 2014
Particle Trail Particle Coarsening
• Option to skip trail particles
• Works like uniform points but with mesh point distribution
• Speeds up rendering and model transformation

30. 30 © 2011 ANSYS, Inc. October 22, 2014
Multi-valued Isosurfaces
• Option to specify multiple iso-values for a single iso-surface object
• Clipping is possible

31. 31 © 2011 ANSYS, Inc. October 22, 2014
• Numeric iso-values can be added to iso-lines of post –
processing objects
Numeric Iso-values for Iso-lines

32. 32 © 2011 ANSYS, Inc. October 22, 2014
• Summary report column
customization
– Choose output columns
– Same columns exported to
Excel as well
Summary Report Customization