The TLP admission process is rigorous and aims to understand applicants comprehensively. It involves 4 main steps: 1) submission of the application form, 2) a tech aptitude test, 3) a personal interview, and 4) receiving the admission offer. Admissions are offered on a rolling basis over 3 rounds by the final deadline of April 24, 2022. Applicants are encouraged to complete each step sincerely and share all relevant information.