2. Page
COMPLETE BUNDLE AVAILABLE.
• PC Controlled (Ethernet).
• Four TAP/IO Boxes.
- 1x TAP Port.
- 4x Digital input ports.
- 5x Digital output ports.
• One Diagnostic Clip.
• Add-on Cover-Extend Technology capability
- Vectorless testing of ICs or Connectors through
boundary scan
• Scan Path Linker
- Connecting physically separate chains to test the
interconnecting nets
Controller
TAP I/O Boxes
Diagnostic
Clip
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3. Page
TAP#4
CET
Adaptor110-240V USB to PC
*USB
*Trigger Out
LAN to PC
*RS-232
*reserved for future use
4 programmable 0-5V receivers
IEEE 1149.1 TAP
TCK : programmable 0-5V, 40-380V/us, max 22.5MHz
TMS : programmable 1.1-5.0V, max 7.5MHz
TRST : programmable 1.1-5.0V, max 10KHz
TDI : programmable 1.1-5.0V, max 11.25MHz
TDO : programmable 0-5V, max 11.25MHz
1 VCC
4 GND
TAP#3
TAP#2
TAP#15 programmable 1.1-5.0V drivers
LAN to PC
4. Page
x1149 CET Mux
Power Adaptor
LAN to PC
x1149 TAP/IO
x1149 Controller
No test access
Cover Extend Technology uses Boundary Scan as the stimulus to test
non-Boundary Scan components having no test access.
VTEP amplifier, sensor plate and a Cover-Extend Mux is
required to complete the metrology.
VTEP amplifier
& sensor plate
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5. Page
Keysight x1149
TCK set at
• 3V
• 22.4MHz
• @ 300V/us
Compared with
‘ABC’ Scan
TCK set at
• 5V
• 15.8MHz
• ? V/us (not
adjustable)
Keysight x1149
TCK set at
• 3V
• 1.8MHz
Keysight x1149
TCK set at
• 3V
• 1.8MHz
• @ 300V/us • @ 50V/us
Adjustable Slew Rate
Low overshoot
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7. Page
Best in Class GUI
• All information available on the screen at a
mouse click.
• Alternative language support (e.g. Chinese).
More can be added with translation matrix.
• Dock and un-dock screens to size displays.
• Intuitive.
• Comprehensive CAD format inputs or simply
use i3070 board file.
• Follows natural test development process
• Test coverage tool, first pass yield, operator
GUI, schematic viewer and more.
• Three level of login privileges to manage
user profiles
• Enables Ease-Of-Use
8. Page
Graphical view of the selected
chain. Mouse over to retrieve
the TAP information.
All information of the
devices in the chain at
a glance.
Process Outline
Guides user through
test development and
debug.
Project Explorer
Navigate to sections
of the test at a click.
Click to select
chain.
Generate Multi-Chain
Scan Path Linker combines
chains at a click.
Configure/Reconfigure Chain
Automatically sets up chains
using board’s net information.
9. Page
View the failing test in Waveform Viewer or the
Frame Debugger to view the expected vs actual.
View failure as a waveform
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10. Page
View the failing test in Waveform Viewer or the
Frame Debugger to view the expected vs actual.
Vector view of frame
Undocked view of the waveform
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11. Page
View the failing test in Waveform Viewer or the
Frame Debugger to view the expected vs actual.
Undocked view of the frame
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12. Page
Output
Shows the results of all the tests for the chain(s).
Results of tests are highlighted in colors. Test
results can be sorted by clicking on the title tab.
Repair Ticket
Pin-level failure reporting and possible cause.
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13. Page
Output
Shows the results of all the tests for the chain(s).
Results of tests are highlighted in colors. Test
results can be sorted by clicking on the title tab.
Repair Ticket
Pin-level failure reporting and possible cause.
Board with injected open faults (Dot6 test)
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CET test failures
15. Page
‘Standard’ Boundary Scan Test
• Board designs can have boundary scan chains
physically separated (not connected).
• Such boundary chains will be generated and tested as
separate chains.
Scan Path Linker
• Boundary scan test coverage can be increased by the
number of interconnect nets if boundary scan chains can
be ‘connected’ during testing and revert to its original
design after testing.
• x1149 Scan Path Linker connects two or more boundary
scan chains by linking the TDO to the TDI of these
chains inside the controller.
• Automated logic level management
IC IC
IC IC
No test coverage
IC IC
IC IC
Nets tested
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16. Page
Integrated STAPL Player
• STAPL (Standard Test and
Programming Language)
• JEDEC standard : JEDEC-JESD71
• Enables programming of various
CPLD/FPGA devices from vendors
like Xilinx, Altera, Lattice, Actel
(Microsemi) and more.
• Compiler takes in various formats :
STAPL, jam, jbc, svf files
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18. Page
Applications for boundary scan test (cont’d)
– Testing of Mobile phones
• Low cost structural test method providing pin level diagnostics in order to filter
out and reduce functional defects
• Test SDRAM POP on the only bscan component (CPU)
• Test connectors for shorts and opens using vectorless test methods
– Testing of SSD boards
• Pre-functional test filters out structural defects for boards with only one Bscan
IC on-board
• This is a quick test that covers all functional blocks of the SSD, Controller,
NAND, SDRAM, EEPROM, Temp sensors, etc
• Combines structural test with some functional test. Shorts and opens test on
power and ground nodes, read/write tests on NAND & SDRAM, programming
of EEPROM
• Tested in panels of boards
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19. Page
Applications for boundary scan test
– Testing of Netcom boards
• Large boards ~ more than 10k nodes
- Want to test at ICT in order to filter out defects before functional test
reduce functional test cost
• Many Bscan ICs on board in long chains
• Bscan is used to reduce the testpoint resources to allow board to fit on ICT
– Testing Server boards
• Detect shorts and opens on CPU sockets and SDRAM DIMM connectors
even through there are no testpoints between the CPU and SDRAM DIMM
• Silicon Nails tests are used to test the paths between the CPU & SDRAM
DIMMs
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20. Page
Applications for boundary scan test (cont’d)
– Embedded Test for Motherboards
• Using built-in test capabilities on the Intel CPU, we are able to execute
functional test on the peripherals
• This is a quick test that provides good diagnostics, but it is dependent on the
test capabilities exposed to the test developer by the Intel CPU developers
• Combines structural test with functional test. Possible to reduce functional
testers
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21. Page
Using x1149 in all stages of the
Product Life Cycle
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22. Page
x1149 throughout the Product Cycle
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Design R&D
• Quick test turn on
• Test high-value ICs
• Diagnostics during design verification
Warranty Repair
• Field Repair
• Fixtureless, portable
Prototyping NPI
• Quick test turn on
• Test high-value ICs
• Test development enhancements
Mass Production Production
• Leverage from NPI
• Integration to ICT or Standalone
• Savings on fixturing
Debug Repair
• Short test time
• Pin level diagnostics
Product Life Team Benefits
23. Page
Conclusion
Introduction to
Keysight x1149 23
– Boundary Scan is the most effective means to mitigate issues with loss of test
access on the product
– Boundary Scan requires DFT to be most effective
– Keysight produces an easy to use, manufacturing ready boundary scan tester for
your production
Get it
NOW
25. Page
X1149 Boundary Scan Analyzer Workshop
– Development
– Debug
– Runtime
TAP/IO Port
Bravo Board
x1149 CET Module
x1149
Main Controller
2
1
1
2
3
3
4
5
4
5
26. Page
Development
– New Project
• Add board
– J6 Test CET
– U3, U4 Show Silicon Nails
– U3, U4 Add Flash
• flash.absl
- AT24C128BN_soic
- AT25DF161_soic
– Configure Chain
– Generate Tests
– Generate Test sequence
27. Page
Debug
– Set IP Address
– Show Integrity test
• Undock Repair Ticket
– Show IDCode
• View Debug Windows
- Binary – Show Device
Information
• Set Multiple IDCode
– Show Interconnect test
• Framedebugger
• SW2%4-5 OpenClose
• Failure waveform
– Show CET
• Port 1
• AutoDebug CET
• Run – View Graphics
• SW2%2-7
– Flash Programming
• U3
- Program (Partial) … 0 to 100
- Verify (Partial) … 0 to 100
- Run
• U4
- Read IDCode
- Chip Unprotect
- Chip Erase
- Blank Check
- Program (Partial) … 0 to 100
- Verify (Partial) … 0 to 100
- Run
– Show Test Sequence
• Show Command and Test List
• Add Print
• Release to Production
28. Page
Runtime
– Production Run – Operator Mode
• Load Tests
• Admin Screen
• Set IP Address
• Run
Keysight
Confidential 28
29. Page
Thank You! Adrian Cheong
Product Marketing Manager
Keysight Technologies
adrian_cheong@Keysight.com
Introduction to Keysight x1149
29