A new technique to achieve the globular weld structure of SSM 356 aluminum alloy was conducted. The effect of joining parameters on the microstructure and mechanical properties of diffusion bonding butt joints of semi-solid SSM 356 aluminum alloy was investigated by conditions as follows: compressive pressure at 0.4, 0.9, 1.8, 2.4 and 2.7 MPa, with holding time 3 hours and temperature at 495oC under argon atmosphere at 4 liters per minute. The results showed that the compressive pressure 1.8 MPa, with holding time 3 hours and temperature 495oC, under argon atmosphere provided the highest joint strength to 124.48 MPa. In addition, the results of the investigation have shown that the joint efficiency was 72 percent compared with base metal and microstructure in weld zone (WZ) after welding becomes globular structure. This microstructure, similar to the original structure of the base material, is a globular structure but the grain size can grow at a higher temperature

1. International
OPEN ACCESS Journal
Of Modern Engineering Research (IJMER)
| IJMER | ISSN: 2249–6645 | www.ijmer.com | Vol. 4 | Iss. 5| May. 2014 | 5 |
Diffusion Bonding of Semi-Solid (SSM 356) Cast Aluminum Alloy
Chaiyoot Meengam1
, Prapas Muangjunburee2
, Jessada Wannasin3
1, 2, 3
Department of Mining and Materials Engineering, Faculty of Engineering, Prince of Songkla University,
Hat Yai, Songkhla, Thailand, 90112
I. INTRODUCTION
Semi-solid metals (SSM) have been receiving considerable attention due to its advantages for
application in automotive and aircraft industries. SSM processing exhibits distinctive advantages such as
components are near net shape, the temperature of SSM processing is lower than conventional casting and its
globular microstructure is shown in Fig 1 [1]. It was clear that the joint of SSM aluminum alloys have expanded
in the usage of casting components. Joining of SSM aluminum alloys has been carried out with a variety of
fusion and solid state welding processes. Conventional welding processes lead to the formation of porosities in
weld as well as change in weld microstructure [2]. Therefore, a suitable joining technique is required to
overcome these problems. These difficulties have led to joining in solid state by diffusion bonding. In this study,
SSM 356 aluminum alloy was obtained from a new rheocasting technique, named gas induced semi solid
(GISS) process.
Diffusion bonding is a solid state joining process, which consists of three main parameters such as
time, temperature and pressure. In this method, mating materials are brought into contact under a pressure far
below the yield strengths of the base materials, and generally the bonding temperature is chosen between 0:5-
0:8Tm, where Tm is the melting point of the base materials [3]. Diffusion bonding of aluminum alloys faces
some problems due to its protective oxide film (Al2O3). This oxide has great stability and tenacity at high
temperatures and to hinder diffusion of atom [4]. However, problems from oxide film can be avoided by joining
in a vacuum or under atmospheric shielding gas [5].
Fig: 1 Microstructure of base materials SSM 356 [6]
In this research, systematic study on the effect of joining parameters on the microstructure and mechanical
properties of diffusion bonding butt-welded joints of SSM 356 aluminum alloy was investigated and the results
were reported and discussed.
Abstract: A new technique to achieve the globular weld structure of SSM 356 aluminum alloy was
conducted. The effect of joining parameters on the microstructure and mechanical properties of diffusion
bonding butt joints of semi-solid SSM 356 aluminum alloy was investigated by conditions as follows:
compressive pressure at 0.4, 0.9, 1.8, 2.4 and 2.7 MPa, with holding time 3 hours and temperature at
495o
C under argon atmosphere at 4 liters per minute. The results showed that the compressive pressure
1.8 MPa, with holding time 3 hours and temperature 495o
C, under argon atmosphere provided the highest
joint strength to 124.48 MPa. In addition, the results of the investigation have shown that the joint
efficiency was 72 percent compared with base metal and microstructure in weld zone (WZ) after welding
becomes globular structure. This microstructure, similar to the original structure of the base material, is a
globular structure but the grain size can grow at a higher temperature.
Keywords: SSM 356 Aluminium alloy, Diffusion Bonding, Bond line, Semi-Solid Metal

2. Diffusion Bonding of Semi-Solid (SSM 356) Cast Aluminum Alloy
| IJMER | ISSN: 2249–6645 | www.ijmer.com | Vol. 4 | Iss. 5| May. 2014 | 6 |
II. MATERIALS AND METHODS
The material used in this study was aluminum semi-solid metal SSM 356 with chemical composition
shown in table 1. The mechanical properties of SSM 356 are as follows; ultimate tensile strength (UTS) is 168
MPa, yield strength (YS) 137 MPa and elongation (E) 9.7 percent
Table 1: The chemical compositions of SSM 356 (% weight) [7].
Materials Si Fe Cu Mn Mg Zn Ti Cr Ni Al
SSM 356 7.74 0.57 0.05 0.06 0.32 0.01 0.05 0.02 0.01 Bal.
The base material for diffusion bonding was supplied in the form of cylindrical shape of dimensions 11
mm. in diameter and 40 mm in length. The specimen preparation was carried out by grinding surfaces with P180
grit SiC paper and cleaning in acetone for 30 s. just before diffusion bonding. Bonding was performed in argon
atmosphere at 4 liters per minute in a high temperature chamber attached to a testomatic tensile
testing/compression testing machine. The temperature of the chamber was set at 495°C. Bonding pressure were
0.4, 0.9, 1.8, 2.4 and 2.7 MPa and heating holding time of 3 hours. The variables used in this experiment are
summarized below:
1. Diffusion bonding temperature: 495 °C
2. Applied pressure: 0.4, 0.9, 1.8, 2.4 and 2.7 MPa
3. Heating holding time of 3 hours.
Fig: 2 temperature cycle time
Total time of heating cycle is 7 hours 45 minutes as shown in Fig 2. Finally desired compression force and
all of which are controlled under the oven shown in Fig 3.
Fig: 3 Set-up used for bonding.

3. Diffusion Bonding of Semi-Solid (SSM 356) Cast Aluminum Alloy
| IJMER | ISSN: 2249–6645 | www.ijmer.com | Vol. 4 | Iss. 5| May. 2014 | 7 |
III. RESULTS AND DISCUSSION
3.1 Metallography
Fig 4(a) shows the cross section macrograph of the diffusion bond line. It can be seen that no macro
defects were observed, in addition, two base materials were sound bonded. Fig 4(b), 4(c), 4(d), 4(e), and 4(f)
show the microstructure along the bond line from top to bottom. The results have indicated that only one void
was observed in the bond interface obtained from Fig 4(d). This elongated void located at the center of the bond
line to this is due to the elimination of the interfacial voids was nearly completed. It is generally considered that
a sound bond was achieved despite little evidence of the bond line. Bond line was part of the specimens where
microstructure is not changed due to heating cycles, and microstructure in bond line zone has globular structure
which is similar to base structure SSM 356 but different in sizes – the size of bond line grain is about 12-15 μm
but the size of base structure grown about 19-22 μm. Fig 4(b)-4(f) also reveals smaller grain size at the interface
compared with base materials away from the interface. Microstructure at and near the interface was influenced
by temperature, time and pressure resulting in changes to the shape and size of grains. [8] Fig 4(a) and 4(b)
suggest a small misalignment at the top and bottom during bonding process.
Fig: 4 Macro-Microstructure of interface for SSM 356. After diffusion bonding method (a) macrostructure at the
interface, (b) on the top edge, (c) top, (d) medium, (e) bottom and (f) on the bottom edge.
Fig 5 shows microstructure revealed by scanning electron microscopy (SEM) with joining parameters
at temperature 495 o
C, pressure 1.8 MPa and time 3 hours. Fig 5 (a) reveals aluminums matrix phase (α-Al) and
void. A small voids was obtained in the bond interface. In addition, broken silicon particles were also obtained
at and near the bond interface. The void along the top to the bottom is very small. Silicon particles were broken
by pressure and the influence of heat; then, the silicon and magnesium as combination of Mg2Si have formed as
shapes of the plates and rods [9]. Mg2Si from shaped plate is grown about 4 μm and about 10-15 μm long, and
Mg2Si from rods-like-shape particle is about 1.5 μm wide and about 10-30 μm in length. Based materials on
silicon from rods-like-shape particle is about 1.5 μm wide and plates-like-shape particle is 2.5 μm in length. For
both rods-like-shape particle and plates-like-shape particle is about 15-20 μm wide. It is obvious that Mg2si
phase are arrangement parallel along the bond lines show in Fig 5 (b). Heating the silicon particles diffusion into
bond line at the right time result in complete diffusion show in Fig 5 (c, d) and Mg2Si are distributed throughout
the aluminum matrix. Although Mg2Si particle is smaller in size, this promotes material strength. Small voids
were observed in the bond interface. In addition, some broken silicon were also observed at and near the bond
line.

4. Diffusion Bonding of Semi-Solid (SSM 356) Cast Aluminum Alloy
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Fig: 5 Scanning Electron Microscopy of interface for SSM 356
Table 2: Chemical compositions of each zone in the bond line for 1.8 MPa at 495 o
C (at.%)
Zone Al Si Mg Fe
A1 72.55 25.74 1.27 0.44
A2 79.80 16.57 2.65 0.98
A3 59.12 38.71 1.26 0.91
A4 75.52 22.51 1.38 0.61
A5 83.82 14.11 1.61 0.46
Fig 6 shows an inspection of line scan and point analysis by energy-dispersive x-ray (EDX) analyze
diffusion elements to bond line. It is found that the microstructures along bond line have silicon particle (Si)
distributing throughout the aluminum matrix which forms a combination of magnesium and silicon into solid
solution Mg2Si where is nearby bond line. In addition, the maximums amount of silicon is located at the center
because the interface zone has the same behavior as grain boundary which assists atoms to diffuse easily on
interface grain. The chemical compositions of each zone in the bond line for 495 o
C, pressure 1.8 MPa and time
3 hours by EDX shown in Table 2. According to the table, the silicon phase maximum diagram and the
morphologies of A3 have 38.71 percent.

5. Diffusion Bonding of Semi-Solid (SSM 356) Cast Aluminum Alloy
| IJMER | ISSN: 2249–6645 | www.ijmer.com | Vol. 4 | Iss. 5| May. 2014 | 9 |
Fig: 6 Energy-Dispersive X-ray of interface for SSM 356
3.2 Tensile Strength of Joints
The tensile properties and fracture locations of joints welded at different welding condition are show in
Fig 7. From investigation, the increase in the contact pressure leads to increase in the tensile strength, a
maximum average value tensile strength of 129.3 MPa was achieved by the joint parameter at contact pressure
1.8 MPa, holding time 3 hours. temperature 495o
C, under argon atmosphere flow 4 l/min. Compared with the
base material is around 76.96 percent of efficiency joints by base material aluminums SSM 356 is 168 MPa.
Joint efficiency can be measured by the percentage of bonded area [4]. The equation used to calculate the joint
efficiency is given as:
Joint efficiency =
From Fig 7, it shows that if the contact pressure is too low, the tensile strength and the bonding surface
is small too. In contrast, the more pressure increase, the more tensile strength increases, respectively. But if the
pressure is too high, the tensile strength will be decreased and the specimen will be deformed. The pressure
variables 0.4 MPa for tensile strength is very low 51.1 MPa because contact the surface of the sample is very
little to diffusion of atoms together is difficult. Increasing pressure is 0.9 MPa, the tensile strength was increased
to 101.5 MPa. Likewise, the pressure is 1.8 MPa while contributing to the higher tensile strength to value of
129.3 MPa this phenomenon as a result of right pressure. Recovery time is the compression of the grain in
compression at high or too low.
Fig: 7 Tensile properties of SSM 356 diffusion bonding
UTS of bonded specimen
UTS of SSM 356 specimen x 100

6. Diffusion Bonding of Semi-Solid (SSM 356) Cast Aluminum Alloy
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Increasing pressure is too high resulting in a decrease in tensile strength as a result of grain surface area
is compressed by the massive force stress at the interface lead to use of energy higher in the release of stress [4].
The high pressure causes the recovery longer described by variable pressure 2.4 and 2.7 MPa is 125.2 and 108.3
MPa respectively. In experiments, the pressure that directly affect the tensile strength and the deformation of the
sample after welding. The variable temperature and time it is also important could result in a change in
metallurgy. Therefore, the variables right is important for the diffusion bonding. Another reason for the high
strength specimen of the bonded as well due to the amount of void is interface zone has minimal.
3.3 Hardness Test
The microhardness distributions on the transverses cross-section of joints welded at all welding
condition the data is summarized in Fig.8 It is observed that the bond lines with a hardness higher than other
areas descriptive by bond line have Mg2Si phase, The influence of temperature resulting in particles together
and specimen by diffusion bonding through all regions were slightly decreased in comparison with the base
materials [10]. Base materials have average hardness in the range 67 HV but after the experimental specimen
average hardness increases is 93 HV which comes from the heat in due movement of the atoms from Mg2Si
phase. The average hardness is 35.48 percent. Heat during welding support to specimen with the hardness
increases. Finally, diffusion bonding processes help increase of the hardness of the specimen after welding.
Fig: 8 Microhardness results for diffusion bonding.
IV. CONCLUSION
In the present study SSM 356 aluminum alloys were joined by diffusion bonding under contact
pressure and holding time were investigated. Summarizing the mean features of the results, the following
conclusions may be drawn:
1. The highest joint strength reaches 129.8 MPa when the specimen is bonded at pressure 1.8 MPa, holding
time 3 hours. temperature 495o
C, under argon flow 4l/min.
2. Microstructure after welding is globular structure is the same as the original texture of the material but
the grain size to grow at a higher temperature.
3. Silicon particles in formed fracture of the increasing pressure and at the influence of heat is diffusion to
the bone line combined with magnesium form solid solution Mg2si
4. Solid solution Mg2si shaped plate is grown about 12 μm and a length of about 15-25 μm and shaped rods
is about 3 μm in length and about 10-40 μm.
Acknowledgements
This work was supported by the Higher Education Research Promotion and National Research
University Project of Thailand, Office of the Higher Education Commission. Researchers thank the Department
of Mining and Materials Engineering, Faculty of Engineering, Prince of Songkla University in Thailand.

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