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Revolutionizing System Memory Bandwidth
PROGRAMMABLE SOLUTIONS GROUP | Intel® ConfidentialProgrammable Solutions Group
WhatiSanfpga?
2
• An advanced, multi-function accelerator
• Flexible for highly differentiated products
• Reprogrammable as market dynamics or standards change
3
Need for Memory Bandwidth Is Critical
HPC
8K Video
Networking
RADAR
Financial
MemoryBandwidth
Evolution of Applications Over Time
Growing
Memory
Bandwidth
Gap
4
Need for Memory Bandwidth Is Critical
HPC
8K Video
Networking
RADAR
Financial
Example Applications Required Bandwidth
(GBytes/second)
Data Center 200
HPC, Custom Server 512 to 1000
HPC, Radar 400 to 1000
8K Video 172 to 432
Communications Tester 300 to 500
Body Scanner 300 to 500
“Far” Memory with Discrete DRAM
5
System-In PackageDiscrete
 Lower bandwidth
 Higher power
 Largest footprint
✓ Highest bandwidth
✓ Lowest power
✓ Smallest footprint
Meets the memory bandwidth needs
of next-generation applications
Cannot meet requirements of
next-generation applications
“Near” Memory with DRAM SiP
E M I B
E M I B
DRAM
DRAM
FPGA
Package
Meeting the Memory Bandwidth Challenge
Intel Stratix® 10 MX DRAM System-in-Package (SiP)
6
Integrates DRAM with Intel® Stratix® 10 FPGA
▪ Unified Intel® Quartus® software and OpenCLTM design environment
10x more bandwidth versus current discrete solutions
▪ Up to 512 GB/s of peak memory bandwidth
Widely applicable in HPC, military,
broadcast, and communications
First Intel® FPGA SiP products enabled by EMIB technology
Only FPGA shipping with 16GB HBM and 58G XCVRs
OpenCL and the OpenCL logo are trademarks of Apple Inc. used by permission by Khronos
Further Information
7
White Papers
Intel® Stratix® 10 MX Devices Solve the Memory Bandwidth Challenge
Enabling Next-Gen Platforms with 3D SiP
Achieving the Highest Levels of Integration
Industry’s First Heterogeneous SiP Devices with HBM2 DRAM
Getting Started Documentation
Intel Stratix 10 MX (DRAM System-in-Package) Device Overview
Available at www.intel.com/stratix10
9
LegalNotices&disclaimers
This document contains information on products, services and/or processes in development. All information provided here is subject to change without
notice. Contact your Intel representative to obtain the latest forecast, schedule, specifications and roadmaps.
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at
intel.com, or from the OEM or retailer. No computer system can be absolutely secure.
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual
performance. Consult other sources of information to evaluate performance as you consider your purchase. For more complete information about
performance and benchmark results, visit http://www.intel.com/performance.
Cost reduction scenarios described are intended as examples of how a given Intel-based product, in the specified circumstances and configurations, may
affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction.
Statements in this document that refer to Intel’s plans and expectations for the quarter, the year, and the future, are forward-looking statements that
involve a number of risks and uncertainties. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings,
including the annual report on Form 10-K.
The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications.
Current characterized errata are available on request.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
Intel does not control or audit third-party benchmark data or the web sites referenced in this document. You should visit the referenced web site and
confirm whether referenced data are accurate.
Intel, the Intel logo, Pentium, Celeron, Atom, Core, Xeon and others are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
© 2016 Intel Corporation.
10
Configurationdetails
Stratix 10 512 GB/s HBM2 DRAM bandwidth
Calculation based on Stratix 10 MX HBM2 interfaces multiplied by the maximum HBM2 DRAM bandwidth per interface. Stratix 10 MX supports a maximum of 2
HBM2 DRAM stacks, with each interface supporting 256 GB/s of DRAM bandwidth for a maximum peak memory bandwidth of 512 GB/s. Actual memory
bandwidth will vary based on memory controller efficiency determined by specific workload characteristics and memory usage patterns.

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High Memory Bandwidth Demo @ One Intel Station

  • 2. PROGRAMMABLE SOLUTIONS GROUP | Intel® ConfidentialProgrammable Solutions Group WhatiSanfpga? 2 • An advanced, multi-function accelerator • Flexible for highly differentiated products • Reprogrammable as market dynamics or standards change
  • 3. 3 Need for Memory Bandwidth Is Critical HPC 8K Video Networking RADAR Financial MemoryBandwidth Evolution of Applications Over Time Growing Memory Bandwidth Gap
  • 4. 4 Need for Memory Bandwidth Is Critical HPC 8K Video Networking RADAR Financial Example Applications Required Bandwidth (GBytes/second) Data Center 200 HPC, Custom Server 512 to 1000 HPC, Radar 400 to 1000 8K Video 172 to 432 Communications Tester 300 to 500 Body Scanner 300 to 500
  • 5. “Far” Memory with Discrete DRAM 5 System-In PackageDiscrete  Lower bandwidth  Higher power  Largest footprint ✓ Highest bandwidth ✓ Lowest power ✓ Smallest footprint Meets the memory bandwidth needs of next-generation applications Cannot meet requirements of next-generation applications “Near” Memory with DRAM SiP E M I B E M I B DRAM DRAM FPGA Package Meeting the Memory Bandwidth Challenge
  • 6. Intel Stratix® 10 MX DRAM System-in-Package (SiP) 6 Integrates DRAM with Intel® Stratix® 10 FPGA ▪ Unified Intel® Quartus® software and OpenCLTM design environment 10x more bandwidth versus current discrete solutions ▪ Up to 512 GB/s of peak memory bandwidth Widely applicable in HPC, military, broadcast, and communications First Intel® FPGA SiP products enabled by EMIB technology Only FPGA shipping with 16GB HBM and 58G XCVRs OpenCL and the OpenCL logo are trademarks of Apple Inc. used by permission by Khronos
  • 7. Further Information 7 White Papers Intel® Stratix® 10 MX Devices Solve the Memory Bandwidth Challenge Enabling Next-Gen Platforms with 3D SiP Achieving the Highest Levels of Integration Industry’s First Heterogeneous SiP Devices with HBM2 DRAM Getting Started Documentation Intel Stratix 10 MX (DRAM System-in-Package) Device Overview Available at www.intel.com/stratix10
  • 8.
  • 9. 9 LegalNotices&disclaimers This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest forecast, schedule, specifications and roadmaps. Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase. For more complete information about performance and benchmark results, visit http://www.intel.com/performance. Cost reduction scenarios described are intended as examples of how a given Intel-based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction. Statements in this document that refer to Intel’s plans and expectations for the quarter, the year, and the future, are forward-looking statements that involve a number of risks and uncertainties. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel does not control or audit third-party benchmark data or the web sites referenced in this document. You should visit the referenced web site and confirm whether referenced data are accurate. Intel, the Intel logo, Pentium, Celeron, Atom, Core, Xeon and others are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others. © 2016 Intel Corporation.
  • 10. 10 Configurationdetails Stratix 10 512 GB/s HBM2 DRAM bandwidth Calculation based on Stratix 10 MX HBM2 interfaces multiplied by the maximum HBM2 DRAM bandwidth per interface. Stratix 10 MX supports a maximum of 2 HBM2 DRAM stacks, with each interface supporting 256 GB/s of DRAM bandwidth for a maximum peak memory bandwidth of 512 GB/s. Actual memory bandwidth will vary based on memory controller efficiency determined by specific workload characteristics and memory usage patterns.