Este documento describe las actividades realizadas en una escuela para fomentar los valores cívicos de amistad, convivencia social y solidaridad entre los niños, padres y maestros. Se llevaron a cabo actividades como cuentos, leyendas y compartir alimentos para promover la convivencia social y la participación de toda la comunidad escolar. El documento concluye enfatizando la importancia de involucrar a la sociedad en actividades que ayuden a los niños a formar amistades y aprender valores cívicos dentro de su ent
Educación Cooperativa:adquisición del hábito, de la pericia y la pertinacia de pensar, ver, juzgar, actuar, proyectar y evaluar de acuerdo los principios cooperativos y su marco axiológico. Educar-Coop.
A short overview of our work at Casa Guatemala, a home and school for some of Guatemala's most at risk children. We provide an education, healthcare and nutritious meals to 250 children everyday.
Educación Cooperativa:adquisición del hábito, de la pericia y la pertinacia de pensar, ver, juzgar, actuar, proyectar y evaluar de acuerdo los principios cooperativos y su marco axiológico. Educar-Coop.
A short overview of our work at Casa Guatemala, a home and school for some of Guatemala's most at risk children. We provide an education, healthcare and nutritious meals to 250 children everyday.
Case film about the social advertising campaignsocreklama
Case film about the social advertising campaign, which included interactive quest "What would you do in this situation" - www.youtube.com/laskyquest
Created and produced by Social Advertising Laboratory
Client: FOCUS-MEDIA Foundation
A memory stack on logic 3D IC stack was considered for comparative study of warpage response to two different process choices, namely, Die to Die (D2D) and Package to Die (P2D) assembly. Process and reliability modeling software CielMech, and Commercial Finite Element Analysis (FEA) software ANSYS Mechanical were utilized to simulate thermo-mechanical effects of sequential chip attach, underfilling and encapsulation process steps for the chosen flows. Warpage at room temperature as well as attach temperature after each attach step were compared. Results indicated that underfill, substrate, and mold compound thermal strains play important roles in warpage evolution. Significant differences in the final assembled state warpage was predicted and is attributable to path dependence of warpage evolution.
Case film about the social advertising campaignsocreklama
Case film about the social advertising campaign, which included interactive quest "What would you do in this situation" - www.youtube.com/laskyquest
Created and produced by Social Advertising Laboratory
Client: FOCUS-MEDIA Foundation
A memory stack on logic 3D IC stack was considered for comparative study of warpage response to two different process choices, namely, Die to Die (D2D) and Package to Die (P2D) assembly. Process and reliability modeling software CielMech, and Commercial Finite Element Analysis (FEA) software ANSYS Mechanical were utilized to simulate thermo-mechanical effects of sequential chip attach, underfilling and encapsulation process steps for the chosen flows. Warpage at room temperature as well as attach temperature after each attach step were compared. Results indicated that underfill, substrate, and mold compound thermal strains play important roles in warpage evolution. Significant differences in the final assembled state warpage was predicted and is attributable to path dependence of warpage evolution.
The Industry has been using Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) for thermal and mechanical modeling of IC packages for many years. What was already practiced as an engineering-art within packaging organizations for monolithic IC packages has now become more complex due to the need for collaboration across organizational walls in the case of 3D stacking. The holistic solution needed for collaborative engineering of 3D stacking process calls for newer methodologies and information exchange protocols.
One particular necessity while building low power System on Chip (SOC) is the methodology needed to ensure package specific thermal feasibility of IC stacking options at physical layout stage of the 3D IC design. A methodology built on the technique to be presented will avert the unintended consequences of stacked IC hot spot alignment during system operation. The presentation will include a validation of the technique by comparison with traditional thermal modeling techniques.
The ability to fabricate such stacks using an evolving supply chain of foundry-OSAT combination is equally crucial to the viability and reliability of the packaged SOC. A process focused modeling tool for understanding the warpage, stress, and Chip Package Interaction (CPI) implications of assembly strategy choices is valuable for ensuring time to market at minimal technology development costs. The presentation will include modeling case studies with quantitative data of warpage and stress implications of process, material and stacking choices.
This presentation will introduce the tools and techniques for collaborative chip stack thermal and assembly process modeling with in-depth discussions on inputs needed, gaps in existing modeling methodologies and output metrics of engineering relevance.
Public cielution imaps_chip_to_system_codesignKamal Karimanal
Thermal management of electronics spans the spectrum of handheld devices with no air cooling to rack servers in data centers. Even though methodologies needed for design can be different for each class of electronics cooling problem, proactive engineering at early stage is a common mantra widely accepted in the thermal management community. This presentation will look into the technical and practical challenges associated with implementing a wholistic thermal design approach across a supply chain spanning different companies. With the above as a motivation, the talk will introduce simulation based methodologies for implementing a chip-to-system co-design methodology. Specific topics include abstraction methods pertinent to system, board, Package and Chip. The role of compact modeling, which is an effective tool for communication across domain expertise as well as organizational boundaries will also be discussed. Most importantly, the talk will address the needs of thermal engineers interested in implementing solutions at their organization as well as beneficiaries whose success is vested in cooler, faster and user friendly end products.
La sensibilización puede fomentarse gracias a la realización de una serie de actividades para concienciar a las personas sobre una determinada situación, en este caso a través del conocimiento impartido y aplicado en las comunidades.
Hoy someto mi nombre nuevamente a consideración de todos los maicaeros y maicaeras para ser Alcalde de Maicao, con la firme convicción que el esfuerzo realizado en estos últimos años, posibilitará con el apoyo de todos ustedes, hacer realidad un sueño. “Un municipio con mejores oportunidades, prospero y administrado con ética y de forma eficiente, centrando sus acciones, estrategias y políticas para impulsar un nuevo modelo de desarrollo local (pensar global, y actuar local), que nos permita elevar la calidad de vida de los maicaeros, mejorando nuestras condiciones económicas, con mejor distribución de las oportunidades y las riquezas, generando mayor y mejor empleo, priorizando en temas de salud y educación de niños jóvenes y adultos; mayor participación ciudadana, fortaleciendo la seguridad para todos y todas.” Por mil sueños y un millón de realidades de la gente noble y generosa de este Maicao que llevamos en el corazón, habré de conducir este municipio por caminos de eficiencia rumbo al centenario.
Practica consistente en la implementación de distintas actividades dirigidas a la población adolescente, buscando aumentar su participación, y transformando al departamento de salud en una organización cercana al grupo de jóvenes.
Esta edición N° 10 de "Familia Viator" comparte la práctica y experiencia educomunicacional del Centro San Viator desde el trabajo cotidiano que se realiza en Collique.
Memoria 2009 Paideia ONG - Asociación PaideiaPaideia Ong
Paideia ONG - Asociación Paideia
Asociación para la Integración del Menor PAIDEIA. ONG, sin ánimo de lucro. Especializada en Infancia,Juventud y Familias en situación de vulnerabilidad.
Fomentemos los valores civicos de amistad y convivencia social
1. FOMENTEMOS LOS VALORES CIVICOS DE
AMISTAD Y CONVIVENCIA SOCIAL
EL ZAPOTILLO, MUNICIPIO DE
CASIMIRO CASTILLO,
JALISCO
VALORES CIVICOS
2. LA FORMACION CIVICA
ES UNA TAREA MUY
IMPORTANTE PARA TODOS
LOS QUE ESTAMOS A
CARGO DEL QUE HACER
DOCENTE Y MAS QUE
NADA EL INICIAR EN LA
EDAD TEMPRANA QUE ES
EN LA ETAPA DE
PREESCOLAR
3. AL LLEVAR A CABO
CONVIVENCIA , ESTE PROYECTO SE
COMPAÑERISMO Y TRATA DE CONVIVIR
SOLIDARIDAD CON TODA LA
COMUNIDAD
ESCOLAR E
INVOLUCRARLOS EN
LAS ACTIVIDADES
CIVICAS DE
CONVIVENCIA ,
COMPAÑERISMO Y
SOLIDARIDAD
4. SE REALIZARON
ACTIVIDADES
DONDE LAS MAMAS
Y LOS NIÑOS
COMPARTIERON
EXPERIENCIAS POR
MEDIO DE
CONVIVENCIA CUENTTOS Y
SOCIAL LEYENDAS
5. REALIZAMOS
ACTIVIIDADES EN CONVIVENCIA EN
DONDE SE SOLIDARIDAD
INVOLUCRAN LOS
PADRES DE FAMILIA,
LOS NIÑOS Y LOS
DOCENTES CON EL
FIN DE LA
CONVIVENCIA,
COMPARTIENDO ASI
ALIMENTOS QUE LAS
MADRES DE FAMILIA
PRERARARON.
6. VALORES CIVICOS DE AMISTAD, Y DE
CONVIENCIA
ES IMPORTANTE QUE LOS NIÑOS CREZCAN CON
VALORES EN UN AMBIENTE DE ARMONIA, RESPETO Y
CONVIVENCIA, DONDE REALICEN ACTIVIDADES QUE
AYUDEN A SU FORMACION DENTRO DE LA
SOCIEDAD.
7. CONCLUSION
ES NECESARIO REALIZAR ACTIVIDADES, EN
DONDE SE INVOLUCRE LA SOCIEDAD, PARA
QUE LOS NIÑOS CONVIVAN CON SU ENTORNO
FORMANDO AMISTADES. TENIENDO EN
CUENTA LOS VALORES CÍVICOS PARA CREAR
CONCIENCIA Y RESPETO ASÍA NUESTRAS
TRADICIONES.