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E & G E C O E N G I N E E R I N G
DAOS:Scale-outSoftware-definedstorage
forHPC/BIGDATA/AIconvergence
Johann Lombardi, Principal Engineer
E & G E C O E N G I N E E R I N G 2
noticesanddisclaimersIntel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration.
No computer system can be absolutely secure.
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. For more complete information
about performance and benchmark results, visit http://www.intel.com/benchmarks .
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using
specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance
tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit
http://www.intel.com/benchmarks .
Intel® Advanced Vector Extensions (Intel® AVX)* provides higher throughput to certain processor operations. Due to varying processor power characteristics, utilizing AVX instructions may cause a)
some parts to operate at less than the rated frequency and b) some parts with Intel® Turbo Boost Technology 2.0 to not achieve any or maximum turbo frequencies. Performance varies depending on
hardware, software, and system configuration and you can learn more at http://www.intel.com/go/turbo.
Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3,
and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel.
Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel
microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.
Cost reduction scenarios described are intended as examples of how a given Intel-based product, in the specified circumstances and configurations, may affect future costs and provide cost
savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction.
Intel does not control or audit third-party benchmark data or the web sites referenced in this document. You should visit the referenced web site and confirm whether referenced data are accurate.
Intel, the Intel logo, Intel Optane and Intel Xeon are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as property of others.
© 2019 Intel Corporation.
E & G E C O E N G I N E E R I N G
DAOSArchitecture
I n t e l P r o p r i e t a r y
High-latency communications
P2P operations
No HW acceleration
Conventional Storage Systems
Linux Kernel I/OBlock Interface
Data & Metadata
Intel® 3D-NAND StorageIntel® 3D-XPoint Storage
HDD
Low-latency high-message-rate communications
Collective operations & in-storage computing
DAOS Storage Engine
Intel® 3D-XPoint Storage
SPDKNVMe Interface
Metadata, low-latency I/Os &
indexing/query
Bulk data
3D-NAND/XPoint Storage
HDD
PMDKMemory Interface
E & G E C O E N G I N E E R I N G
DAOSDeployments
I n t e l P r o p r i e t a r y
DAOS Nodes (DNs)
Intel® Xeon servers with DCPMM & NVMe SSDs
Gateway Nodes (GNs)
Intel® Xeon servers with no local storage
Capacity Tier
PFS, Cloud Object Store, …
UPI
Xeon
CPUPCIe
x16
PCIe
x4
Fabric
PCIe
x16
PCIe
x4
Xeon
CPU
NIC
NIC
Fabric
Fabric
Pooled Hyperconverged
E & G E C O E N G I N E E R I N G
DAOSTierAnatomy
I n t e l P r o p r i e t a r y
DAOS Tier
• Globally accessible from any compute nodes
• Large capacity (100’s PB)
DAOS Nodes
• COTS Intel® Xeon servers running the DAOS service
• RNIC attached for communications
• Support multiple RNICs per server to sustain
backend storage IOPS/bandwidth
• Mix of storage technologies attached
• Intel® Optane™ DC Persistent Memory (DCPMM)
• NVMe SSD (*NAND, Intel® Optane™ SSDs)
AI/Analytics/Simulation Workflow
DAOS library
File HDF5 TensorFlow…
DAOS
Service
Intel®QLC3DNandSSD
DAOS Nodes
Compute Nodes
E & G E C O E N G I N E E R I N G
NetworkSupport
I n t e l P r o p r i e t a r y
Performance-critical I/O path over libfabric
• Low-latency messaging
• End-to-end in userspace
• Native support for RDMA
• True zero-copy I/O
• Non-blocking
• Scalable collective communications
Out-of-band channel for administration
• Manage hardware, service & pools
• Telemetry & troubleshooting
• Secured with TLS & certificate
DAOS Storage Engine
Data Plane Control Plane
gRPC
TCP/IP
OFI / Libfabric
OPA RoCE SlingshotInfinibandSockets
AWS
EFA
E & G E C O E N G I N E E R I N G
Storagevirtualization&Multi-tenancy
I n t e l P r o p r i e t a r y
Distributed storage reservation
• Intel® Optane ™ DC Persistent Memory (DCPMM)
• NVMe SSD
Predicatable capacity
• Can be resized
• Can be extended to span more servers
Multi-tenancy
• NFSv4-type ACLs
Typically 1 pool = 1 project
• Can have a single pool or 100’s
Pool 1 (DCPMM + NVMe)
Pool 2 (DCPMM) Pool 3 (DCPMM+NVMe)
Storage Node
Target1 Target2 Target3 Target4
Storage Node Storage Node Storage Node
Target1 Target2 Target3 Target4 Target1 Target2 Target3 Target4
Target1 Target2 Target3 Target4
E & G E C O E N G I N E E R I N G
POSIXI/OSupport
I n t e l P r o p r i e t a r y
Application / Framework
DAOS library (libdaos)
DAOS File System (libdfs)
Interception Library
dfuse
Single process address space
DAOS Storage Engine
RPC RDMA
End-to-end userspace
No system calls
E & G E C O E N G I N E E R I N G
POSIXi/OLimitations
I n t e l P r o p r i e t a r y
val2
key1
val1
key2
key3
val3
@
@
@
AI/Analytics Application Dataset Serialized into a POSIX File
header size key1 size val1
val1 cont’d size key2 size
val2
val2 cont’d
val2 cont’d size key3 size val3
val3
Block 1
Block 2
Block 3
Block 4
Block 5
Block 6
Dataset Serialized into a POSIX File
Block 1
Block 2
Block 3
Block 4
POSIX
Serialization
HPC Application I/O Middleware
HDF5
SCR/VeloC
MPI-IO
Data Metadata
Block 1
Block 2
Block 3
Block 4
Block 5
Block 6
POSIX
Serialization
…
E & G E C O E N G I N E E R I N G
DAOSAPI
I n t e l P r o p r i e t a r y
key1
val1
key3
val3
@
@
Application
NVMe SSD
DAOS
key1
val1
root
@
key3
val3
@
val2
key2
@@
@
@
val2 con’d
val2
key2
@
Application
Native support for structured, semi-structured &
unstructured data models
• Built on top of DCPMM
• Unconstrained by POSIX serialization
• Data access time orders of magnitude faster (µs)
• Scalable concurrent updates & high IOPS
• Enable in-storage computing
DAOS Storage Engine
Open Source Apache 2.0 License
Data Model Library
Array KV Store Multi-level KV Store
E & G E C O E N G I N E E R I N G
ApplicationInterface
I n t e l P r o p r i e t a r y
Dataset
Mover
Capacity Tier
Lustre, S3, HSM, …
DAOS Storage Engine
Open Source Apache 2.0 License
POSIX I/O
HPC APPs
HDF5 MPI-IO VeloC
Apache
Spark
Apache
Arrow
(No)SQL
Analytics/AI APPs
TensorFlow
E & G E C O E N G I N E E R I N G
DAOS&Bigdata/AI
I n t e l P r o p r i e t a r y
DAOS
FileSystem
DAOS POSIX API
Java Wrapper
HDFS
Hadoop FileSystem Abstract Class
DAOS
Storage
DAOS Library, PMDK/SPDK used, Kernel bypass, zero copy
DAOS/Arrow
Wrapper
Apache Arrow Data Source
DAOS API
Wrapper
DAOS Native Data Source
Parquet, ORC, etc.
Scan/Parse
Project, Join, ML, etc.
Native Scan/Parse
(CSV, Parquet, ORC, etc.)
E & G E C O E N G I N E E R I N G
DAOS:Primarystorageforaurora
I n t e l P r o p r i e t a r y
"The Argonne Leadership Computing Facility will be the first major production deployment of the DAOS storage system
as part of Aurora, the first US exascale system coming in 2021. The DAOS storage system is designed to provide the levels
of metadata operation rates and bandwidth required for I/O extensive workloads on an exascale-level machine.”
Susan Coghlan, ALCF-X Project Director/Exascale Computing Systems Deputy Director
Aurora DAOS configuration
• Capacity: 230PB
• Bandwidth >25TB/s
E & G E C O E N G I N E E R I N G
DAOSCOMMUNITYROADMAP
I n t e l P r o p r i e t a r y
All information provided in this roadmap is subject to change without notice.
1Q19 2Q19 3Q19 4Q19 1Q20 2Q20 3Q20 4Q20 1Q21 2Q21 3Q21 4Q21 1Q22 2Q22 3Q22
Pre-1.0 releases & RCs 1.0 1.2 1.4 2.0 2.2 2.4
DAOS:
- NVMe & DCPMM support
- python/golang API bindings
- Per-pool ACL
- Lustre integration
I/O Middleware:
- MPI-IO Driver
- HDF5 DAOS Connector
- POSIX I/O support
- Spark
DAOS:
- End-to-end data integrity
- Per-container ACL
- Improved control plane
DAOS:
- Online server addition
- Advanced control plane
I/O Middleware:
- POSIX data mover
- Async HDF5 operations over DAOS
DAOS:
- Erasure code
- Telemetry & per-job statistics
- Multi OFI provider support
- Distributed transactions
I/O Middleware:
- Advanced POSIX I/O support
- Advanced data mover
Partner engagement & PoCs
DAOS:
- Progressive layout / GIGA+
- Placement optimizations
- Checksum scrubbing
I/O Middleware:
- Apache Arrow (not POR)
Exascale-readyPetascale
DAOS:
- Catastrophic recovery
tools
DAOS - Scale-Out Software-Defined Storage for HPC/Big Data/AI Convergence

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DAOS - Scale-Out Software-Defined Storage for HPC/Big Data/AI Convergence

  • 1. E & G E C O E N G I N E E R I N G DAOS:Scale-outSoftware-definedstorage forHPC/BIGDATA/AIconvergence Johann Lombardi, Principal Engineer
  • 2. E & G E C O E N G I N E E R I N G 2 noticesanddisclaimersIntel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. For more complete information about performance and benchmark results, visit http://www.intel.com/benchmarks . Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit http://www.intel.com/benchmarks . Intel® Advanced Vector Extensions (Intel® AVX)* provides higher throughput to certain processor operations. Due to varying processor power characteristics, utilizing AVX instructions may cause a) some parts to operate at less than the rated frequency and b) some parts with Intel® Turbo Boost Technology 2.0 to not achieve any or maximum turbo frequencies. Performance varies depending on hardware, software, and system configuration and you can learn more at http://www.intel.com/go/turbo. Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice. Cost reduction scenarios described are intended as examples of how a given Intel-based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction. Intel does not control or audit third-party benchmark data or the web sites referenced in this document. You should visit the referenced web site and confirm whether referenced data are accurate. Intel, the Intel logo, Intel Optane and Intel Xeon are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as property of others. © 2019 Intel Corporation.
  • 3. E & G E C O E N G I N E E R I N G DAOSArchitecture I n t e l P r o p r i e t a r y High-latency communications P2P operations No HW acceleration Conventional Storage Systems Linux Kernel I/OBlock Interface Data & Metadata Intel® 3D-NAND StorageIntel® 3D-XPoint Storage HDD Low-latency high-message-rate communications Collective operations & in-storage computing DAOS Storage Engine Intel® 3D-XPoint Storage SPDKNVMe Interface Metadata, low-latency I/Os & indexing/query Bulk data 3D-NAND/XPoint Storage HDD PMDKMemory Interface
  • 4. E & G E C O E N G I N E E R I N G DAOSDeployments I n t e l P r o p r i e t a r y DAOS Nodes (DNs) Intel® Xeon servers with DCPMM & NVMe SSDs Gateway Nodes (GNs) Intel® Xeon servers with no local storage Capacity Tier PFS, Cloud Object Store, … UPI Xeon CPUPCIe x16 PCIe x4 Fabric PCIe x16 PCIe x4 Xeon CPU NIC NIC Fabric Fabric Pooled Hyperconverged
  • 5. E & G E C O E N G I N E E R I N G DAOSTierAnatomy I n t e l P r o p r i e t a r y DAOS Tier • Globally accessible from any compute nodes • Large capacity (100’s PB) DAOS Nodes • COTS Intel® Xeon servers running the DAOS service • RNIC attached for communications • Support multiple RNICs per server to sustain backend storage IOPS/bandwidth • Mix of storage technologies attached • Intel® Optane™ DC Persistent Memory (DCPMM) • NVMe SSD (*NAND, Intel® Optane™ SSDs) AI/Analytics/Simulation Workflow DAOS library File HDF5 TensorFlow… DAOS Service Intel®QLC3DNandSSD DAOS Nodes Compute Nodes
  • 6. E & G E C O E N G I N E E R I N G NetworkSupport I n t e l P r o p r i e t a r y Performance-critical I/O path over libfabric • Low-latency messaging • End-to-end in userspace • Native support for RDMA • True zero-copy I/O • Non-blocking • Scalable collective communications Out-of-band channel for administration • Manage hardware, service & pools • Telemetry & troubleshooting • Secured with TLS & certificate DAOS Storage Engine Data Plane Control Plane gRPC TCP/IP OFI / Libfabric OPA RoCE SlingshotInfinibandSockets AWS EFA
  • 7. E & G E C O E N G I N E E R I N G Storagevirtualization&Multi-tenancy I n t e l P r o p r i e t a r y Distributed storage reservation • Intel® Optane ™ DC Persistent Memory (DCPMM) • NVMe SSD Predicatable capacity • Can be resized • Can be extended to span more servers Multi-tenancy • NFSv4-type ACLs Typically 1 pool = 1 project • Can have a single pool or 100’s Pool 1 (DCPMM + NVMe) Pool 2 (DCPMM) Pool 3 (DCPMM+NVMe) Storage Node Target1 Target2 Target3 Target4 Storage Node Storage Node Storage Node Target1 Target2 Target3 Target4 Target1 Target2 Target3 Target4 Target1 Target2 Target3 Target4
  • 8. E & G E C O E N G I N E E R I N G POSIXI/OSupport I n t e l P r o p r i e t a r y Application / Framework DAOS library (libdaos) DAOS File System (libdfs) Interception Library dfuse Single process address space DAOS Storage Engine RPC RDMA End-to-end userspace No system calls
  • 9. E & G E C O E N G I N E E R I N G POSIXi/OLimitations I n t e l P r o p r i e t a r y val2 key1 val1 key2 key3 val3 @ @ @ AI/Analytics Application Dataset Serialized into a POSIX File header size key1 size val1 val1 cont’d size key2 size val2 val2 cont’d val2 cont’d size key3 size val3 val3 Block 1 Block 2 Block 3 Block 4 Block 5 Block 6 Dataset Serialized into a POSIX File Block 1 Block 2 Block 3 Block 4 POSIX Serialization HPC Application I/O Middleware HDF5 SCR/VeloC MPI-IO Data Metadata Block 1 Block 2 Block 3 Block 4 Block 5 Block 6 POSIX Serialization …
  • 10. E & G E C O E N G I N E E R I N G DAOSAPI I n t e l P r o p r i e t a r y key1 val1 key3 val3 @ @ Application NVMe SSD DAOS key1 val1 root @ key3 val3 @ val2 key2 @@ @ @ val2 con’d val2 key2 @ Application Native support for structured, semi-structured & unstructured data models • Built on top of DCPMM • Unconstrained by POSIX serialization • Data access time orders of magnitude faster (µs) • Scalable concurrent updates & high IOPS • Enable in-storage computing DAOS Storage Engine Open Source Apache 2.0 License Data Model Library Array KV Store Multi-level KV Store
  • 11. E & G E C O E N G I N E E R I N G ApplicationInterface I n t e l P r o p r i e t a r y Dataset Mover Capacity Tier Lustre, S3, HSM, … DAOS Storage Engine Open Source Apache 2.0 License POSIX I/O HPC APPs HDF5 MPI-IO VeloC Apache Spark Apache Arrow (No)SQL Analytics/AI APPs TensorFlow
  • 12. E & G E C O E N G I N E E R I N G DAOS&Bigdata/AI I n t e l P r o p r i e t a r y DAOS FileSystem DAOS POSIX API Java Wrapper HDFS Hadoop FileSystem Abstract Class DAOS Storage DAOS Library, PMDK/SPDK used, Kernel bypass, zero copy DAOS/Arrow Wrapper Apache Arrow Data Source DAOS API Wrapper DAOS Native Data Source Parquet, ORC, etc. Scan/Parse Project, Join, ML, etc. Native Scan/Parse (CSV, Parquet, ORC, etc.)
  • 13. E & G E C O E N G I N E E R I N G DAOS:Primarystorageforaurora I n t e l P r o p r i e t a r y "The Argonne Leadership Computing Facility will be the first major production deployment of the DAOS storage system as part of Aurora, the first US exascale system coming in 2021. The DAOS storage system is designed to provide the levels of metadata operation rates and bandwidth required for I/O extensive workloads on an exascale-level machine.” Susan Coghlan, ALCF-X Project Director/Exascale Computing Systems Deputy Director Aurora DAOS configuration • Capacity: 230PB • Bandwidth >25TB/s
  • 14. E & G E C O E N G I N E E R I N G DAOSCOMMUNITYROADMAP I n t e l P r o p r i e t a r y All information provided in this roadmap is subject to change without notice. 1Q19 2Q19 3Q19 4Q19 1Q20 2Q20 3Q20 4Q20 1Q21 2Q21 3Q21 4Q21 1Q22 2Q22 3Q22 Pre-1.0 releases & RCs 1.0 1.2 1.4 2.0 2.2 2.4 DAOS: - NVMe & DCPMM support - python/golang API bindings - Per-pool ACL - Lustre integration I/O Middleware: - MPI-IO Driver - HDF5 DAOS Connector - POSIX I/O support - Spark DAOS: - End-to-end data integrity - Per-container ACL - Improved control plane DAOS: - Online server addition - Advanced control plane I/O Middleware: - POSIX data mover - Async HDF5 operations over DAOS DAOS: - Erasure code - Telemetry & per-job statistics - Multi OFI provider support - Distributed transactions I/O Middleware: - Advanced POSIX I/O support - Advanced data mover Partner engagement & PoCs DAOS: - Progressive layout / GIGA+ - Placement optimizations - Checksum scrubbing I/O Middleware: - Apache Arrow (not POR) Exascale-readyPetascale DAOS: - Catastrophic recovery tools